An objective of the present invention is to provide a charged particle beam device capable of estimating a lifetime of a filament of a charged particle beam source with a cheap and simple circuit configuration. The charged particle beam device according to the present invention includes a boosting circuit that boosts a voltage to be supplied to a filament and estimates a remaining duration of the filament using a measured value of a current flowing on a low-voltage side of the boosting circuit (see FIG. 3).

An objective of the present invention is to provide a charged particle beam device capable of estimating a lifetime of a filament of a charged particle beam source with a cheap and simple circuit configuration. The charged particle beam device according to the present invention includes a boosting circuit that boosts a voltage to be supplied to a filament and estimates a remaining duration of the filament using a measured value of a current flowing on a low-voltage side of the boosting circuit (see FIG. 3).

A plasma processing method according to an exemplary embodiment includes preparing a substrate in a chamber of a plasma processing apparatus. The substrate is disposed on a substrate support in the chamber. The substrate support includes a lower electrode and an electrostatic chuck. The electrostatic chuck is provided on the lower electrode. The plasma processing method further includes applying a positive voltage to a conductive member when plasma is being generated in the chamber for plasma processing on the substrate. The conductive member extends closer to a grounded side wall of the chamber than the substrate.

A plasma processing method according to an exemplary embodiment includes preparing a substrate in a chamber of a plasma processing apparatus. The substrate is disposed on a substrate support in the chamber. The substrate support includes a lower electrode and an electrostatic chuck. The electrostatic chuck is provided on the lower electrode. The plasma processing method further includes applying a positive voltage to a conductive member when plasma is being generated in the chamber for plasma processing on the substrate. The conductive member extends closer to a grounded side wall of the chamber than the substrate.

A charged particle beam device according to the present invention comprises a charged particle source that emits charged particles, a detection circuit that detects electrons which are generated by a sample as a result of irradiation with the charged particles, and a power storage device (107_VHD) that holds direct voltage, and comprises a charge circuit (107_CHG) that charges the power storage device with supplied voltage, and a control circuit (107_CTL) that controls the charge circuit such that charging is carried out in a period in which no sample is measured, wherein the direct voltage held by the power storage device (107_VHD) is used as operating voltage.

A charged particle beam device according to the present invention comprises a charged particle source that emits charged particles, a detection circuit that detects electrons which are generated by a sample as a result of irradiation with the charged particles, and a power storage device (107_VHD) that holds direct voltage, and comprises a charge circuit (107_CHG) that charges the power storage device with supplied voltage, and a control circuit (107_CTL) that controls the charge circuit such that charging is carried out in a period in which no sample is measured, wherein the direct voltage held by the power storage device (107_VHD) is used as operating voltage.

Systems and methods for creating arbitrarily-shaped ion energy distribution functions using shaped-pulse-bias. In an embodiment, a method includes applying a positive jump voltage to an electrode of a process chamber to neutralize a wafer surface, applying a negative jump voltage to the electrode to set a wafer voltage, and modulating the amplitude of the wafer voltage to produce a predetermined number of pulses to determine an ion energy distribution function. In another embodiment a method includes applying a positive jump voltage to an electrode of a process chamber to neutralize a wafer surface, applying a negative jump voltage to the electrode to set a wafer voltage, and applying a ramp voltage to the electrode that overcompensates for ion current on the wafer or applying a ramp voltage to the electrode that undercompensates for ion current on the wafer.

Systems and methods for creating arbitrarily-shaped ion energy distribution functions using shaped-pulse-bias. In an embodiment, a method includes applying a positive jump voltage to an electrode of a process chamber to neutralize a wafer surface, applying a negative jump voltage to the electrode to set a wafer voltage, and modulating the amplitude of the wafer voltage to produce a predetermined number of pulses to determine an ion energy distribution function. In another embodiment a method includes applying a positive jump voltage to an electrode of a process chamber to neutralize a wafer surface, applying a negative jump voltage to the electrode to set a wafer voltage, and applying a ramp voltage to the electrode that overcompensates for ion current on the wafer or applying a ramp voltage to the electrode that undercompensates for ion current on the wafer.

The invention describes a compact device having, in a housing, a chamber which is closable by a flap, one wall of which chamber having at least one first guidance element and at least one first fixation element, as well as two spaced-apart first contact elements which are fixedly connected to electrical connectors of a generator by electrical leads. Further, the device has at least one carrier having at least one second guidance element which, when the carrier is arranged against the wall, engages the first guidance elements and aligns the carrier in a predetermined position with respect to the wall. The carrier has at least one second fixation element that is aligned to match with the at least one first fixation element upon engagement of the first and second guidance elements, such that, when the first and second guidance elements are engaged, the first and second fixation elements are aligned to match one another and can be secured to one another.

The invention describes a compact device having, in a housing, a chamber which is closable by a flap, one wall of which chamber having at least one first guidance element and at least one first fixation element, as well as two spaced-apart first contact elements which are fixedly connected to electrical connectors of a generator by electrical leads. Further, the device has at least one carrier having at least one second guidance element which, when the carrier is arranged against the wall, engages the first guidance elements and aligns the carrier in a predetermined position with respect to the wall. The carrier has at least one second fixation element that is aligned to match with the at least one first fixation element upon engagement of the first and second guidance elements, such that, when the first and second guidance elements are engaged, the first and second fixation elements are aligned to match one another and can be secured to one another.