A method of milling a sample that includes a first layer formed over a second layer, where the first and second layers are different materials, the method comprising: milling the region of the sample by scanning a focused ion beam over the region a plurality of iterations in which, for each iteration, the focused ion beam removes material from the sample generating byproducts from the milled region; detecting, during the milling, the partial pressures of one or more byproducts with a residual gas analyzer positioned to have a direct line of sight to the milled region; generating, in real-time, an output detection signal from the residual gas analyzer indicative of an amount of the one or more byproducts detected; and stopping the milling based on the output signal.

In an embodiment, a method includes: placing a wafer on an implanter platen, the wafer including alignment marks; measuring a position of the wafer by measuring positions of the alignment marks with one or more cameras; determining an angular displacement between the position of the wafer and a reference position of the wafer; and rotating the implanter platen by the angular displacement.

In an embodiment, a method includes: placing a wafer on an implanter platen, the wafer including integrated circuit dies; measuring a position of the wafer by measuring a positions of an outer edge of the integrated circuit dies with a camera; determining an angular displacement between the position of the wafer and a reference position of the wafer; and rotating the implanter platen by the angular displacement.

A method of evaluating a region of interest of a sample including: positioning the sample within in a vacuum chamber of an evaluation tool that includes a scanning electron microscope (SEM) column and a focused ion beam (FIB) column; acquiring a plurality of two-dimensional images of the region of interest by alternating a sequence of delayering the region of interest with a charged particle beam from the FIB column and imaging a surface of the region of interest with the SEM column; generating an initial three-dimensional data cube representing the region of interest by stacking the plurality of two-dimensional images on top of each other in an order in which they were acquired; identifying distortions within the initial three-dimensional data cube; and creating an updated three-dimensional data cube that includes corrections for the identified distortions.

Calibration systems, additive manufacturing systems employing the same, and methods of calibrating include a plurality of electron beam guns. One calibration system includes an imaging device positioned to capture one or more images of an impingement of electron beams emitted from the plurality of electron beam guns on a surface within a build chamber of the electron beam additive manufacturing system and an analysis component communicatively coupled to the imaging device. The analysis component is programmed to receive image data corresponding to the one or more images, determine one or more calibration parameters from the image data, and transmit one or more instructions to the plurality of electron beam guns in accordance with the one or more calibration parameters.

Calibration systems, additive manufacturing systems employing the same, and methods of calibrating include a plurality of electron beam guns. One calibration system includes an imaging device positioned to capture one or more images of an impingement of electron beams emitted from the plurality of electron beam guns on a surface within a build chamber of the electron beam additive manufacturing system and an analysis component communicatively coupled to the imaging device. The analysis component is programmed to receive image data corresponding to the one or more images, determine one or more calibration parameters from the image data, and transmit one or more instructions to the plurality of electron beam guns in accordance with the one or more calibration parameters.

There is provided an ion implanter including a beam generation device that generates an ion beam, based on an implantation recipe, a plurality of measurement devices that measure at least one physical quantity of the ion beam, and a control device that acquires a data set including a plurality of measurement values measured by the plurality of measurement devices, and evaluates measurement validity of the at least one physical quantity of the ion beam by using a model representing a correlation between the plurality of measurement values.

There is provided an ion implanter including a beam generation device that generates an ion beam, based on an implantation recipe, a plurality of measurement devices that measure at least one physical quantity of the ion beam, and a control device that acquires a data set including a plurality of measurement values measured by the plurality of measurement devices, and evaluates measurement validity of the at least one physical quantity of the ion beam by using a model representing a correlation between the plurality of measurement values.

A specimen machining device for machining a specimen by irradiating the specimen with an ion beam includes an ion source for irradiating the specimen with the ion beam, a specimen stage for holding the specimen, a camera for photographing the specimen, an information provision unit for providing information indicating an expected machining completion time, and a storage unit for storing past machining information. The information provision unit performs processing for calculating the expected machining completion time based on the past machining information, processing for acquiring an image photographed by the camera, processing for calculating a machining speed based on the acquired image, and processing for updating the expected machining completion time based on the machining speed.

A specimen machining device for machining a specimen by irradiating the specimen with an ion beam includes an ion source for irradiating the specimen with the ion beam, a specimen stage for holding the specimen, a camera for photographing the specimen, an information provision unit for providing information indicating an expected machining completion time, and a storage unit for storing past machining information. The information provision unit performs processing for calculating the expected machining completion time based on the past machining information, processing for acquiring an image photographed by the camera, processing for calculating a machining speed based on the acquired image, and processing for updating the expected machining completion time based on the machining speed.