A molded filler pad for encapsulating a fuse element can include one or more collection channels and one or more molded walls. The collection channels can guide conductive particulates from the fuse element along interior walls of a fuse body housing the fuse element to control any venting of the conductive particulates. The molded walls can press against the interior walls of the fuse body to control where the conductive particulars redeposit and prevent the same from redepositing in a connected path. The collection channels and the molded walls can be molded into a single device for filling the fuse body and be formed from a material that can remain undamaged and physically intact even when exposed to pressure and heat from an electrical arc of the fuse device that is produced as the fuse element opens to interrupt a circuit.