Methods, systems, and devices for electron beam probing techniques and related structures are described to enable inline testing of memory device structures. Conductive loops may be formed, some of which may be grounded and others of which may be electrically floating in accordance with a predetermined pattern. The loops may be scanned with an electron beam and image analysis techniques may be used to generate an optical pattern. The generated optical pattern may be compared to an expected optical pattern, which may be based on the predetermined pattern of grounded and floating loops. An electrical defect may be determined based on any difference between the generated optical pattern and the expected optical pattern. For example, if a second loop appears as having a brightness corresponding to a grounded loop, this may indicate that an unintended short exists. Fabrication techniques may be adjusted for subsequent devices to correct identified defects.

A multiple-charged particle-beam irradiation apparatus includes a shaping aperture array substrate that causes a charged particle beam to pass through a plurality of first apertures to form multi-beams, a plurality of blanking aperture array substrates each provided with a plurality of second apertures, which enable corresponding beams to pass, and including a blanker arranged at each of the second apertures, a movable table on which the blanking aperture array substrates are mounted so as to be spaced apart from each other in a second direction, which is orthogonal to a first direction along an optical axis, and that moves in the second direction to position one of the blanking aperture array substrates on the optical axis, and an alignment mechanism that performs an alignment adjustment between the blanking aperture array substrate on the optical axis and the shaping aperture array substrate.

A blanking aperture array unit according to the present embodiment includes a chip configured to control a charged particle beam by blanking control of switching whether to irradiate a target with the charged particle beam; a substrate having the chip mounted thereon; a wire configured to electrically connect pads on the chip to the substrate and transmit a control signal for the blanking control from the substrate to the chip through the pads; and a conductive covering member having a first end connected to the substrate and a second end located on the chip, the covering member being provided from the first end to the second end to cover the wire while maintaining electrical insulation from the wire, and at least two end sides of the second end of the covering member are nearer a central portion of the chip than locations of the pads on the chip.

An electron beam inspection apparatus includes a plurality of electrodes to surround an inspection substrate placed on a stage, a camera to measure, for each of the plurality of electrodes, a gap between a peripheral edge of the inspection substrate and an electrode of the plurality of electrodes, a retarding potential application circuit to apply a retarding potential to the inspection substrate, an electrode potential application circuit to apply, to each electrode, a corresponding potential of potentials each obtained by adding an offset potential, which is variable according to a measured gap, to the retarding potential to be applied to the inspection substrate, and an electron optical system to irradiate the inspection substrate with electron beams, in the state where the retarding potential has been applied to the inspection substrate and the corresponding potential of the potentials has been individually applied to each of the plurality of electrodes.

A multi-charged particle beam writing apparatus includes a movable stage to mount a substrate thereon, a shot data generation circuit to generate shot data of each shot of multiple charged particle beams, a shift amount calculation circuit to calculate a shift amount for collectively correcting positions of all of the multiple charged particle beams of the k-th shot, based on parameters related to at least the (k+1)th and subsequent shots (k being a natural number) of the multiple charged particle beams, and a writing mechanism including a deflector for deflecting the multiple charged particle beams, and to perform the k-th shot onto the substrate with the multiple charged particle beams while shifting the all of the multiple charged particle beams of the k-th shot by collective deflection according to the shift amount.

The present disclosure aims at proposing a multi-beam irradiation device capable of correcting off-axis aberrations. In order to achieve the above object, a beam irradiation device is proposed, which includes a beam source which emits a plurality of beams; an objective lens (17) which focuses a beam on a sample; a first lens (16) which is arranged such that a lens main surface is positioned at an object point of the objective lens and deflects a plurality of incident beams toward an intersection point of a lens main surface of the objective lens and an optical axis; a second lens (15) which is arranged closer to a beam source side than the first lens and focuses the plurality of beams on a lens main surface of the first lens; and a third lens (14) which is arranged closer to the beam source side than the second lens and deflects the plurality of beams toward an intersection point of a lens main surface of the second lens and the optical axis.

A charged particle beam device for imaging and/or inspecting a sample is described. The charged particle beam device includes a beam emitter for emitting a primary charged particle beam; a retarding field device for retarding the primary beam before impinging on the sample, the retarding field device including an objective lens and a proxy electrode; and a first detector for off-axial backscattered particles between the proxy electrode and the objective lens. The charged particle beam device is adapted for guiding the primary beam along an optical axis to the sample for releasing signal particles. The proxy electrode includes one opening allowing a passage of the primary charged particle beam and of the signal particles, wherein the one opening is sized to allow a passage of charged particles backscattered from the sample at angles from 0° to 20° or above relative to the optical axis. Further, a method for imaging and/or inspecting a sample with a charged particle beam device is described.

An ion beam processing system including a plasma chamber, a plasma plate, disposed alongside the plasma chamber, the plasma plate defining a first extraction aperture, a beam blocker, disposed within the plasma chamber and facing the extraction aperture, a blocker electrode, disposed on a surface of the beam blocker outside of the plasma chamber, and an extraction electrode disposed on a surface of the plasma plate outside of the plasma chamber.

Method for investigating samples by time-series emission of cathodoluminescence (CL) microscope having electron beam and light sensor. In discovery scan, changes caused by the electron beam are unknown, in an inspection scan changes have already been identified in similar sample. Discovery scan starts by setting parameters of the electron beam to irradiate at a first rate of dose; flushing the buffer of the light sensor; scanning the electron beam over an area of interest on the sample while collecting CL emission with the light sensor, while preventing any reading of the data from the buffer until the entire scanning has been completed; once the entire scanning has been completed, blanking the electron beam and interrogating the buffer to identify a first CL image; and then interrogating the buffer to fetch all remaining CL images and tagging all fetched CL images according to time sequence starting from the first CL image.

Disclosed are a ceramic structure, a lower electrode, and a dry etching machine. The ceramic structure includes at least two ceramic plates, and a clamping slot and a boss are arranged on one side of each ceramic plate close to a neighboring ceramic plate. In two neighboring ceramic plates, a boss of one ceramic plate is clamped into a clamping slot of the other ceramic plate, so that no through gap is generated between the two neighboring ceramic plates in a thickness direction.