This disclosure is directed to solutions of detecting and classifying wafer defects using machine learning techniques. The solutions take only one coarse resolution digital microscope image of a target wafer, and use machine learning techniques to process the coarse SEM image to review and classify a defect on the target wafer. Because only one coarse SEM image of the wafer is needed, the defect review and classification throughput and efficiency are improved. Further, the techniques are not distractive and may be integrated with other defect detecting and classification techniques.

An object of the invention is to accurately correct a deviation in position or angle between observation regions in an imaging device that acquires images of a plurality of sample sections. The imaging device according to the invention identifies a correspondence relationship between the observation regions between the sample sections using a feature point on a first image, corrects a deviation between the sample sections using a second image in a narrower range than the first image, and after reflecting a correction result, acquires a third image having a higher resolution than the second image (see FIG. 6B).

A beam position monitor is provided, for measuring a position of a beam of charged particles passing through a chamber, the beam position monitor including a first magnetic field sensor and a second magnetic field sensor configured to be installed in the chamber on either side of the beam of charged particles, each magnetic field sensor including a conductive loop, the conductive loop of the first magnetic field sensor and the conductive loop of the second magnetic field sensor being configured to have inductances different from one another. A measurement system and a particle accelerator are also provided.

An electron gun according to one aspect of the present invention includes an emission source configured to emit an electron beam, an aperture array substrate, where a plurality of passage holes are formed, configured to form multiple beams by letting portions of the electron beam individually pass through the plurality of passage holes, and a first electrode, where a first opening through which the electron beam can pass is formed, configured to include an opposing plane which is located at a side of the emission source with respect to the aperture array substrate and facing a surface of the aperture array substrate and whose outer diameter is smaller than an outer diameter of the aperture array substrate, the first electrode configured to be applied with a first control potential.

Provided is a charged particle beam system capable of reducing the force applied to a sample when a chuck device grips the sample. The charged particle beam system is typified by an electron microscope including a sample chamber, a sample exchange chamber connected to the sample chamber, a sample container capable of being removably attached in the sample exchange chamber, and a transport device for transporting the sample between the sample container and the sample exchange chamber. The transport device includes the chuck device for gripping the sample, a drive mechanism for moving the chuck device in a given direction, a mechanical driver for actuating the chuck device, and a power transmission mechanism for transmitting power of the mechanical driver to the chuck device. The power transmission mechanism includes a shaft and a resilient member that elastically deforms when a force in the given direction is applied to the shaft.

There is provided a system and method of examination of a semiconductor specimen, comprising: obtaining a sequence of frames of an area of the specimen acquired by an electron beam tool configured to scan the area from a plurality of directions, the sequence comprising a plurality of sets of frames each acquired from a respective direction; and registering the plurality of sets of frames and generating an image of the specimen based on result of the registration, comprising: performing, for each direction, a first registration among the set of frames acquired therefrom, and combining the registered set of frames to generate a first composite frame, giving rise to a plurality of first composite frames respectively corresponding to the plurality of directions; and performing a second registration among the plurality of first composite frames, and combining the registered plurality of first composite frames to generate the image of the specimen.

The present invention relates to an image generation method for an objective for generating an image corresponding to a multi-frame image from image signals obtained by scanning a small number of frames are proposed. To achieve the above objective, there is proposed a method of performing two-dimensionally scanning on an object on a sample with a beam a plurality of times, generating a first image by integrating image signals obtained by a plurality of times of scanning at a first timing among the image signals generated based on the plurality of times of the two-dimensional scanning (S103), generating a second image based on the smaller number of times of scanning than the number of times of scanning at the first timing including scanning after the first timing (S105), training a learning device by using teacher data with the second image as an input and the first image as an output (S108), and inputting input image signals obtained by the smaller number of times of scanning than the number of times of scanning at the first timing to the trained learning device to output an estimated image.

Situating samples on an optical axis of a charged particle microscope can be performed based a 3D map of the samples. The 3D map is produced with back-side illumination of the samples and telecentric imaging to produce profile images. The profile images are a combined to form the 3D map. Using the 3D map, the processor is coupled to a sample stage to situate a selected sample or sample portion for imaging in the charged particle microscope. In some examples, the processor is responsive to selection of a sample using a graphical interface so that the sample stage is controlled to safely situate the selected sample without further operator intervention.

Systems directed to a stage apparatus in an electron beam inspection tool to inspect a sample are disclosed. The stage apparatus comprises a short stroke stage; a long stroke stage; a first sensor configured to measure a position of the short stroke stage with respect to a measurement reference; one or more roller bearings configured to support the long stroke stage; and a controller having circuitry and configured to control a motion of the long stroke stage and a motion of the short stroke stage for following movement of the reference at least partly based on measurement from the first sensor, wherein the controller is operable such that control of the long stroke stage is decoupled from the movement of the reference in at least a part of operation of the stage apparatus for reducing debris generation of the one or more roller bearings.

The purpose of the present invention is to provide a charged-particle beam apparatus capable of performing various types of signal discriminations according to the shape and the size of a sample. The present invention proposes a charged-particle beam apparatus for irradiating a sample disposed in a vacuum vessel with a charged particle beam. The charged-particle beam apparatus is provided with: a first light-generating surface for generating light on the basis of the collision of charged particles released from the sample; a light-guiding member for guiding the generated light to the outside of the vacuum vessel while maintaining the generation distribution of the light generated at the first light-generating surface; a photodetector for detecting the light guided by the light-guiding member to the outside of the vacuum vessel; and a light-transmission restricting member for restricting transmission of the light guided by the light-guiding member between the photodetector and the light-guiding member.