The purpose is to make it possible to autonomously suppress a reduction in an electron beam without providing a means for supervising the electron beam intensity of a monitor or the like. An electron gun, provided with: a heater (12) in which one terminal serves as a heater terminal (H) and the other terminal serves as a shared terminal (HK), and in which a low-voltage power supply (21) is connected between the terminals, the heater (12) generating heat due to a current being supplied from the low-voltage power supply (21); and a cathode electrode (11) connected to the shared terminal (HK) and heated by the heater (12) to discharge thermal electrons. A cathode current (Ik) due to the thermal electrons discharged from the cathode electrode (11), and a current (Ih) due to the low-voltage power supply, flow in opposite directions through the heater (12).

The purpose is to make it possible to autonomously suppress a reduction in an electron beam without providing a means for supervising the electron beam intensity of a monitor or the like. An electron gun, provided with: a heater (12) in which one terminal serves as a heater terminal (H) and the other terminal serves as a shared terminal (HK), and in which a low-voltage power supply (21) is connected between the terminals, the heater (12) generating heat due to a current being supplied from the low-voltage power supply (21); and a cathode electrode (11) connected to the shared terminal (HK) and heated by the heater (12) to discharge thermal electrons. A cathode current (Ik) due to the thermal electrons discharged from the cathode electrode (11), and a current (Ih) due to the low-voltage power supply, flow in opposite directions through the heater (12).

Vacuum electron devices (VEDs) having a plurality of two-dimensional layers of various materials are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together into a sandwich-like structure. The manufacturing process enables incorporation of metallic, magnetic, ceramic materials, and other materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability.

Vacuum electron devices (VEDs) having a plurality of two-dimensional layers of various materials are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together into a sandwich-like structure. The manufacturing process enables incorporation of metallic, magnetic, ceramic materials, and other materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability.

Vacuum electron devices (VEDs) are produced having a plurality of two-dimensional layers of various materials that are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together using brazing, diffusion bonding, assisted diffusion bonding, solid state bonding, cold welding, ultrasonic welding, and the like. The manufacturing process enables incorporation of metallic, magnetic, and ceramic materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability. The VEDs so produced include a combination of magnetic and electrostatic lenses for electron beam control.

Vacuum electron devices (VEDs) are produced having a plurality of two-dimensional layers of various materials that are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together using brazing, diffusion bonding, assisted diffusion bonding, solid state bonding, cold welding, ultrasonic welding, and the like. The manufacturing process enables incorporation of metallic, magnetic, and ceramic materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability. The VEDs so produced include a combination of magnetic and electrostatic lenses for electron beam control.

Embodiments include a vacuum device, comprising: an enclosure configured to enclose a vacuum, comprising an external base forming at least a portion of the enclosure; an internal base within the enclosure; and at least one thermal dissipative strap assembly, comprising: an internal base thermal conductive base in contact with the internal base, an external base thermal conductive base in contact with the external base, and a flexible thermal dissipative strap coupling the internal base thermal conductive base to the external base thermal conductive base.

Embodiments include a vacuum device, comprising: an enclosure configured to enclose a vacuum, comprising an external base forming at least a portion of the enclosure; an internal base within the enclosure; and at least one thermal dissipative strap assembly, comprising: an internal base thermal conductive base in contact with the internal base, an external base thermal conductive base in contact with the external base, and a flexible thermal dissipative strap coupling the internal base thermal conductive base to the external base thermal conductive base.

Embodiments include a vacuum device, comprising: an enclosure configured to enclose a vacuum, the enclosure including an external base including an opening; an internal base within the enclosure; and an adjustable support assembly adjustably coupling the internal base to the external base and extending through the opening, the adjustable support assembly comprising: a threaded shaft extending along a longitudinal axis and coupled to the internal base; a threaded hole component threadedly engaged with the threaded shaft and coupled to the external base such that the threaded hole component is axially constrained in a direction along the longitudinal axis relative to the external base independent of the threaded shaft; and a flexible component coupled to the external base and the threaded shaft and sealing the opening.

The present invention generally relates to systems and methods for generating controllable beam of electrons using a hollow-cathode triode electron gun that substantially mitigate impact of back-streaming electrons. In one embodiment, a triode hollow-cathode electron gun is configured to provide electrons and substantially mitigates the impact of back-streaming electrons. The triode hollow-cathode electron gun includes a hollow cathode, a heating filament, an anode, a control grid, a shadow grid and a sleeve mechanically coupled to the hollow-cathode. The sleeve is substantially centered on the axis of the triode hollow-cathode electron gun and configured to maintain shape and trajectory of emitted beams of electrons.