A multi-beam charged particle system is configured for selecting a first and a second, different image acquisition property, and for acquiring a first image and a second image of a surface of a wafer with a plurality of primary charged particle beamlets. The multi-beam charged particle system is configured for image processing of the first and the second images to obtain at least one processed image. The technology can be used in applications of multi-beam charged particle system, where relatively high beam uniformity and throughput are often desirable. A corresponding method is disclosed. The system and method can yield improved image contrast.