Approaches herein provided surface mounted devices each configured as a stand-alone component suitable for attachment to a substrate such as a printed circuit board (PCB). In some embodiments, a method includes forming a base housing, coupling an electronic component to the base housing, and forming a cover over the electronic component, wherein the cover is coupled to the base housing. The electronic component may include a fusible link/element extending between terminals, the terminals wrapped around an exterior of base housing. The device may then be coupled to the PCB, for example, by attaching the terminals to an upper surface of the PCB.

Approaches herein provided surface mounted devices each configured as a stand-alone component suitable for attachment to a substrate such as a printed circuit board (PCB). In some embodiments, a method includes forming a base housing, coupling an electronic component to the base housing, and forming a cover over the electronic component, wherein the cover is coupled to the base housing. The electronic component may include a fusible link/element extending between terminals, the terminals wrapped around an exterior of base housing. The device may then be coupled to the PCB, for example, by attaching the terminals to an upper surface of the PCB.

An overvoltage protection device having a printed circuit board, varistor, and gas discharge tube, the varistor and discharge tube connected in series between a first and second electrical terminal of the circuit board via conductive tracks, wherein: the varistor is connected to the first terminal by a first track, the discharge tube is connected to the varistor by a second track, the discharge tube is connected to the second terminal by a third track, and wherein the second and third tracks have curved portions situated on either side of the discharge tube, having a concavity facing in the same orientation respective to the discharge tube and a thermofusible area able to separate the corresponding track into two parts in response to an overcurrent, the distance between the two parts of each track allowing generation of an arc in response to an overvoltage that activates the discharge tube.

An overvoltage protection device having a printed circuit board, varistor, and gas discharge tube, the varistor and discharge tube connected in series between a first and second electrical terminal of the circuit board via conductive tracks, wherein: the varistor is connected to the first terminal by a first track, the discharge tube is connected to the varistor by a second track, the discharge tube is connected to the second terminal by a third track, and wherein the second and third tracks have curved portions situated on either side of the discharge tube, having a concavity facing in the same orientation respective to the discharge tube and a thermofusible area able to separate the corresponding track into two parts in response to an overcurrent, the distance between the two parts of each track allowing generation of an arc in response to an overvoltage that activates the discharge tube.

A block fuse including a body and a plurality of fuses coupled to the body is described herein. The block fuse also includes a plurality of electrical connectors extending from the body in a first direction and electrically coupled to the plurality of fuses, and at least one block fuse removal tab extending from the body in a second direction, opposite to the first direction.

A block fuse including a body and a plurality of fuses coupled to the body is described herein. The block fuse also includes a plurality of electrical connectors extending from the body in a first direction and electrically coupled to the plurality of fuses, and at least one block fuse removal tab extending from the body in a second direction, opposite to the first direction.

A power source device that includes a first battery; a second battery; a power supply line that supplies power to a plurality of loads; a power source line that connects the first battery and the power supply line; a first fuse that is connected between the power source line and the power supply line; a fuse portion whose current capacity is made smaller or larger than a current capacity of the first fuse depending on whether a potential of the power source line is higher or lower than a reference potential; and a first switch that is connected between the second battery and the fuse portion, and is connected to the power supply line via the fuse portion.

A power source device that includes a first battery; a second battery; a power supply line that supplies power to a plurality of loads; a power source line that connects the first battery and the power supply line; a first fuse that is connected between the power source line and the power supply line; a fuse portion whose current capacity is made smaller or larger than a current capacity of the first fuse depending on whether a potential of the power source line is higher or lower than a reference potential; and a first switch that is connected between the second battery and the fuse portion, and is connected to the power supply line via the fuse portion.

A surge protective device (SPD) module includes a module housing, first and second module electrical terminals mounted on the module housing, an overvoltage clamping element electrically connected between the first and second module electrical terminals, and a thermal disconnector mechanism. The thermal disconnector mechanism is positioned in a ready configuration, wherein the overvoltage clamping element is electrically connected with the second module electrical terminal. The thermal disconnector mechanism is repositionable to electrically disconnect the overvoltage clamping element from the second module electrical terminal. The thermal disconnector mechanism includes: an electrode electrically connected to the overvoltage clamping element; a disconnect spring elastically deflected and electrically connected to the electrode in the ready configuration; a solder securing the disconnect spring in electrical connection with the electrode in the ready configuration; and a heat sink member thermally interposed between the electrode and the solder, the heat sink member having a thermal capacity. The solder is meltable in response to overheating of the overvoltage clamping element. The disconnect spring is configured to electrically disconnect the overvoltage clamping element from the second module electrical terminal when the solder is melted. The thermal capacity of the heat sink member buffers and dissipates heat from the overvoltage clamping element to prevent the solder from melting in response to at least some surge currents through the SPD module.

A surge protective device (SPD) module includes a module housing, first and second module electrical terminals mounted on the module housing, an overvoltage clamping element electrically connected between the first and second module electrical terminals, and a thermal disconnector mechanism. The thermal disconnector mechanism is positioned in a ready configuration, wherein the overvoltage clamping element is electrically connected with the second module electrical terminal. The thermal disconnector mechanism is repositionable to electrically disconnect the overvoltage clamping element from the second module electrical terminal. The thermal disconnector mechanism includes: an electrode electrically connected to the overvoltage clamping element; a disconnect spring elastically deflected and electrically connected to the electrode in the ready configuration; a solder securing the disconnect spring in electrical connection with the electrode in the ready configuration; and a heat sink member thermally interposed between the electrode and the solder, the heat sink member having a thermal capacity. The solder is meltable in response to overheating of the overvoltage clamping element. The disconnect spring is configured to electrically disconnect the overvoltage clamping element from the second module electrical terminal when the solder is melted. The thermal capacity of the heat sink member buffers and dissipates heat from the overvoltage clamping element to prevent the solder from melting in response to at least some surge currents through the SPD module.