Provided is an electrical junction box for use in a vehicle that includes: a fit-in housing in which a plurality of fuses are fitted from one side; and a plurality of fuse terminals that connect the fuses fitted in the fit-in housing to a substrate, the electrical junction box comprising a holding body that is plate-shaped, is arranged so as to be opposed to an opposite surface of the fit-in housing that is opposite to the one side, and holds one-end portions of the fuse terminals that are close to the fit-in housing. The remaining portions of the fuse terminals other than the one-end portions are not held and are released.

A power supply apparatus includes a battery pack for an electric vehicle, and an interface unit that couples the battery pack and a plurality of electrical devices. The interface unit includes a branch connector provided with a coupling unit and a plurality of fuses. The coupling unit allows coupling wires to join. Each of the coupling wires is coupled to a corresponding one of electrical devices. Each of the plurality of fuses is disposed in a corresponding one of coupling wires. The interface unit also includes a battery pack connector that is able to be coupled to the branch connector. In a state in which the branch connector is coupled to the battery pack connector, the power supply apparatus is configured to be able to supply electric power from the battery pack to each of the plurality of electrical devices via the coupling unit.

A plug-in connector cooperating with a terminal block includes a body having a cooperation assembly mechanically securing the plug-in connector on the terminal block, the body having a compartment accommodating a fuse element, a pair of plug contacts received within the compartment, and a handle part having an actuating portion and a linking portion. The plug contacts are each connected to a terminal of the fuse element. Each of the plug contacts has a contact tongue extending outside of the compartment, the contact tongue electrically secured to a bus bar of the terminal block. The linking portion is attached to the body and extends along a linking axis parallel to an insertion axis of a pin of the cooperation assembly. The actuating portion has an actuating surface extending transversely to the insertion axis and cooperating with a marking element disposed along the actuating surface.

A method of making printed circuit board vias using a double drilling and plating method is disclosed. A first hole is drilled in a core, the first hole having a first diameter. The first hole is filled and/or plated with an electrically conductive material. A circuit pattern may be formed on one or two conductive layers of the core. A multilayer structure may then be formed including a plurality of cores that also include pre-drilled and plated via holes, wherein at least some of the pre-drilled and plated via holes are aligned with the first hole. A second hole is then drilled within the first hole and the aligned pre-drilled and plated holes, the second hole having a second diameter where the second diameter is smaller than the first diameter. A conductive material is then plated to an inner surface of the second hole.

A method of making printed circuit board vias using a double drilling and plating method is disclosed. A first hole is drilled in a core, the first hole having a first diameter. The first hole is filled and/or plated with an electrically conductive material. A circuit pattern may be formed on one or two conductive layers of the core. A multilayer structure may then be formed including a plurality of cores that also include pre-drilled and plated via holes, wherein at least some of the pre-drilled and plated via holes are aligned with the first hole. A second hole is then drilled within the first hole and the aligned pre-drilled and plated holes, the second hole having a second diameter where the second diameter is smaller than the first diameter. A conductive material is then plated to an inner surface of the second hole.

A method of making printed circuit board vias using a double drilling and plating method is disclosed. A first hole is drilled in a core, the first hole having a first diameter. The first hole is filled and/or plated with an electrically conductive material. A circuit pattern may be formed on one or two conductive layers of the core. A multilayer structure may then be formed including a plurality of cores that also include pre-drilled and plated via holes, wherein at least some of the pre-drilled and plated via holes are aligned with the first hole. A second hole is then drilled within the first hole and the aligned pre-drilled and plated holes, the second hole having a second diameter where the second diameter is smaller than the first diameter. A conductive material is then plated to an inner surface of the second hole.

A method of making printed circuit board vias using a double drilling and plating method is disclosed. A first hole is drilled in a core, the first hole having a first diameter. The first hole is filled and/or plated with an electrically conductive material. A circuit pattern may be formed on one or two conductive layers of the core. A multilayer structure may then be formed including a plurality of cores that also include pre-drilled and plated via holes, wherein at least some of the pre-drilled and plated via holes are aligned with the first hole. A second hole is then drilled within the first hole and the aligned pre-drilled and plated holes, the second hole having a second diameter where the second diameter is smaller than the first diameter. A conductive material is then plated to an inner surface of the second hole.

A method of making printed circuit board vias using a double drilling and plating method is disclosed. A first hole is drilled in a core, the first hole having a first diameter. The first hole is filled and/or plated with an electrically conductive material. A circuit pattern may be formed on one or two conductive layers of the core. A multilayer structure may then be formed including a plurality of cores that also include pre-drilled and plated via holes, wherein at least some of the pre-drilled and plated via holes are aligned with the first hole. A second hole is then drilled within the first hole and the aligned pre-drilled and plated holes, the second hole having a second diameter where the second diameter is smaller than the first diameter. A conductive material is then plated to an inner surface of the second hole.

A method of making printed circuit board vias using a double drilling and plating method is disclosed. A first hole is drilled in a core, the first hole having a first diameter. The first hole is filled and/or plated with an electrically conductive material. A circuit pattern may be formed on one or two conductive layers of the core. A multilayer structure may then be formed including a plurality of cores that also include pre-drilled and plated via holes, wherein at least some of the pre-drilled and plated via holes are aligned with the first hole. A second hole is then drilled within the first hole and the aligned pre-drilled and plated holes, the second hole having a second diameter where the second diameter is smaller than the first diameter. A conductive material is then plated to an inner surface of the second hole.

An electrical connection box includes a fusible link including a pair of terminal portions, a plate-shaped conductive member, a first nut including a first flange portion and fastened to the conductive member by being screwed with a first screw member, a second nut including a second flange portion and fastened to the conductive member by being screwed with a second screw member, and a block that includes a holding portion holding the first flange portion and the second flange portion and holds the fusible link. The holding portion extends between the pair of terminal portions in a projecting direction of the terminal portions, and includes a first holding portion located on a back side in an insertion direction, a second holding portion located on an entrance side in the insertion direction, and a projecting portion allowing entry of the first flange portion and restricting entry of the second flange portion.