An ionizing device is described, comprising a tubular bulb made of electrically insulating or dielectric material extending along a longitudinal reference axis and having the two longitudinal open ends and opposite each other, a tubular cathode engaged in the bulb, a tubular anode fitted to the bulb, a pair of covers, each of which has a respective internal seat into which a respective end of the bulb is inserted so as to hermetically seal it, and a conductive electrode which extends into the bulb and is electrically connected to the cathode.

An ionizing device is described, comprising a tubular bulb made of electrically insulating or dielectric material extending along a longitudinal reference axis and having the two longitudinal open ends and opposite each other, a tubular cathode engaged in the bulb, a tubular anode fitted to the bulb, a pair of covers, each of which has a respective internal seat into which a respective end of the bulb is inserted so as to hermetically seal it, and a conductive electrode which extends into the bulb and is electrically connected to the cathode.

A cathode head can include: a first electron emitter filament having a first size; a first grid pair defining walls of a first filament slot having the first filament therein, each grid member of the first grid pair being electronically coupled to different voltage sources; a second electron emitter filament; and a second grid pair defining walls of a second filament slot having the first electron emitter therein, each grid member of the second grid pair being electronically coupled to different voltage sources. The first grid pair can have a first and second grid members; and the second grid pair can have the second grid member and a third grid member. The first grid member and third grid member are electronically coupled to the same voltage source and the second grid member being electronically coupled to a different voltage source.

A cathode head can include: a first electron emitter filament having a first size; a first grid pair defining walls of a first filament slot having the first filament therein, each grid member of the first grid pair being electronically coupled to different voltage sources; a second electron emitter filament; and a second grid pair defining walls of a second filament slot having the first electron emitter therein, each grid member of the second grid pair being electronically coupled to different voltage sources. The first grid pair can have a first and second grid members; and the second grid pair can have the second grid member and a third grid member. The first grid member and third grid member are electronically coupled to the same voltage source and the second grid member being electronically coupled to a different voltage source.

The present disclosure relates to methods of fabricating electronic devices or components thereof. The electronic devices can be vacuum electronic devices. The methods can include disposing a first material on or in a substrate. The methods can further include removing a portion of the first material to form one or more structure protruding from the substrate. The methods can further include disposing a second material onto the one or more structure of the first material, and then removing a portion of the second material to form one or more sidewall structures. A second portion of the one or more structures of the first material can also be removed to form a fabricated structure including the substrate and one or more sidewall structures protruding therefrom.

The present disclosure relates to methods of fabricating electronic devices or components thereof. The electronic devices can be vacuum electronic devices. The methods can include disposing a first material on or in a substrate. The methods can further include removing a portion of the first material to form one or more structure protruding from the substrate. The methods can further include disposing a second material onto the one or more structure of the first material, and then removing a portion of the second material to form one or more sidewall structures. A second portion of the one or more structures of the first material can also be removed to form a fabricated structure including the substrate and one or more sidewall structures protruding therefrom.

According to one embodiment, an X-ray tube includes an outer envelope that maintains a vacuum inside, an anode target provided inside the envelope and generating X-rays by collision of thermal electrons, and a cathode electron gun provided inside the envelope and emitting thermal electrons toward the anode target, and the X-ray tube includes an envelope assembly including a metal-made cylindrical support fixing portion and constituting the envelope, and an anode assembly including a metal-made support holding the cathode electron gun, and the support of the cathode assembly is fixed to an inner circumferential side thereof by welding.

According to one embodiment, an X-ray tube includes an outer envelope that maintains a vacuum inside, an anode target provided inside the envelope and generating X-rays by collision of thermal electrons, and a cathode electron gun provided inside the envelope and emitting thermal electrons toward the anode target, and the X-ray tube includes an envelope assembly including a metal-made cylindrical support fixing portion and constituting the envelope, and an anode assembly including a metal-made support holding the cathode electron gun, and the support of the cathode assembly is fixed to an inner circumferential side thereof by welding.

An on-chip miniature X-ray source, comprising: an on-chip miniature electron source (10); a first insulating spacer (11) located on one side of the on-chip miniature electron source (10) emitting electrons, the first insulating spacer (11) being of a cavity structure; and an anode (12) located on the first insulating spacer (11), a closed vacuum cavity being formed between the on-chip miniature electron source (10) and the anode (12). The on-chip miniature electron source can be obtained by means of a micromachining technique, further reducing the size thereof, and reducing the manufacturing costs. The on-chip miniature X-ray source has the advantages of stable X-ray dose, low operation vacuum requirement, fast switch response, integrated and mass processing, etc. and can be used in various types of small and portable X-ray detection, analysis and treatment devices.

An on-chip miniature X-ray source, comprising: an on-chip miniature electron source (10); a first insulating spacer (11) located on one side of the on-chip miniature electron source (10) emitting electrons, the first insulating spacer (11) being of a cavity structure; and an anode (12) located on the first insulating spacer (11), a closed vacuum cavity being formed between the on-chip miniature electron source (10) and the anode (12). The on-chip miniature electron source can be obtained by means of a micromachining technique, further reducing the size thereof, and reducing the manufacturing costs. The on-chip miniature X-ray source has the advantages of stable X-ray dose, low operation vacuum requirement, fast switch response, integrated and mass processing, etc. and can be used in various types of small and portable X-ray detection, analysis and treatment devices.