Metallic ion source for resolving the issue of not being able to produce high-density ions efficiently with small-scale ion sources in situations where an electron beam injecting scheme is employed as the evaporation source to evaporate a solid, and for producing high-density ions highly efficiently. Designed to be compact and lightweight, the metallic ion source also facilitates selection of the ion extraction direction. The ion source, structured exploiting the characteristic physical property that whether ionization takes place is dependent on the energy of the electron beam, is furnished with a dual evaporation-plasma chamber that inside the same chamber enables a high-speed electron beam, whose ionization efficiency is low, and low-speed electrons generated by electric discharge, whose ionization efficiency is high, to participate independently and simultaneously in, respectively, evaporation of precursor and ionization action.

To provide an ion gun of a penning discharge type capable of narrowing a beam with a low ion beam current at a low acceleration voltage, an ion milling device including the same, and an ion milling method. An ion milling device that controls half width of a beam profile of an ion beam with which a sample is irradiated from an ion gun to be in a range of 200 m to 350 m. The device includes: the ion gun that ionizes a gas supplied from the outside, and emits an ion beam; a gas-flow-rate varying unit that varies a flow rate of the gas supplied to the ion gun; and a current measurement unit that measures a current value of the ion beam emitted from the ion gun. The gas-flow-rate varying unit sets a gas flow rate to be higher than a gas flow rate at which the ion beam current has a maximum value based on the current value measured by the current measurement unit and the flow rate of the gas determined by the gas-flow-rate varying unit.

To provide an ion gun of a penning discharge type capable of narrowing a beam with a low ion beam current at a low acceleration voltage, an ion milling device including the same, and an ion milling method. An ion milling device that controls half width of a beam profile of an ion beam with which a sample is irradiated from an ion gun to be in a range of 200 m to 350 m. The device includes: the ion gun that ionizes a gas supplied from the outside, and emits an ion beam; a gas-flow-rate varying unit that varies a flow rate of the gas supplied to the ion gun; and a current measurement unit that measures a current value of the ion beam emitted from the ion gun. The gas-flow-rate varying unit sets a gas flow rate to be higher than a gas flow rate at which the ion beam current has a maximum value based on the current value measured by the current measurement unit and the flow rate of the gas determined by the gas-flow-rate varying unit.

To provide an ion gun of a penning discharge type capable of achieving a milling rate which is remarkably higher than that in the related art, an ion milling device including the same, and an ion milling method. An ion generation unit includes a cathode that emits electrons, an anode that is provided within the ion generation unit and has an inner diameter of 5.2 mm or less, and magnetic-field generation means using a permanent magnet of which a maximum energy product ranges from 110 kJ/m.sup.3 to 191 kJ/m.sup.3.

To provide an ion gun of a penning discharge type capable of achieving a milling rate which is remarkably higher than that in the related art, an ion milling device including the same, and an ion milling method. An ion generation unit includes a cathode that emits electrons, an anode that is provided within the ion generation unit and has an inner diameter of 5.2 mm or less, and magnetic-field generation means using a permanent magnet of which a maximum energy product ranges from 110 kJ/m.sup.3 to 191 kJ/m.sup.3.

An object of the present invention is to provide an ion milling apparatus capable of processing deposits attached to an ion gun and an ion milling method capable of processing deposits attached to an ion gun. The ion milling apparatus includes gas injection means for injecting a gas toward the ion gun, and the gas injection means included in the ion milling apparatus moves the deposits attached to the ion gun by injecting the gas toward the inside of the ion gun.

An object of the present invention is to provide an ion milling apparatus capable of processing deposits attached to an ion gun and an ion milling method capable of processing deposits attached to an ion gun. The ion milling apparatus includes gas injection means for injecting a gas toward the ion gun, and the gas injection means included in the ion milling apparatus moves the deposits attached to the ion gun by injecting the gas toward the inside of the ion gun.

An ion pump has an exterior magnet and a chamber wall defining an interior. The interior contains an anode having an exterior surface extending around an axis and defining an opening wherein the axis passes through the opening and a post made of ferrous material, aligned with the axis of the anode and positioned between the exterior magnet and the anode.

A system has a linear accelerator, ion pump and a compensating magnet. The ion pump includes an ion pump magnet position, an ion pump magnet shape, an ion pump magnet orientation, and an ion pump magnet magnetic field profile. The compensating magnet has a position, a shape, an orientation, and a magnetic field profile, where at least one of the position, shape, orientation, and magnetic field profile of the compensating magnet reduce at least one component of a magnetic field in the linear accelerator resulting from the ion pump magnet.

An object of the present invention is to provide an ion milling apparatus capable of processing deposits attached to an ion gun and an ion milling method capable of processing deposits attached to an ion gun. The ion milling apparatus includes gas injection means for injecting a gas toward the ion gun, and the gas injection means included in the ion milling apparatus moves the deposits attached to the ion gun by injecting the gas toward the inside of the ion gun.