A plasma processing apparatus includes: a processing container in which a stage is accommodated and including an opening formed above the stage; a lid member for sealing the opening and including: at least one through-hole formed in a region facing the stage and in which a radiation part for radiating microwaves is arranged; a protruded portion formed on a first surface facing an interior of the processing container to protrude toward the interior of the processing container along an edge of the opening; a flow path formed inside the protruded portion; gas holes formed on the first surface to communicate with the flow path; and a supply port formed on a second surface facing an exterior of the processing container to communicate with the flow path; and a remote plasma unit connected to the supply port and for plasmarizing a cleaning gas and supply the same to the supply port.

The present disclosure provides an integrated feedthrough for high voltage cables, which belongs to the field of compact neutron generators and comprises a glue filling device composed of an upper clamping cover plate, a lower clamping cover plate, a high voltage joint, a compression collar and a compression nut, and a feedthrough composed of a feeder pillar, a high voltage joint, a high pressure sealing plug, an insulating glue, a high voltage cable, a compression collar, a compression nut, a flange, a seal ring, threaded rods, a pressing plate and nuts. According to the present disclosure, the high voltage joint and the high voltage cable are sealed with an insulating glue through a glue filling device, so as to realize insulation treatment of the high voltage cable fed into vacuum.

A fluoroelastomer is formed by polymerizing a reaction mixture that comprises vinyl-functionalized silica cages, tetrafluoroethylene, a perfluoroalkyl vinyl ether, a curative, and a polymerization initiator. The fluoroelastomer has excellent chemical resistance and thermal resistance, and is suitable for use in plasma treatment systems in sealing applications. The fluoroelastomer has reduced particle formation as erosion occurs over time.

A processing tool for charged particle processing is described herein. The processing tool has a vacuum chamber, a first support member disposed in an interior of the vacuum chamber, the first support member having a plurality of openings to accept a modular charged particle device through each opening, a second support member disposed in the interior of the vacuum chamber in juxtaposition with the first support member, first and second electrical couplings adjacent to the first and second support members, respectively for connecting to the charged particle devices upon inserting through the respective opening for delivering power and control signals to the modular charged particle devices. Processing systems and methods using such processing tools are also described herein.

A wall member body is provided in a circumferential direction of a processing container, and provided with a first cavity formed along the circumferential direction inside. A pipe member is disposed in the first cavity, formed of a member having lower thermal conductivity than the wall member body, provided with a second cavity formed to flow a cooling gas inside, and provided with one or more holes formed to cause the first cavity and the second cavity to communicate with each other.

Detector modules, systems and methods for detecting signal beams are disclosed using a detector module and a support comprising a feedthrough. Furthermore, apparatuses, systems, and methods for sealing a vacuum system configured to provide an atmospheric environment and a vacuum chamber environment are disclosed. In some embodiments, a printed circuit board (PCB) comprising a first side for exposing to the atmospheric environment and a second side for exposing to the vacuum chamber environment and for covering an aperture in the vacuum chamber environment, wherein the second side is opposite to the first side. The apparatuses, systems, and methods may include a rigid body on the first side of the PCB and a device connected to the second side of the PCB and positioned on a portion of the PCB that covers the aperture. The PCB may be configured to provide an interface between the device and the rigid body.

Systems/techniques are provided for facilitating vacuum simulation for charged-particle microscopy grid receptacles. In various embodiments, an apparatus can comprise a positioning mechanism configured to be coupled to a vacuum chamber of a charged-particle microscope. In various aspects, the apparatus can comprise an adjustable force applicator coupled to the positioning mechanism and configured to simulate a vacuum for a microscopy grid receptacle located on an inner surface of a load-lock door of the vacuum chamber by mechanically pressing against an outer surface of the load-lock door.

A corrosion-resistant component configured for use with a semiconductor processing reactor, the corrosion-resistant component comprising: a) a ceramic insulating substrate; and, b) a white corrosion-resistant non-porous outer layer associated with the ceramic insulating substrate, the white corrosion-resistant non-porous outer layer having a thickness of at least 50 m, a porosity of at most 1%, and a composition comprising at least 15% by weight of a rare earth compound based on total weight of the corrosion-resistant non-porous layer; and, c) an L* value of at least 90 as measured on a planar surface of the white corrosion-resistant non-porous outer layer. Methods of making are also disclosed.

Detector modules, systems and methods for detecting signal beams are disclosed using a detector module and a support comprising a feedthrough.

Furthermore, apparatuses, systems, and methods for sealing a vacuum system configured to provide an atmospheric environment and a vacuum chamber environment are disclosed. In some embodiments, a printed circuit board (PCB) comprising a first side for exposing to the atmospheric environment and a second side for exposing to the vacuum chamber environment and for covering an aperture in the vacuum chamber environment, wherein the second side is opposite to the first side. The apparatuses, systems, and methods may include a rigid body on the first side of the PCB and a device connected to the second side of the PCB and positioned on a portion of the PCB that covers the aperture. The PCB may be configured to provide an interface between the device and the rigid body.