A capacitor module has a module case including a lower case and an upper case. A housing case is fixed to an inner face of the upper case, and a capacitor is housed in the housing case. A circuit board is fixed to an upper face of the lower case. The circuit board has wiring that is electrically connectable to the capacitor, and electronic components and constituting a circuit that controls electric current to the capacitor are mounted on the circuit board.

The present disclosure provides a solid electrolytic capacitor package structure for increasing electrical performances and a method of manufacturing the same, and a capacitor unit thereof. The capacitor unit includes at least one first capacitor, the at least one first capacitor includes a conductive polymer composite material layer. The conductive polymer composite material layer includes a conductive polymer material and a first nanometer material mixed with the conductive polymer material, and the first nanometer material includes a plurality of first fully embedded nanometer structures completely enclosed by the conductive polymer material and a plurality of first partially exposed nanometer structures partially exposed from the conductive polymer material.

The present disclosure provides a solid electrolytic capacitor package structure for increasing electrical performances and a method of manufacturing the same, and a capacitor unit thereof. The capacitor unit includes at least one first capacitor, the at least one first capacitor includes a conductive polymer composite material layer. The conductive polymer composite material layer includes a conductive polymer material and a first nanometer material mixed with the conductive polymer material, and the first nanometer material includes a plurality of first fully embedded nanometer structures completely enclosed by the conductive polymer material and a plurality of first partially exposed nanometer structures partially exposed from the conductive polymer material.

Provided is an improved capacitor formed by a process comprising: providing an anode comprising a dielectric thereon wherein the anode comprises a sintered powder wherein the powder has a powder charge of at least 45,000 μFV/g; and forming a first conductive polymer layer encasing at least a portion of the dielectric by applying a first slurry wherein the first slurry comprises a polyanion and a conductive polymer and wherein the polyanion and conductive polymer are in a weight ratio of greater than 3 wherein the conductive polymer and polyanion forms conductive particles with an average particle size of no more than 20 nm.

Provided is an improved capacitor formed by a process comprising: providing an anode comprising a dielectric thereon wherein the anode comprises a sintered powder wherein the powder has a powder charge of at least 45,000 μFV/g; and forming a first conductive polymer layer encasing at least a portion of the dielectric by applying a first slurry wherein the first slurry comprises a polyanion and a conductive polymer and wherein the polyanion and conductive polymer are in a weight ratio of greater than 3 wherein the conductive polymer and polyanion forms conductive particles with an average particle size of no more than 20 nm.

Disclosed are tantalum capacitors having enhanced volumetric efficiency, effective series resistance, effective series inductance, and high frequency performance when compared to existing tantalum capacitors. Also disclosed is a screening process for tantalum capacitors to enhance reliability.

A capacitor array that includes a solid electrolytic capacitor element including an anode plate made of a valve-action metal, a porous layer on at least one main surface of the anode plate, a dielectric layer on a surface of the porous layer, and a cathode layer including a solid electrolyte layer on a surface of the dielectric layer; a first anodic through-electrode electrically connected to the anode plate; a second anodic through-electrode electrically connected to the anode plate; and a first cathodic through-electrode electrically connected to the cathode layer, wherein a distance between the first cathodic through-electrode and the first anodic through-electrode is the same or substantially the same as a distance between the first cathodic through-electrode and the second anodic through-electrode in a plane view from a thickness direction of the anode plate.

A capacitor is described. A casing for the capacitor comprises a container having a face wall joined to a surrounding sidewall extending to a annular edge defining an open end of the container. An inwardly extending protrusion is located intermediate the face wall and the annular edge at the container open end. A partition plate is supported on the protrusion to thereby provide a first capacitor enclosure bounded by the face wall, the surrounding sidewall and the partition plate. A cover plate is secured to the annular edge to close the open end of the container and provide a second capacitor enclosure bounded by the partition plate, the surrounding sidewall and the cover plate. An anode, for example of tantalum, and a cathode active material, for example of ruthenium oxide, reside in capacitive association with each other inside each of the first and second capacitor enclosures. A working electrolyte is also contained in the capacitor enclosures. Finally, leads extend from each anode through insulative seals structures supported by the casing for making electrical connection to the capacitor.

An electronic component includes: a capacitor array including a plurality of tantalum capacitors arranged linearly; and a fixing member supporting a first surface and both side surfaces of the capacitor array so that the plurality of tantalum capacitors are not separated, wherein an area through which adjacent tantalum capacitors in the capacitor array are in contact with each other is 90% or more of an entire area of a corresponding surface of the adjacent tantalum capacitors.

An electronic component includes: a capacitor array including a plurality of tantalum capacitors arranged linearly; and a fixing member supporting a first surface and both side surfaces of the capacitor array so that the plurality of tantalum capacitors are not separated, wherein an area through which adjacent tantalum capacitors in the capacitor array are in contact with each other is 90% or more of an entire area of a corresponding surface of the adjacent tantalum capacitors.