The instant disclosure relates to a stacked-type solid electrolytic capacitor capable of increasing welding effect and a manufacturing method of the same. The stacked-type solid electrolytic capacitor includes a plurality of solid electrolytic capacitor units, each of which has an anode part and a cathode part connected to the anode part, characterized in that the anode part is formed with at least one buffering via-hole in a welding area thereof. When each of the anode parts is compressed in a welding process, the volume of the corresponding buffering via-hole decreases accordingly. Therefore, the soldering performance of the anode part solid electrolytic capacitor is enhanced and the connection stability is increased.

A solid electrolytic capacitor that includes a capacitor element having a linear through conductor made of a valve function metal, a dielectric layer disposed on the through conductor, and a cathode-side functional layer disposed on the dielectric layer. The through conductor includes a core portion and a porous portion covering a peripheral surface of the core portion. Both end faces of the core portion of the through conductor are in contact with a pair of anode terminals on the pair of end faces of the body, respectively. A cathode terminal is electrically connected to the cathode-side functional layer.

An energy storage apparatus provided with an energy storage device is provided with an electrode terminal disposed on the energy storage device, and a bus bar placed on a surface of the electrode terminal and connected to the electrode terminal. The bus bar includes a plurality of opening portions formed such that the surface of the electrode terminal is exposed.

An energy storage apparatus provided with an energy storage device is provided with an electrode terminal disposed on the energy storage device, and a bus bar placed on a surface of the electrode terminal and connected to the electrode terminal. The bus bar includes a plurality of opening portions formed such that the surface of the electrode terminal is exposed.

A solid electrolytic capacitor that includes a resin molding, a first external electrode, and a second external electrode. The resin molding includes a laminate of multiple capacitor elements, and a sealing resin sealing the laminate. The following are satisfied: t.sub.1<t.sub.2, t.sub.3<t.sub.4, t.sub.1<t.sub.3, and t.sub.4/t.sub.3<t.sub.2/t.sub.1, where t.sub.1 is the thickness of an inner portion of the cathode lead-out layer, the inner portion not being exposed at the second end surface; t.sub.2 is the thickness of an exposed portion of the cathode lead-out layer, the exposed portion being exposed at the second end surface; t.sub.3 is the thickness of an inner portion of the valve-action metal substrate, the inner portion not being exposed at the first end surface; and t.sub.4 is the thickness of an exposed portion of the valve-action metal substrate, the exposed portion being exposed at the first end surface.

A capacitor is provided that includes a capacitor stack including an anode layer, cathode layer, and electrolytic layer electrically coupled together, the capacitor stack including a capacitor stack periphery. The capacitor also includes a first cover portion having a first cover portion periphery that aligns with the capacitor stack periphery, and a second cover portion having a second cover portion periphery that aligns with the capacitor stack periphery and received the first cover portion periphery to form a shell body for encasing the capacitor stack therein. The capacitor stack is isolated from the second cover portion to provide a neutrally charged second cover portion that is electrically coupled within an implanted medical device.

This document provides an apparatus including a sintered electrode, a second electrode and a separator material arranged in a capacitive stack. A conductive interconnect couples the sintered electrode and the second electrode. Embodiments include a clip interconnect. In some embodiments, the interconnect includes a comb-shaped connector. In some embodiments, the interconnect includes a wire snaked between adjacent sintered substrates.

This document provides an apparatus including a sintered electrode, a second electrode and a separator material arranged in a capacitive stack. A conductive interconnect couples the sintered electrode and the second electrode. Embodiments include a clip interconnect. In some embodiments, the interconnect includes a comb-shaped connector. In some embodiments, the interconnect includes a wire snaked between adjacent sintered substrates.

An electronic component that includes an electronic component body including a first internal electrode exposed at a first end surface and a second internal electrode exposed at a second end surface; a first external electrode on the first end surface and a bottom surface of the electronic component body; and a second external electrode on the second end surface and the bottom surface of the electronic component body, wherein the first external electrode comprises a first end surface electrode and a first bottom surface electrode that are integrated, and a thickness of the first end surface electrode is smaller than a thickness of the first bottom surface electrode, and the second external electrode comprises a second end surface electrode and a second bottom surface electrode that are integrated, and a thickness of the second end surface electrode is smaller than a thickness of the second bottom surface electrode.

A solid electrolytic capacitor containing a capacitor element is provided. The capacitor element contains a sintered porous anode body, a dielectric that overlies the anode body, a solid electrolyte that overlies the dielectric, wherein the solid electrolyte includes a conductive polymer layer, and a moisture barrier that overlies the conductive polymer layer.