A method of providing a stable connector used in a deposition apparatus is presented. The method may include forming a dome-shaped electrode connector inside of a ceramic material, drilling out a part of the ceramic material along with a portion of the dome-shaped electrode connector to flatten the electrode connector, and bonding a rod into a remaining part of the electrode connector. The method would provide a stable electrode connector which could hold the entire length of the rod which is bonded onto it. The length of the flattened electrode connector could be 5 mm.

Disclosed are an electrostatic chuck capable of preventing deformation of a bonding layer and damage to a lift pin, a method of manufacturing the electrostatic chuck, and a plasma processing apparatus. The electrostatic chuck configured to support a substrate and to receive a lift pin so that the lift pin is ascendable and descendable therein includes at least one pin hole formed vertically therethrough to allow the lift pin to ascend and descend along the pin hole, a ceramic puck configured to allow the substrate to be seated thereon, a base plate configured to support the ceramic puck, a bonding layer configured to bond the ceramic puck to the base plate, and an insulating pipe mounted on an inner side wall of the pin hole. The insulating pipe includes an upper insulating pipe bonded to the ceramic puck and a lower insulating pipe adhered to the base plate.

Disclosed are an electrostatic chuck capable of preventing deformation of a bonding layer and damage to a lift pin, a method of manufacturing the electrostatic chuck, and a plasma processing apparatus. The electrostatic chuck configured to support a substrate and to receive a lift pin so that the lift pin is ascendable and descendable therein includes at least one pin hole formed vertically therethrough to allow the lift pin to ascend and descend along the pin hole, a ceramic puck configured to allow the substrate to be seated thereon, a base plate configured to support the ceramic puck, a bonding layer configured to bond the ceramic puck to the base plate, and an insulating pipe mounted on an inner side wall of the pin hole. The insulating pipe includes an upper insulating pipe bonded to the ceramic puck and a lower insulating pipe adhered to the base plate.

A technique reduces scratches on the back surface of a substrate held on an electrostatic chuck. An electrostatic chuck for holding a substrate includes a dielectric member, and an electrode in the dielectric member. The dielectric member includes an upper surface, and a plurality of projections projecting upward from the upper surface. The plurality of projections support a substrate. Each of the plurality of projections includes a crystalline base and an amorphous surface layer on the crystalline base.

A technique reduces scratches on the back surface of a substrate held on an electrostatic chuck. An electrostatic chuck for holding a substrate includes a dielectric member, and an electrode in the dielectric member. The dielectric member includes an upper surface, and a plurality of projections projecting upward from the upper surface. The plurality of projections support a substrate. Each of the plurality of projections includes a crystalline base and an amorphous surface layer on the crystalline base.

A method of providing a stable connector used in a deposition apparatus is presented. The method may comprise forming a dome-shaped electrode connector inside of a ceramic material, drilling out a part of the ceramic material along with a portion of the dome-shaped electrode connector to flatten the electrode connector; and bonding a rod into a remaining part of the electrode connector. The method would provide a stable electrode connector which could hold the entire length of the rod which is bonded onto it. The length of the flattened electrode connector could be 5 mm.

A method of providing a stable connector used in a deposition apparatus is presented. The method may comprise forming a dome-shaped electrode connector inside of a ceramic material, drilling out a part of the ceramic material along with a portion of the dome-shaped electrode connector to flatten the electrode connector; and bonding a rod into a remaining part of the electrode connector. The method would provide a stable electrode connector which could hold the entire length of the rod which is bonded onto it. The length of the flattened electrode connector could be 5 mm.

A channel structure includes a base and a channel. The base has a first opening on a first surface. The channel is located inside the base and is connected to the first opening. The base has a plurality of grooves on the first surface. The plurality of grooves include a plurality of first grooves and a plurality of second grooves. The plurality of first grooves extend along a first direction. The plurality of second grooves extend along a second direction intersecting the first direction.

A channel structure includes a base and a channel. The base has a first opening on a first surface. The channel is located inside the base and is connected to the first opening. The base has a plurality of grooves on the first surface. The plurality of grooves include a plurality of first grooves and a plurality of second grooves. The plurality of first grooves extend along a first direction. The plurality of second grooves extend along a second direction intersecting the first direction.

A ceramic joined body includes: a pair of ceramic plates; an electrode layer that is interposed between the pair of ceramic plates; and a joining layer that is disposed in a periphery of the electrode layer between the pair of ceramic plates, in which at least one of the pair of ceramic plates and the joining layer is formed of a composite of an insulating material and a conductive material, a gap is provided between an outer edge of the electrode layer and an inner edge of the joining layer, and a content ratio of the conductive material in the at least one of the pair of ceramic plates and the joining layer is 3% by mass or more and 12% by mass or less.