A photoelectric conversion device is provided with an electron emitter including a meta-surface emitting an electron in response to incidence of an electromagnetic wave. The meta-surface includes a plurality of photoelectric conversion units having a sensitivity for electromagnetic waves having mutually different wavelength regions. The plurality of photoelectric conversion units respectively include patterns having mutually different configurations.

In one exemplary embodiment, a method for calibrating an instrument is provided. The instrument includes an optical system capable of imaging florescence emission from a plurality of reaction sites. The method includes performing a region-of-interest (ROI) calibration to determine reaction site positions in an image. The method further includes performing a pure dye calibration to determine the contribution of a fluorescent dye used in each reaction site by comparing a raw spectrum of the fluorescent dye to a pure spectrum calibration data of the fluorescent dye. The method further includes performing an instrument normalization calibration to determine a filter normalization factor. The method includes performing an RNase P validation to validate the instrument is capable of distinguishing between two different quantities of sample.

In one embodiment, a femtowatt sensitivity optical detector is provided using one or more photodiodes, intended as a replacement for the photomultiplier based photon counting unit.

An imaging apparatus 10 includes an imaging panel 11 formed by arranging imaging element units 20 included in one pixel or a plurality of pixels, in a two-dimensional matrix form. Each of the imaging element units 20 includes an imaging element 30 which converts an incident electromagnetic wave to a current, and a current/voltage conversion circuit 40A which converts the current from the imaging element to a voltage.

An apparatus for detecting deformation of an elongate body may comprise a light source configured to sequentially provide light of multiple frequencies, an optical receiver configured to receive light from the light source, and a filter disposed between the light source and the optical detector. The filter may comprise multiple segments, each of the segments configured to filter light at one of the frequencies so as to alter the amount of light incident on said optical receiver. A total amount of light detected by the optical receiver may change during the sequence so as to be indicative of deformation of the elongate body.

Rolling bearings include a plurality of rolling bodies which during operation roll on raceways. In order to reduce friction during rolling, it is customary to supply the rolling bearings with a lubricant. However, the quality of the lubricant can deteriorate during operation due to long-term stress, aging, or thermal influences, or get lost in gaps etc. The objective addressed by the invention is that of providing a sensor device, which can be operated in a functionally reliable manner. This objective is achieved by a sensor device for monitoring the state of a lubricant in a lubricant chamber, including a transmitter platform, wherein on the transmitter platform, a plurality of diode devices are arranged, having a measurement window device, wherein the measurement window device is arranged between a measuring chamber and the lubricant chamber, having a receiving device, wherein at least one of the diode devices comprises a die and a plastic dome. The plastic dome and the die are connected by way of a contact surface, wherein the contact surface is arranged on an upper side of the die.

A solid-state imaging device includes: a semiconductor substrate provided with an effective pixel region including a light receiving section that photoelectrically converts incident light; an interconnection layer that is provided at a plane side opposite to the light receiving plane of the semiconductor substrate; a first groove portion that is provided between adjacent light receiving sections and is formed at a predetermined depth from the light receiving plane side of the semiconductor substrate; and an insulating material that is embedded in at least a part of the first groove portion.

In a photoelectric conversion device, the meta-surface includes a first antenna portion, a first bias portion, a second antenna portion, and a second bias portion. The first antenna portion extends in a first direction and emits an electron in response to incidence of the electromagnetic wave. The first bias portion faces the first antenna portion and is configured to generate an electric field having a component in the first direction between the first bias portion and the first antenna portion. The second antenna portion extends in a second direction intersecting the first direction and emits an electron in response to incidence of the electromagnetic wave. The second bias portion faces the second antenna portion and is configured to generate an electric field having a component in the second direction between the second bias portion and the second antenna portion.

In a photoelectric conversion device, the meta-surface includes a first antenna portion, a first bias portion, a second antenna portion, and a second bias portion. The first antenna portion extends in a first direction and emits an electron in response to incidence of the electromagnetic wave. The first bias portion faces the first antenna portion and is configured to generate an electric field having a component in the first direction between the first bias portion and the first antenna portion. The second antenna portion extends in a second direction intersecting the first direction and emits an electron in response to incidence of the electromagnetic wave. The second bias portion faces the second antenna portion and is configured to generate an electric field having a component in the second direction between the second bias portion and the second antenna portion.

A method for forming a photosensitive module is provided. The method includes providing a sensing device. The sensing device includes a conducting pad located on a substrate. A first opening penetrates the substrate and exposes the conducting pad. A redistribution layer is in the first opening to electrically connect to the conducting pad. A cover plate is located on the substrate and covers the conducting pad. The method also includes removing the cover plate of the sensing device. The method further includes bonding the sensing device to a circuit board after the removal of the cover plate. The redistribution layer in the first opening is exposed and faces the circuit board. In addition, the method includes mounting an optical component corresponding to the sensing device on the circuit board. A photosensitive module formed by the method is also provided.