A contact device according to an embodiment includes: a fixed contact assembly including a first fixed contact and a second fixed contact; and a moving contact assembly including a first moving contact and a second moving contact. The moving contact assembly includes: a first moving member; and a second moving member. The second moving member is arranged, in a first direction, between the first moving member and the fixed contact assembly and fixed to the first moving member at one end in a second direction intersecting with the first direction. The first moving contact and the second moving contact move as the first moving member moves. A first distance from the one end in the second direction to the first moving contact is longer than a second distance from the one end in the second direction to the second moving contact.

A switch includes a housing and a metal terminal that is insert-molded into the housing. The metal terminal includes a contact portion provided on a first side of the metal terminal, an external connection portion provided on a second side of the metal terminal, and an embedded portion provided between the contact portion and the external connection portion and embedded in the housing. In the embedded portion, groove portions are formed in a front surface of the metal terminal and a rear surface of the metal terminal, the groove portions in the front surface being formed at positions different from the groove portions in the rear surface. The groove portions extend in a widthwise direction that is a direction intersecting an extending direction of the embedded portion.

An SMD-solderable component comprises a resistance element, a first contact element, and a second contact element, wherein the first contact element is connected with a first end section of the resistance element by means of a first soldered connection and the second contact element is connected with a second end section of the resistance element by means of a second soldered connection. At least one of the first soldered connection and the second soldered connection is a lead-free soldered connection that is made with a lead-free solder preform. Further disclosed is a method for producing an SMD-solderable component.

A switch mounting device comprises: a resin seat having an upper surface and a lower surface; a switch mounted on the upper surface of the seat; and terminal members fixed to the lower surface. The seat has claw parts on the lower surface thereof. The switch has a main body part, which is operated by pressing in the X direction, and connection terminals extending downward from this main body part. With connection terminals led out to the lower surface of the seat, the connection terminals are electrically connected to the terminal members. The terminal members are fixed to the seat by the claw parts by way of being slid along the lower surface of the seat.

A surface mount snap switch and method of making the same, including a housing having a plurality of channels formed therein and a cover configured for snap-fit engagement with the housing. The snap switch also includes an actuator slidably disposed at least partially within the housing, a first terminal having an external surface mount portion and another portion press-fittingly held within one of the plurality of channels of the housing, and a second terminal having an external surface mount portion and another portion press-fittingly held within another one of the plurality of channels of the housing. The snap switch further includes a blade contact having a first end portion pivotally associated with the first terminal and a second end portion comprising a blade contact button, and the actuator is configured to interact with the blade contact to electrically couple the first terminal and the second terminal.

A surface mount snap switch and method of making the same, including a housing having a plurality of channels formed therein and a cover configured for snap-fit engagement with the housing. The snap switch also includes an actuator slidably disposed at least partially within the housing, a first terminal having an external surface mount portion and another portion press-fittingly held within one of the plurality of channels of the housing, and a second terminal having an external surface mount portion and another portion press-fittingly held within another one of the plurality of channels of the housing. The snap switch further includes a blade contact having a first end portion pivotally associated with the first terminal and a second end portion comprising a blade contact button, and the actuator is configured to interact with the blade contact to electrically couple the first terminal and the second terminal.

An electronic device where molten solder does not come into contact with a sealant so as not to destroy a sealing function. An electronic device is provided with: an insulating base mounted on a printed circuit board; a common planar terminal provided so as to extend from an outer side surface to a bottom surface edge of the insulating base, and cause electrical continuity between the outer side surface and the bottom surface edge of the insulating base; a cover fitted to the insulating base and covering the common planar terminal; and a sealant sealing a gap between the outer side surface of the insulating base and an inner circumferential surface of the cover. A solder pool is formed in a position surrounded by the printed circuit board and the common planar terminal at the bottom surface edge of the insulating base.

An inline reed relay comprises at least one reed assembly, at least one pair of metal pins, a housing and a control pin disposed on the housing. The reed assembly comprises at least two reed switches, each having two pins. The metal pins are respectively connected to the two pins of the reed switches. One end of each metal pin extends out of the housing. The inline reed relay allows the reed switches to be integrated through the injection molded housing, and the reed switches are connected to an external circuit board via the metal pins, because the metal pins can be maintained a fixed shape and difficult to deform. The processing size and position tolerances of the inline reed relay can meet the requirements of mechanized automatic welding, thereby improving welding efficiency and production assembly efficiency and reducing labor costs.

A protective element includes: a rectangurarly shaped insulating substrate; a heat-generating element formed on the insulating substrate; first and second electrodes laminated on a surface of the insulating substrate; first and second connecting terminals provided on a back surface of the insulating substrate and being continuous with the first and second electrodes; a heat-generating element extracting electrode provided on a current path between the first and the second electrodes and electrically connected to the heat-generating element; and a meltable conductor laminated on a region extending from the heat-generating element extracting electrode to the first and second electrodes and to be melted by heat to interrupt the current path between the first electrode and the second electrodes; wherein at least one of the corner portions of the insulating substrate is chamfered.

The inventive assembly comprises a hyperfrequency component of the surface-mounted component type including at least one first hyperfrequency transmission line, as well as a printed circuit board including at least one second hyperfrequency transmission line able to be put in contact with the first hyperfrequency transmission line. The component comprises an enclosure with a face in contact with the printed circuit board, which includes at least one cavity for confining a hyperfrequency signal, delimited by conductive surfaces of the enclosure, and by a conductive zone of the second hyperfrequency transmission line.