Patent classifications
H01J2237/1501
METHOD FOR OPERATING A PARTICLE BEAM MICROSCOPE
Two types of operational parameters are used in a particle beam microscope. First parameters influence the image quality, and have settings that are alterable by a user in view of obtaining a better image quality. Second parameters characterize the mode of operation, and the image quality becomes poorer when these change. A mode of operation of the particle beam microscope includes: registering of settings of the first parameters and the second parameters, which the user undertakes in a period of time; analysing a plurality of recorded settings of the first parameters and of the second parameters; determining settings of the first parameters which are advantageous in view of the image quality on the basis of the current settings of the second parameters; and setting the determined advantageous settings of the first parameters.
Charged Particle Beam Device
When using a charged particle beam aperture having a ring shape in a charged particle beam device, the charged particle beam with the highest current density immediately above the optical axis, among the charged particle beams is blocked, so that it is difficult to dispose the charged particle beam aperture at the optimal mounting position. Therefore, in addition to the ring-shaped charged particle beam aperture, a hole-shaped charged particle beam aperture is provided, and it is possible to switch between the case where the ring-shaped charged particle beam aperture is disposed on the optical axis of the charged particle beam and the case where the hole-shaped charged particle beam aperture is disposed on the optical axis of the charged particle beam.
Charged particle beam axial alignment device, charged particle beam irradiation device and charged particle beam axial alignment method
With strength of an objective lens set to first strength, a first scanned image of a sample is produced. The strength of the objective lens is set to second strength. A rotation amount difference of a charged particle beam between the case where the strength is set to the first strength and the case where the strength is set to the second strength is specified. At the second strength, with a scanner controlled such that the rotation for canceling the rotation amount difference is supplied to the charged particle beam, a second scanned image of the sample is produced. Based on a relative positional relationship between the first and second scanned images, a deflector is controlled such that positions of the first and second scanned images coincide with each other.
ADJUSTMENT METHOD AND ELECTRON BEAM DEVICE
An adjustment method for adjusting a path of an electron beam passing through an electron beam device including at least one unit having at least one lens and at least one aligner electrode, and a detector configured to detect the electron beam, the method including: a step of measuring, by a coordinate measuring machine, an assembly tolerance for each of a plurality of the units constituting the electron beam device; a step of determining a shift amount of the electron beam at a position of the at least one of the lenses; a step of determining an electrode condition for each of a plurality of the aligner electrodes included in the units in a manner such that a shift amount of the electron beam is to be the determined shift amount; and a step of setting each of the aligner electrodes to the corresponding determined electrode condition.
Multi-beam inspection apparatus with improved detection performance of signal electrons
The present disclosure proposes a crossover-forming deflector array of an electro-optical system for directing a plurality of electron beams onto an electron detection device. The crossover-forming deflector array includes a plurality of crossover-forming deflectors positioned at or at least near an image plane of a set of one or more electro-optical lenses of the electro-optical system, wherein each crossover-forming deflector is aligned with a corresponding electron beam of the plurality of electron beams.
Beam position monitors for medical radiation machines
An apparatus includes: a structure having a lumen for accommodating a beam (e.g., electron beam, proton beam, or a charged particle beam), wherein the structure is a component of a medical radiation machine having a target for interaction with the beam to generate radiation; and a first beam position monitor comprising a first electrode and a second electrode, the first electrode being mounted to a first side of the structure, the second electrode being mounted to a second side of the structure, the second side being opposite from the first side; wherein the first beam position monitor is located upstream with respect to the target.
STATIONARY INTRAORAL TOMOSYNTHESIS IMAGING SYSTEMS, METHODS, AND COMPUTER READABLE MEDIA FOR THREE DIMENSIONAL DENTAL IMAGING
Intraoral three-dimensional (3D) tomosynthesis imaging systems, methods, and non-transitory computer readable media are used to generate one or more two-dimensional (2D) x-ray projection images and to reconstruct, using a computing platform, the one or more 2D x-ray projection images into one or more 3D images of an object, such as teeth of a patient, which can then be displayed on a monitor in order to enhance diagnostic accuracy of dental disease. The intraoral 3D tomosynthesis imaging system can include a wall-mountable control unit connected to one end of an articulating arm, the other end of which is connected to an x-ray source, which is configured to generate x-ray radiation that is acquired by an x-ray detector held at a desired position by an x-ray detector holder that is removably coupled to a collimator at an emission region of the x-ray source.
Charged Particle Beam Device and Control Method of Optical System of Charged Particle Beam Device
A charged particle beam device includes: a charged particle source; an optical system which acts on a charged particle beam emitted from the charged particle source; a control unit which controls the optical system; and a storage unit which stores previous setting values of the optical system. The optical system includes a first optical element and a second optical element for controlling a state of the charged particle beam to be incident on the first optical element. The control unit obtains an initial value of a setting value of the second optical element based on previous setting values of the second optical element; and changes a state of the charged particle beam by changing the setting value of the second optical element from the obtained initial value and obtains the setting value of the second optical element based on the change in the state of the charged particle beam.
Charged particle beam image acquisition apparatus
According to one aspect of the present invention, a charged particle beam image acquisition apparatus includes a rectangular parallelepiped chamber where a target object is disposed; a primary electron optical column placed on an upper surface of the chamber so that a point of intersection between two diagonal lines on the upper surface of the chamber is located at a center of a horizontal section of the primary electron optical column, a primary charged particle beam optics irradiating the target object with a primary charged particle beam being disposed in the primary electron optical column; and a secondary electron optical column connected to a lower portion of the primary electron optical column, a secondary charged particle beam optics being disposed in the secondary electron optical column and a secondary charged particle beam passing through the secondary charged particle beam optics.
Scanning electron microscope objective lens calibration using X-Y voltages iteratively determined from images obtained using said voltages
Objective lens alignment of a scanning electron microscope review tool with fewer image acquisitions can be obtained using the disclosed techniques and systems. Two different X-Y voltage pairs for the scanning electron microscope can be determined based on images. A second image based on the first X-Y voltage pair can be used to determine a second X-Y voltage pair. The X-Y voltage pairs can be applied at the Q4 lens or other optical components of the scanning electron microscope.