A battery pack includes: a first switch connected between a first end of a battery and a first output terminal; a second switch including a first terminal and a second terminal which are connected to a second end of the battery, and a third terminal and a fourth terminal which are connected to a second output terminal, wherein the first terminal and the third terminal are electrically connected when the second switch is turned off, and the second terminal and the fourth terminal are electrically connected when the second switch is turned on; a pre-charge resistor connected between the third terminal of the second switch and the second output terminal; and a controller configured to control the second switch such that the second switch is turned on if a precharging period of time elapses after the first switch is turned on.

A battery pack includes: a first switch connected between a first end of a battery and a first output terminal; a second switch including a first terminal and a second terminal which are connected to a second end of the battery, and a third terminal and a fourth terminal which are connected to a second output terminal, wherein the first terminal and the third terminal are electrically connected when the second switch is turned off, and the second terminal and the fourth terminal are electrically connected when the second switch is turned on; a pre-charge resistor connected between the third terminal of the second switch and the second output terminal; and a controller configured to control the second switch such that the second switch is turned on if a precharging period of time elapses after the first switch is turned on.

Approaches herein provided surface mounted devices each configured as a stand-alone component suitable for attachment to a substrate such as a printed circuit board (PCB). In some embodiments, a method includes forming a base housing, coupling an electronic component to the base housing, and forming a cover over the electronic component, wherein the cover is coupled to the base housing. The electronic component may include a fusible link/element extending between terminals, the terminals wrapped around an exterior of base housing. The device may then be coupled to the PCB, for example, by attaching the terminals to an upper surface of the PCB.

Approaches herein provided surface mounted devices each configured as a stand-alone component suitable for attachment to a substrate such as a printed circuit board (PCB). In some embodiments, a method includes forming a base housing, coupling an electronic component to the base housing, and forming a cover over the electronic component, wherein the cover is coupled to the base housing. The electronic component may include a fusible link/element extending between terminals, the terminals wrapped around an exterior of base housing. The device may then be coupled to the PCB, for example, by attaching the terminals to an upper surface of the PCB.

A device for dissipating a surge includes at least three metal oxide varistors (MOVs). Each of the MOVs may be positioned adjacent to each other. Each of the MOVs may have two contact surfaces. Contact surfaces of adjacent MOVs are electrically connected together. The at least three MOVs include a first outer MOV, a second outer MOV, and at least one inner MOV positioned between the first outer MOV and the second outer MOV. The first outer MOV and the second outer MOV have a greater voltage at a given current than at least one of the at least one inner MOV. The device further includes a first connector electrically coupled to at least one of the at least three MOVs. The device further includes a second connector electrically coupled to at least another of the at least three MOVs.

A device for dissipating a surge includes at least three metal oxide varistors (MOVs). Each of the MOVs may be positioned adjacent to each other. Each of the MOVs may have two contact surfaces. Contact surfaces of adjacent MOVs are electrically connected together. The at least three MOVs include a first outer MOV, a second outer MOV, and at least one inner MOV positioned between the first outer MOV and the second outer MOV. The first outer MOV and the second outer MOV have a greater voltage at a given current than at least one of the at least one inner MOV. The device further includes a first connector electrically coupled to at least one of the at least three MOVs. The device further includes a second connector electrically coupled to at least another of the at least three MOVs.

A recyclable fuse includes a first contact and a second contact, and a current control unit allowing current to flow by electrically connecting the first contact and the second contact with each other when a temperature of the current control unit is less than a predetermined first temperature and preventing the current from flowing by electrically interrupting the first contact and the second contact from each other when the temperature of the current control unit is equal to or more than the predetermined first temperature.

A recyclable fuse includes a first contact and a second contact, and a current control unit allowing current to flow by electrically connecting the first contact and the second contact with each other when a temperature of the current control unit is less than a predetermined first temperature and preventing the current from flowing by electrically interrupting the first contact and the second contact from each other when the temperature of the current control unit is equal to or more than the predetermined first temperature.

A surge protective device (SPD) module includes a module housing, first and second module electrical terminals mounted on the module housing, an overvoltage clamping element electrically connected between the first and second module electrical terminals, and a thermal disconnector mechanism. The thermal disconnector mechanism is positioned in a ready configuration, wherein the overvoltage clamping element is electrically connected with the second module electrical terminal. The thermal disconnector mechanism is repositionable to electrically disconnect the overvoltage clamping element from the second module electrical terminal. The thermal disconnector mechanism includes: an electrode electrically connected to the overvoltage clamping element; a disconnect spring elastically deflected and electrically connected to the electrode in the ready configuration; a solder securing the disconnect spring in electrical connection with the electrode in the ready configuration; and a heat sink member thermally interposed between the electrode and the solder, the heat sink member having a thermal capacity. The solder is meltable in response to overheating of the overvoltage clamping element. The disconnect spring is configured to electrically disconnect the overvoltage clamping element from the second module electrical terminal when the solder is melted. The thermal capacity of the heat sink member buffers and dissipates heat from the overvoltage clamping element to prevent the solder from melting in response to at least some surge currents through the SPD module.

A surge protective device (SPD) module includes a module housing, first and second module electrical terminals mounted on the module housing, an overvoltage clamping element electrically connected between the first and second module electrical terminals, and a thermal disconnector mechanism. The thermal disconnector mechanism is positioned in a ready configuration, wherein the overvoltage clamping element is electrically connected with the second module electrical terminal. The thermal disconnector mechanism is repositionable to electrically disconnect the overvoltage clamping element from the second module electrical terminal. The thermal disconnector mechanism includes: an electrode electrically connected to the overvoltage clamping element; a disconnect spring elastically deflected and electrically connected to the electrode in the ready configuration; a solder securing the disconnect spring in electrical connection with the electrode in the ready configuration; and a heat sink member thermally interposed between the electrode and the solder, the heat sink member having a thermal capacity. The solder is meltable in response to overheating of the overvoltage clamping element. The disconnect spring is configured to electrically disconnect the overvoltage clamping element from the second module electrical terminal when the solder is melted. The thermal capacity of the heat sink member buffers and dissipates heat from the overvoltage clamping element to prevent the solder from melting in response to at least some surge currents through the SPD module.