Patent classifications
H01J37/256
METHOD OF EXAMINING A SAMPLE USING A CHARGED PARTICLE MICROSCOPE, WHEREIN AN ELECTRON ENERGY-LOSS SPECTROSCOPY (EELS) SPECTRUM IS ACQUIRED
The invention relates to a method of examining a sample using a charged particle microscope, comprising the steps of providing a charged particle beam, as well as a sample; scanning said charged particle beam over said sample at a plurality of sample positions; and acquiring an EELS spectrum for each of said plurality of sample positions. According to the method, it comprises the further steps of scanning, once more, said charged particle beam over said sample at said plurality of sample positions; acquiring a further EELS spectrum for each of said plurality of sample positions; and combining, for each of said plurality of sample positions, said EELS spectrum with said further EELS spectrum. With this, it is possible to acquire rapid information on the sample being investigated, allowing for faster processing of samples.
X-ray analyzer and method for correcting counting rate
An X-ray analyzer includes: an X-ray detector that detects an X-ray emitted from a specimen and outputs a signal having a step that has a height corresponding to energy of the X-ray; a pulse generation circuit that converts the signal output from the X-ray detector into a first pulse signal; a pulse-width setting circuit that sets a pulse width; a pulse-width conversion circuit that converts a pulse width of the first pulse signal into the pulse width set by the pulse-width setting circuit to form a second pulse signal; a pulse-height discriminator that discriminates the second pulse signal according to a pulse height of the second pulse signal; a counting circuit that calculates a counting rate of the discriminated second pulse signal; and a counting-loss correction processing unit that corrects the counting rate. The counting-loss correction processing unit corrects the counting rate based on the pulse width.
HARD X-RAY PHOTOELECTRON SPECTROSCOPY ARRANGEMENT AND SYSTEM
The present invention relates to a hard X-ray photoelectron spectroscopy (HAXPES) system comprising an X-ray source providing a beam of photons which is directed through the system so as to excite electrons from an illuminated sample. An X-ray tube is connected to a monochromator vacuum chamber in which a crystal is configured to monochromatize and focus the beam onto an illuminated sample. A hemispherical electron energy analyser is mounted onto the analysis chamber. An air gap is provided between the X-ray tube and the monochromator chamber, which air gap is provided with a first radiation trap to shield the ambient air from the radiation when the air gap is illuminated with X-rays from the source.
HARD X-RAY PHOTOELECTRON SPECTROSCOPY ARRANGEMENT AND SYSTEM
The present invention relates to a hard X-ray photoelectron spectroscopy (HAXPES) system comprising an X-ray source providing a beam of photons which is directed through the system so as to excite electrons from an illuminated sample. An X-ray tube is connected to a monochromator vacuum chamber in which a crystal is configured to monochromatize and focus the beam onto an illuminated sample. A hemispherical electron energy analyser is mounted onto the analysis chamber. An air gap is provided between the X-ray tube and the monochromator chamber, which air gap is provided with a first radiation trap to shield the ambient air from the radiation when the air gap is illuminated with X-rays from the source.
REAL-TIME DIRECT MEASUREMENT OF MECHANICAL PROPERTIES IN-SITU OF SCANNING BEAM MICROSCOPE
System and methods are described for directly measuring mechanical properties of a sample while concurrently imaging the sample using a scanning beam microscope (e.g., a scanning electron microscope (SEM)). The system includes a clamping mount configured to hold the sample and a load cell positioned proximal to the clamping mount and configured to provide a direct, real-time measurement of force on the sample end. The system further includes a controllable probe configured to apply a force to the sample. In some embodiments, the sample load cell is tiltably couplable to a sample held by the clamping mount and the controllable probe is moveable between a plurality of different mounting positions relative to the load cell.
REAL-TIME DIRECT MEASUREMENT OF MECHANICAL PROPERTIES IN-SITU OF SCANNING BEAM MICROSCOPE
System and methods are described for directly measuring mechanical properties of a sample while concurrently imaging the sample using a scanning beam microscope (e.g., a scanning electron microscope (SEM)). The system includes a clamping mount configured to hold the sample and a load cell positioned proximal to the clamping mount and configured to provide a direct, real-time measurement of force on the sample end. The system further includes a controllable probe configured to apply a force to the sample. In some embodiments, the sample load cell is tiltably couplable to a sample held by the clamping mount and the controllable probe is moveable between a plurality of different mounting positions relative to the load cell.
X-Ray Analyzer and Method for Correcting Counting Rate
An X-ray analyzer includes: an X-ray detector that detects an X-ray emitted from a specimen and outputs a signal having a step that has a height corresponding to energy of the X-ray; a pulse generation circuit that converts the signal output from the X-ray detector into a first pulse signal; a pulse-width setting circuit that sets a pulse width; a pulse-width conversion circuit that converts a pulse width of the first pulse signal into the pulse width set by the pulse-width setting circuit to form a second pulse signal; a pulse-height discriminator that discriminates the second pulse signal according to a pulse height of the second pulse signal; a counting circuit that calculates a counting rate of the discriminated second pulse signal; and a counting-loss correction processing unit that corrects the counting rate. The counting-loss correction processing unit corrects the counting rate based on the pulse width.
Electron energy loss spectrometer using direct detection sensor
An electron energy loss spectrometer is described having a direct detection sensor, a high speed shutter and a sensor processor wherein the sensor processor combines images from individual sensor read-outs and converts a two dimensional image from said sensor into a one dimensional spectrum and wherein the one dimensional spectrum is output to a computer and operation of the high speed shutter is integrated with timing of imaging the sensor. The shutter is controlled to allow reduction in exposure of images corresponding to the individual sensor readouts. A plurality of images are exposed by imaging less than the full possible exposure and wherein the plurality of images are combined to form a composite image. The plurality of images can be comprised of images created by exposing the sensor for different exposure times.
Electron energy loss spectrometer using direct detection sensor
An electron energy loss spectrometer is described having a direct detection sensor, a high speed shutter and a sensor processor wherein the sensor processor combines images from individual sensor read-outs and converts a two dimensional image from said sensor into a one dimensional spectrum and wherein the one dimensional spectrum is output to a computer and operation of the high speed shutter is integrated with timing of imaging the sensor. The shutter is controlled to allow reduction in exposure of images corresponding to the individual sensor readouts. A plurality of images are exposed by imaging less than the full possible exposure and wherein the plurality of images are combined to form a composite image. The plurality of images can be comprised of images created by exposing the sensor for different exposure times.
Nondestructive sample imaging
A system and method for imaging a sample having a complex structure (such as an integrated circuit) implements two modes of operation utilizing a common electron beam generator that produces an electron beam within a chamber. In the first mode, the electron beam interacts directly with the sample, and backscattered electrons, secondary electrons, and backward propagating fluorescent X-rays are measured. In the second mode, the electron beam interrogates the sample via X-rays generated by the electron beam within a target that is positioned between the electron beam generator and the sample. Transmitted X-rays are measured by a detector within the vacuum chamber. The sample is placed on a movable platform to precisely position the sample with respect to the electron beam. Interferometric and/or capacitive sensors are used to measure the position of the sample and movable platform to provide high accuracy metadata for performing high resolution three-dimensional sample reconstruction.