A charged particle beam writing method includes forming an aperture image by making a charged particle beam pass through an aperture substrate, changing, in the state where a plurality of crossover positions of the charged particle beam and positions of all of one or more intermediate images of the aperture image are adjusted to matching positions with respect to the aperture image with the first magnification, magnification of the aperture image from the first magnification to the second magnification by using a plurality of lenses while maintaining the last crossover position of the charged particle beam and the position of the last intermediate image of the aperture image to be fixed, and forming, using an objective lens, the aperture image whose magnification has been changed to the second magnification on the surface of the target object, and writing the aperture image.

A method for automatically aligning a scanning tunneling electron microscope (STEM) for acquiring precession electron diffraction (PED) mapping data includes the generation of an incident electron beam aligned with a STEM optic axis and focused on a sample region. A non-inclined signal is acquired of the spatial distribution from the sample region, by scanning the aligned incident beam across multiple discrete locations and acquiring a signal associated with each location. The method can further include the inclination of the incident electron beam to a fixed inclination angle relative to the optic axis and then acquiring an inclined signal spatial distribution from the sample region by scanning the inclined incident beam across the multiple discrete locations while applying a cyclic azimuthal scanning protocol to the inclined beam and acquiring a signal associated with each location. An azimuthal spatial alignment correction is determined by comparing the non-inclined and inclined signal spatial distributions.

Methods, apparatuses, systems and software for ion beam milling or machining are disclosed. The apparatus includes a specimen holder, a table, one or more ion sources, rotatable ion optics, and an imaging device. The specimen holder is configured to hold a specimen in a stationary position during milling or machining. The table is configured to change the stationary position of the specimen holder in any of three orthogonal linear directions and an angular direction. The rotatable ion optics are configured to emit an ion beam towards a predetermined location on the specimen from any of the one or more ion sources at any angle around an axis that is orthogonal to a horizontal surface of the table when the angular direction of the table is 0. The imaging device is configured to generate an image of the specimen including the predetermined location, thereby enabling real-time monitoring of the milling or machining process.

Provided is a measurement method for measuring, in an electron microscope including a segmented detector having a detection plane segmented into a plurality of detection regions, a direction of each of the plurality of detection regions in a scanning transmission electron microscope (STEM) image, the measurement method including: shifting an electron beam EB incident on a sample S under a state where the detection plane is conjugate to a plane shifted from a diffraction plane to shift the electron beam EB on the detection plane, and measuring a shift direction of the electron beam EB on the detection plane with the segmented detector; and obtaining the direction of each of the plurality of detection regions in the STEM image from the shift direction.

A charged particle beam writing method includes forming an aperture image by making a charged particle beam pass through an aperture substrate, changing, in the state where a plurality of crossover positions of the charged particle beam and positions of all of one or more intermediate images of the aperture image are adjusted to matching positions with respect to the aperture image with the first magnification, magnification of the aperture image from the first magnification to the second magnification by using a plurality of lenses while maintaining the last crossover position of the charged particle beam and the position of the last intermediate image of the aperture image to be fixed, and forming, using an objective lens, the aperture image whose magnification has been changed to the second magnification on the surface of the target object, and writing the aperture image.

An SEM image acquisition device including a scanning signal generation unit configured to rotate a scanning direction of the electron beam to be scanned on the sample and generate a scanning signal to be emitted on a position on the sample corresponding to a same region and same pixels on the sample; a deflection device configured to emit the electron beam on a position on the sample corresponding to the same region and the same pixels on the sample, on the basis of the scanning signal generated by the scanning signal generation unit; a detection and amplification unit configured to detect and amplify a signal from the position on the sample corresponding to the same region and the same pixels on the sample, on which the electron beam was emitted by being deflected by the deflection device; and an image generation unit configured to generate an image from when the position on the sample corresponding to the same region and the same pixels on the sample is irradiated, on the basis of the signal detected and amplified by the detection and amplification unit.

A scanning transmission electron microscope is adapted to acquire high quality precession electron diffraction (PED) patterns by means of separated scanning deflectors and precession deflectors. Magnetic or electrostatic deflectors may be used for scanning and for precession. This enables independent optimization of parameters for each deflection system to achieve a broad operating range simultaneously for both deflection systems.

Methods, apparatuses, systems and software for ion beam milling or machining are disclosed. The apparatus includes a specimen holder, a table, one or more ion sources, rotatable ion optics, and an imaging device. The specimen holder is configured to hold a specimen in a stationary position during milling or machining. The table is configured to change the stationary position of the specimen holder in any of three orthogonal linear directions and an angular direction. The rotatable ion optics are configured to emit an ion beam towards a predetermined location on the specimen from any of the one or more ion sources at any angle around an axis that is orthogonal to a horizontal surface of the table when the angular direction of the table is 0. The imaging device is configured to generate an image of the specimen including the predetermined location, thereby enabling real-time monitoring of the milling or machining process.

Methods, apparatuses, systems and software for ion beam milling or machining are disclosed. The apparatus includes a specimen holder, a table, one or more ion sources, rotatable ion optics, and an imaging device. The specimen holder is configured to hold a specimen in a stationary position during milling or machining. The table is configured to change the stationary position of the specimen holder in any of three orthogonal linear directions and an angular direction. The rotatable ion optics are configured to emit an ion beam towards a predetermined location on the specimen from any of the one or more ion sources at any angle around an axis that is orthogonal to a horizontal surface of the table when the angular direction of the table is 0. The imaging device is configured to generate an image of the specimen including the predetermined location, thereby enabling real-time monitoring of the milling or machining process.

An electron beam apparatus addresses blanking issues resulting from sinking high-power heat onto an aperture diaphragm by evenly spreading heat on the aperture diaphragm. The apparatus can include an aperture diaphragm and a deflector that deflects the electron beam on the aperture diaphragm. The electron beam is directed at the aperture diaphragm in a pattern around the aperture. The pattern may be a circle, square, or polygon. The pattern also may include a variable locus relative to the aperture.