A method of manufacturing an electric contact includes a welding step of welding a contact material (12) to a base material (11), and a crushing step of crushing the contact material (12), wherein one or more absorption holes (11a and 11b) that absorb deformation of the base material (11) in a thickness direction (Z direction) caused by the crushing of the contact material (12) are formed around the welding position of the contact material (12) on the base material (11).

An arc-ablation resistant tungsten alloy switch contact and preparation method is disclosed. A contact member has a three-layer structure, wherein a first layer is a hydrophobic rubber layer, a second layer is a sheet metal layer, and a third layer is a tungsten alloy chemical deposition layer. A plating bath adopted in the chemical deposition contains 25-125 g/L soluble tungsten compound, 0-60 g/L soluble compound of a transition metal like ferrum, nickel, cobalt, copper or manganese, and 0-30 g/L soluble compound of tin, stibium, lead or bismuth. When a layered complex of the hydrophobic rubber layer and the sheet metal layer is chemically plated by the plating bath, a tungsten alloy plated layer is selectively deposited on a metal surface, and chemical deposition of the tungsten alloy does not occur on a surface of the hydrophobic rubber fundamentally.

There is provided a silver-plated product which has good thermal resistance, bendability and wear resistance. In a silver-plated product wherein a surface layer of silver having a thickness of 10 m or less is formed on a base material of copper or a copper alloy, the full-width at half maximum of a rocking curve on a preferred orientation plane (preferably {200} or {111} plane) of the surface layer is caused to be 2 to 8, preferably 3 to 7, to improve the out-of-plane orientation of the surface layer to improve the thermal resistance, bendability and wear resistance of the silver-plated product.

Embodiments relate generally to systems and methods for preventing arcing within a snap action switch, particularly by removing a portion of a contact carrier attached to a stationary contact. A method of forming a contact for use in a snap action switch may comprise welding a contact onto a contact carrier; trimming at least one edge of the contact carrier proximate to the contact; and installing the contact carrier into a snap action switch housing. Trimming the at least one edge of the contact carrier may also comprise removing flash formed during the welding of the contact to the contact carrier.

The disclosure relates to an electrical switching contact, including a contact carrier and a contact plating, which has a contact material, and to a method for producing the electrical switching contact. The disclosure is characterized in that a layer that may be sintered is arranged between the contact material and the contact carrier in order to connect the contact material to the contact carrier.

A layered structure for forming charging terminals for high power applications. In some embodiments, the layered structure may include a substrate and a contact layer disposed over at least a portion of the substrate. The substrate may have a conductivity greater than 40% International Annealed Copper Standard (IACS). The contact layer may demonstrate a coefficient of friction of less than 1.4, such as from 0.1 to 1.4, as measured in accordance with American Society of Testing and Materials (ASTM) G99-17. The contact layer may include a precious-metal-based alloy, such as a silver-samarium alloy.

An arc-ablation resistant switch contact and a preparation method thereof is disclosed. The switch contact is a complex having a plurality of layers of layered structure, wherein a first layer is a hydrophobic rubber layer, a second layer is an adhesive layer, a third layer is a sheet metal layer, a fourth layer is an adhesive layer, and a fifth layer is a metal plated layer; wherein, the fifth layer of metal plated layer is formed by dipping a complex of the first layer, the second layer, the third layer and the fourth layer in a chemical plating bath containing refractory metal elements, and depositing on surfaces of the second layer, the third layer and the fourth layer in the complex by a chemical deposition method.

A contact pin for a high-voltage and/or medium-voltage switch includes a contact tip of arc-erosion resistant material, a tubular support sleeve connected to the contact tip and a support core in the sleeve. The contact tip is in a forward region of the contact pin where arcs arise during use. The sleeve is in a rearward region of the contact pin, adjoining the forward region, where no arcs arise during use. A pipe contact includes an arc-erosion resistant annular contact and a support pipe connected to the annular contact. The annular contact is in a forward region of the pipe contact where arcs arise during use, and the support pipe is in a rearward region of the pipe contact, adjoining the forward region, where no arcs arise during use. Methods for producing a contact pin and a pipe contact are also provided.

The invention relates to a method for producing at least one functional region on an electrical contact element such as, for example, a switching contact or a plug type contact. In order to prevent the high environmental burden which is disadvantageous in wet-chemical methods and to overcome the restriction to a very small number of materials caused in hot dip methods in physical technical terms, and to substantially improve the spatial possibility for selection and structuring which is insufficient in both techniques, there is provision according to the invention for at least one material coating to be applied mechanically in a highly selective manner to the contact element in the functional region and subsequently highly energetic thermal radiation such as, for example, a particle beam in the form of an ion and/or electron beam, to be directed onto the at least on material coating.

The invention relates to a method for producing at least one functional region (1) on an electrical contact element (30) such as, for example, a switching contact or a plug type contact. The at least one functional region (1), for example, a contact location or a connection region for crimping or soldering connections is limited to a partial area of the contact element. In order to prevent the high environmental burden which is disadvantageous in wet-chemical methods and to overcome the restriction to a very small number of materials caused in hot dip methods in physical technical terms, and to substantially improve the spatial possibility for selection and structuring which is insufficient in both techniques, there is provision according to the invention for at least one material coating (4) to be applied mechanically in a highly selective manner to the contact element in the functional region (1) and subsequently highly energetic thermal radiation (9) such as, for example, a particle beam in the form of an ion and/or electron beam, to be directed onto the at least one material coating (4). The material coating (4) can contain new materials or material combinations which cannot be provided by previous methods. The invention further relates to a device for producing such a functional region and a contact element having such a functional region (1), the contact element (30) being produced in accordance with the above method.