Electrical fuse (eFuse) and resistor structures and methods of manufacture are provided. The method includes forming metal gates having a capping material on a top surface thereof. The method further includes protecting the metal gates and the capping material during an etching process which forms a recess in a dielectric material. The method further includes forming an insulator material and metal material within the recess. The method further includes forming a contact in direct electrical contact with the metal material.

A flexible printed circuit board according to an aspect of the present invention includes a base film having insulating properties and a conductive pattern laminated to one surface side of the base film. The conductive pattern forms part of a circuit and includes at least one fuse portion having a cross section smaller than the other part. The flexible printed circuit board includes at least one opening passing through front and rear surfaces on at least one of the right and left sides of the fuse portion in a two-dimensional view.

A mandrel structure is provided over a dielectric using a patterning process. The mandrel structure includes a first mandrel, a second mandrel and a third mandrel in a parallel arrangement. The second mandrel is located between the first and third mandrels and has a cut larger than a minimum ground rule feature. A sidewall layer is formed over the mandrel structure. The sidewall layer has two long parallel gaps for two contact lines and a third gap for a fuse element. The third gap is orthogonal to and connects the two long parallel gaps. The mandrel structure is removed. The sidewall pattern is used to etch the dielectric to form a trench structure comprising two parallel contact line trenches having a width at least as great as a ground rule of the patterning process for the contact lines and a connecting, orthogonal fuse element trench having a width less than the ground rule for the fuse element. The trenches are filled with conductive material to form the contact lines and a fuse element. The contact lines function as an anode and a cathode in the e-Fuse.

The invention relates to a protection device (1) for an electrical distribution system (3) of an aircraft electrical network, said device (1) including a substrate (11) comprising a plurality of electrically conductive elements (13), said electrically conductive elements (13) being connected pairwise by a fuse element (15), and a coating material (17) that is arranged over the substrate (11) and each fuse element (15). The invention also relates to an electrical distribution system (3) of an aircraft electrical network comprising an electrical circuit (5) to which one or more protection devices (1) are attached, said one or more protection devices (1) being electrically connected to the electrical circuit (5).

Electrical fuse (eFuse) and resistor structures and methods of manufacture are provided. The method includes forming metal gates having a capping material on a top surface thereof. The method further includes protecting the metal gates and the capping material during an etching process which forms a recess in a dielectric material. The method further includes forming an insulator material and metal material within the recess. The method further includes forming a contact in direct electrical contact with the metal material.

A novel temperature-triggered fuse device is configured to be activated at a designer-specified ambient temperature by utilizing wetting force among a pair of wetting material bays and a solder bridge or a solder ball. The solder bridge or the solder ball is typically positioned on top of the pair of wetting material bays separated by an electrically-insulated gap. Preferably, the wetting material bays are at least partly made of gold, nickel, or other elements suitable for generating an increased wetting force to the solder bridge or the solder ball upon increases in ambient temperature. The novel temperature-triggered fuse device can be integrated into various types of integrated circuits (IC's), or can function as a discrete fuse connected to one or more electronic components for robust protection from power surges and/or thermal runaway-related device malfunctions, meltdowns, or explosions. Various methods of producing the temperature-triggered fuse device are also disclosed herein.

A fuse production method includes the steps of forming a liquid film of a dispersion liquid, in which metal nanoparticles are dispersed in a solvent, on a principal surface of a substrate containing at least an organic substance, heating the liquid film so as to vaporize the solvent to melt or sinter the metal nanoparticles and to soften or melt the principal surface, and forming a fuse film on the principal surface by fusing the melted or sintered metal nanoparticles and the softened or melted principal surface with each other.

Structures of and methods for fabricating fine-scale interconnects and fuses are disclosed. A mushroom-type structure with a narrow stalk supporting a wider cap can be used for fine-scale interconnects with widths on the scale of hundreds of nanometers that have low resistivity. Micro-air bridges can be introduced by omitting the stalk in sections of the interconnect, allowing the interconnect to bridge over obstacles. The mushroom-type micro-air bridge structure can also be modified to create fine-scale fuses that have low resistivity overall and sections of significantly higher resistivity where the micro-air bridges exist. The significantly higher resistivity results in preferential fusing at the micro-air bridges. Both mushroom interconnects and mushroom fuses can be fabricated using electron beam lithography.

Electrical fuse (eFuse) and resistor structures and methods of manufacture are provided. The method includes forming metal gates having a capping material on a top surface thereof. The method further includes protecting the metal gates and the capping material during an etching process which forms a recess in a dielectric material. The method further includes forming an insulator material and metal material within the recess. The method further includes forming a contact in direct electrical contact with the metal material.

Electrical fuse (eFuse) and resistor structures and methods of manufacture are provided. The method includes forming metal gates having a capping material on a top surface thereof. The method further includes protecting the metal gates and the capping material during an etching process which forms a recess in a dielectric material. The method further includes forming an insulator material and metal material within the recess. The method further includes forming a contact in direct electrical contact with the metal material.