A contact slide unit for a switch unit, where the contact slide unit includes a contact slide with a switching piece displaceably guided therein, and method for mounting the contact slide unit, where the displaceable switching piece is protected on the contact slide against twisting via a separately formed anti-twist stop.

A keypad with a contact element in a form of a contact pill for intermittent contacting of printed circuit board (PCB) contacts on a PCB, where the contact element includes a plurality of irregularly shaped electrically conductive particles, and where the contact element is connected to the keypad or to an element of the keypad.

A keypad with a contact element in a form of a contact pill for intermittent contacting of printed circuit board (PCB) contacts on a PCB, where the contact element includes a plurality of irregularly shaped electrically conductive particles, and where the contact element is connected to the keypad or to an element of the keypad.

A fusible conductive material can be used to electrically connect or join power distribution bus bars that are placed on opposing sides of an electrically insulating bus support. The fusible conductive material can be placed in an opening or hole in the bus support with the bus bars abutting the fusible conductive material on opposing sides. The fusible conductive material can then be ignited, such as by applying a voltage drop, to produce a localized heat source suitable to electrically join the bus bars together. By electrically connecting the bus bars in this manner, the bus bars can better conduct, be less susceptible to separation and require less maintenance with respect to connectivity.

An arc-ablation resistant tungsten alloy switch contact and preparation method is disclosed. A contact member has a three-layer structure, wherein a first layer is a hydrophobic rubber layer, a second layer is a sheet metal layer, and a third layer is a tungsten alloy chemical deposition layer. A plating bath adopted in the chemical deposition contains 25-125 g/L soluble tungsten compound, 0-60 g/L soluble compound of a transition metal like ferrum, nickel, cobalt, copper or manganese, and 0-30 g/L soluble compound of tin, stibium, lead or bismuth. When a layered complex of the hydrophobic rubber layer and the sheet metal layer is chemically plated by the plating bath, a tungsten alloy plated layer is selectively deposited on a metal surface, and chemical deposition of the tungsten alloy does not occur on a surface of the hydrophobic rubber fundamentally.

An arc-ablation resistant tungsten alloy switch contact and preparation method is disclosed. A contact member has a three-layer structure, wherein a first layer is a hydrophobic rubber layer, a second layer is a sheet metal layer, and a third layer is a tungsten alloy chemical deposition layer. A plating bath adopted in the chemical deposition contains 25-125 g/L soluble tungsten compound, 0-60 g/L soluble compound of a transition metal like ferrum, nickel, cobalt, copper or manganese, and 0-30 g/L soluble compound of tin, stibium, lead or bismuth. When a layered complex of the hydrophobic rubber layer and the sheet metal layer is chemically plated by the plating bath, a tungsten alloy plated layer is selectively deposited on a metal surface, and chemical deposition of the tungsten alloy does not occur on a surface of the hydrophobic rubber fundamentally.

The switch case includes a metal plate having a first surface and a second surface that is at a side opposite to the first surface, and a resin case embedding a part of the metal plate. The resin case includes a housing portion having an opening formed on a surface of the resin case. The metal plate includes a terminal portion, a contact portion, and an intermediate portion positioned between the terminal portion and the contact portion. The terminal portion is exposed from the surface of the resin case, and the intermediate portion is embedded in the resin case. The intermediate portion is provided with at least one through-hole penetrating the first surface and the second surface. The contact portion includes a part of the first surface exposed to the housing portion of the resin case. In the at least one through-hole, the hole diameter of the at least one through-hole at the second surface is larger than the hole diameter of the at least one through-hole at the first surface.

Embodiments relate generally to systems and methods for preventing arcing within a snap action switch, particularly by removing a portion of a contact carrier attached to a stationary contact. A method of forming a contact for use in a snap action switch may comprise welding a contact onto a contact carrier; trimming at least one edge of the contact carrier proximate to the contact; and installing the contact carrier into a snap action switch housing. Trimming the at least one edge of the contact carrier may also comprise removing flash formed during the welding of the contact to the contact carrier.

Embodiments relate generally to systems and methods for preventing arcing within a snap action switch, particularly by removing a portion of a contact carrier attached to a stationary contact. A method of forming a contact for use in a snap action switch may comprise welding a contact onto a contact carrier; trimming at least one edge of the contact carrier proximate to the contact; and installing the contact carrier into a snap action switch housing. Trimming the at least one edge of the contact carrier may also comprise removing flash formed during the welding of the contact to the contact carrier.

The disclosure relates to an electrical switching contact, including a contact carrier and a contact plating, which has a contact material, and to a method for producing the electrical switching contact. The disclosure is characterized in that a layer that may be sintered is arranged between the contact material and the contact carrier in order to connect the contact material to the contact carrier.