H01J2237/216

METHOD FOR OPERATING A PARTICLE BEAM MICROSCOPE
20220246389 · 2022-08-04 ·

A method for operating a particle beam microscopy system includes recording a first particle-microscopic image at a given first focus and varying the excitations of the first deflection device within a given first range. The method also includes changing the focus to a second focus, and determining a second range of excitations of the first deflection device on the basis of the first range, the first excitation, the second excitation and a machine parameter determined in advance. The method further includes recording a second particle-microscopic image at the second focus and varying the excitations of the first deflection device within the determined second range. The second range of excitations is determined so that a region of the object represented in the second particle-microscopic image was also represented in the first particle-microscopic image.

Method for focusing an electron beam on a wafer having a transparent substrate
11378531 · 2022-07-05 · ·

A method, a non-transitory computer readable medium and a system for focusing an electron beam. The method may include focusing the electron beam on at least one evaluated area of a wafer, based on a height parameter of each one of the at least one evaluated area. The wafer includes a transparent substrate. The height parameter of each one of the at least one evaluated area is determined based on detection signals generated as a result of an illumination of one or more height-measured areas of the wafer with a beam of photons. The illumination occurs while one or more supported areas of the wafer contact one or more supporting elements of a chuck, and while each one of the one or more height-measured areas are spaced apart from the chuck by a distance that exceeds a depth of field of the optics related to the beam of photons.

INSPECTION APPARATUS AND METHOD

An inspection apparatus for adjusting a working height for a substrate for multiple target heights is disclosed. The inspection apparatus includes a radiation source configured to provide a radiation beam and a beam splitter configured to split the radiation beam into multiple beamlets that each reflect off a substrate. Each beamlet contains light of multiple wavelengths. The inspection apparatus includes multiple light reflecting components, wherein each light reflecting component is associated with one of the beamlets reflecting off the substrate and is configured to support a different target height for the substrate by detecting a height or a levelness of the substrate based on the beamlet reflecting off the substrate.

Inspection device

An inspection device includes a charged particle optical system that includes a charged particle beam source emitting a charged particle beam and plural lenses focusing the charged particle beam on a sample, a detector that detects secondary charged particles emitted by an interaction of the charged particle beam and the sample, and a calculation unit that executes auto-focusing at a time a field of view of the charged particle optical system moves over plural inspection spots, the calculation unit irradiates the charged particle beam to the sample under an optical condition that is obtained by introducing astigmatism of a predetermined specification to an optical condition that is for observing a pattern by the charged particle optical system, and executes the auto-focusing using an image formed from a signal outputted by the detector in detecting the secondary charged particles.

Method for image adjustment and charged particle beam system

There are provided: a method for image adjustment using a charged particle beam device, and a charged particle beam system, capable of appropriately adjusting a contrast and brightness as well as a focus for a measurement region present in a deep portion of a sample even when a depth of the measurement region is unknown. A method for image adjustment performed by a computer system controlling a charged particle beam device includes: by the computer system, specifying a measurement region from a captured image of a sample; performing centering processing based on the specified measurement region; extracting the measurement region in a field of view that has undergone the centering processing or the image that has undergone the centering processing; adjusting a contrast and brightness for the extracted measurement region; and adjusting a focus for the measurement region in which the contrast and brightness have been adjusted.

CHARGED PARTICLE BEAM ADJUSTMENT METHOD, CHARGED PARTICLE BEAM DRAWING METHOD, AND CHARGED PARTICLE BEAM IRRADIATION APPARATUS
20220068591 · 2022-03-03 · ·

A charged particle beam adjustment method includes scanning, with a charged particle beam an emission current of which is set to a first adjustment value smaller than a target value, an aperture substrate including a hole disposed to be a focus position of the charged particle beam using each of lens values in an electron lens and calculating first resolution, calculating a first function of lens values and the first resolution and calculating a lens value range, scanning, with the charged particle beam the emission current of which is set to a second adjustment value, the aperture substrate using each of lens values set to avoid the lens value range and calculating second resolution, calculating a second function of lens values and the second resolution and estimating a lens value at a just focus, and adjusting the electron lens to the lens value at the just focus.

Scanning electron microscope
11133148 · 2021-09-28 · ·

When a high-performance retarding voltage applying power supply cannot be employed in terms of costs or device miniaturization, it is difficult to sufficiently adjust focus in a high acceleration region within a range of changing an applied voltage, and identify a point at which a focus evaluation value is maximum. To address the above problems, the invention is directed to a scanning electron microscope including: an objective lens configured to converge an electron beam emitted from an electron source; a current source configured to supply an excitation current to the objective lens; a negative-voltage applying power supply configured to form a decelerating electric field of the electron beam on a sample; a detector configured to detect charged particles generated when the electron beam is emitted to the sample; and a control device configured to calculate a focus evaluation value from an image formed according to an output of the detector. The control device calculates a focus evaluation value when an applied voltage is changed, determines whether to increase or decrease an excitation current according to an increase or a decrease of the focus evaluation value, and supplies the excitation current based on a result of the determination.

METHOD OF AUTOMATICALLY FOCUSING A CHARGED PARTICLE BEAM ON A SURFACE REGION OF A SAMPLE, METHOD OF CALCULATING A CONVERGING SET OF SHARPNESS VALUES OF IMAGES OF A CHARGED PARTICLE BEAM DEVICE AND CHARGED PARTICLE BEAM DEVICE FOR IMAGING A SAMPLE

A method of automatically focusing a charged particle beam on a surface region of a sample is provided. The method includes acquiring a plurality of images for a corresponding plurality of focusing strength values; calculating a plurality of sharpness values based on the plurality of images, the plurality of sharpness values are calculated with a sharpness function provided as a sum in a frequency space based on the plurality of images; and determining subsequent focusing strength values of the plurality of focusing strength values with a golden ratio search algorithm based one the calculated sharpness values.

Height Measurement Device
20210254964 · 2021-08-19 ·

The purpose of the present invention is to provide a height measurement device with which, even when the height of a sample surface varies considerably, it is possible, with a relatively simple configuration, to perform height measurement with high accuracy at various heights. In order to achieve the abovementioned purpose, proposed is an optical height measurement device characterized by being provided with: a stage for retaining a sample; a stage driving unit for adjusting the stage at different heights; a projection optical system for projecting light onto the sample; a detection optical system for receiving light reflected from the sample; and a processing unit for measuring the height of the sample on the basis of a signal outputted from the detection optical system, wherein the projection optical system is provided with a light source that emits light, and an optical path dividing element for branching the optical path of the light emitted from the light source, and the detection optical system is provided with a sensor for receiving light reflected from the sample, and an element for adjusting the light path of the light reflected from the sample in the direction of the sensor prior to reception of the light by the sensor.

ELECTRONIC MICROSCOPE DEVICE

In the present invention, an electro-optical condition generation unit includes: a condition setting unit that sets, as a plurality of electro-optical conditions, a plurality of electro-optical conditions in which the combinations of the aperture angle and the focal-point height for an electron beam are different; an index calculating unit that determines a measurement-performance index in the electro-optical conditions set by the condition setting unit; and a condition deriving unit that derives an electro-optical condition, including an aperture angle and a focal-point height, so that the measurement-performance index determined by the index calculating unit becomes a prescribed value.