H01K1/16

ARRANGEMENT AND METHOD FOR MECHANICALLY AND ELECTRICALLY CONTACTING A GLOW WIRE OF A THERMAL RADIATION SOURCE MADE OF REFRACTORY METAL FOR SEMICONDUCTOR AND MICROSYSTEM TECHNOLOGY
20230278132 · 2023-09-07 · ·

The invention discloses an arrangement for mechanically and electrically contacting a glow wire of a thermal radiation source, comprising a glow wire made of refractory metal having at least one flat connection surface to be contacted, a contact surface on which the glow wire is contacted, and a contacting means which connects the glow wire to the contact surface. The invention also relates to a method for producing the contact according to the invention. The problem addressed by the invention, of providing a reliable and enduringly stable mechanical and electrical contact of glow wires made of refractory metals, is solved in that the flat connection surface has at least two perforations and/or at a circumferential edge of the connection surface of the glow wire at least two recesses are formed, wherein the contacting means is integrally connected to the contact surface at the location of the perforations and/or recesses and forms both an electrical and a mechanical connection to the glow wire at the location of the perforations and/or recesses by means of a flange-like design of the contacting means above the connection surface of the glow wire.

ARRANGEMENT AND METHOD FOR MECHANICALLY AND ELECTRICALLY CONTACTING A GLOW WIRE OF A THERMAL RADIATION SOURCE MADE OF REFRACTORY METAL FOR SEMICONDUCTOR AND MICROSYSTEM TECHNOLOGY
20230278132 · 2023-09-07 · ·

The invention discloses an arrangement for mechanically and electrically contacting a glow wire of a thermal radiation source, comprising a glow wire made of refractory metal having at least one flat connection surface to be contacted, a contact surface on which the glow wire is contacted, and a contacting means which connects the glow wire to the contact surface. The invention also relates to a method for producing the contact according to the invention. The problem addressed by the invention, of providing a reliable and enduringly stable mechanical and electrical contact of glow wires made of refractory metals, is solved in that the flat connection surface has at least two perforations and/or at a circumferential edge of the connection surface of the glow wire at least two recesses are formed, wherein the contacting means is integrally connected to the contact surface at the location of the perforations and/or recesses and forms both an electrical and a mechanical connection to the glow wire at the location of the perforations and/or recesses by means of a flange-like design of the contacting means above the connection surface of the glow wire.

Simplified lamp design
11133173 · 2021-09-28 · ·

Embodiments of the present invention generally relate to simplified, high voltage, tungsten halogen lamps for use as source of heat radiation in a rapid thermal processing (RTP) chamber or other lamp heated thermal processing chambers. Embodiments include a lamp design that includes an external fuse while reducing the number of part and expense of prior art lamps. In addition, embodiments of the lamps described herein provide sufficient rigidity to handle compressive forces of inserting the lamps into a heating assembly base, while maintaining a simplified fuse design.

Simplified lamp design
11133173 · 2021-09-28 · ·

Embodiments of the present invention generally relate to simplified, high voltage, tungsten halogen lamps for use as source of heat radiation in a rapid thermal processing (RTP) chamber or other lamp heated thermal processing chambers. Embodiments include a lamp design that includes an external fuse while reducing the number of part and expense of prior art lamps. In addition, embodiments of the lamps described herein provide sufficient rigidity to handle compressive forces of inserting the lamps into a heating assembly base, while maintaining a simplified fuse design.

Component carrier with integrated strain gauge

A component carrier for carrying an electronic component on and/or in the component carrier, wherein the component carrier includes an interconnected stack composed of a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures, wherein at least part of at least one of the electrically conductive layer structures is configured as at least part of an integrated strain gauge configured for detecting strain exerted on at least part of the component carrier.

APPARATUSES COMPRISING FILMS WITH FREE-STANDING REGION
20210171341 · 2021-06-10 · ·

An apparatus, comprising a film (103) comprising a network of conductive and/or semi-conductive high aspect ratio molecular structures is presented. The apparatus also comprises a frame (102) arranged to support the film (103) at least at least two support positions so that a free-standing region (101) of the film (103) extends between the at least two support positions. The two or more electrical contact areas electrically coupled to the film (103), and these electrical contact areas are arranged to pass electric charge across the free-standing region (101) of the film (103) at a current between 0.01 and 10 amperes.

LED LIGHT BULB APPARATUS AND LED LIGHT APPARATUS
20210090875 · 2021-03-25 ·

A conductive structure comprising: a plurality of conductive devices; a first conductive spring sheet, comprising a first connecting point; and a second conductive spring sheet, comprising a second connecting point. Each of the conductive devices comprises a first conductive end and a second conductive end. The second conductive end is connected to the second connecting point, and the first conductive end is connected to the first connecting point corresponding to the second connecting point to which the second conductive end is connected.

LED LIGHT BULB APPARATUS AND LED LIGHT APPARATUS
20210090875 · 2021-03-25 ·

A conductive structure comprising: a plurality of conductive devices; a first conductive spring sheet, comprising a first connecting point; and a second conductive spring sheet, comprising a second connecting point. Each of the conductive devices comprises a first conductive end and a second conductive end. The second conductive end is connected to the second connecting point, and the first conductive end is connected to the first connecting point corresponding to the second connecting point to which the second conductive end is connected.

Threadless magnetic lightbulb and socket system
10941922 · 2021-03-09 ·

A threadless magnetic lightbulb and socket system includes a lightbulb base having a neck with a threadless exterior surface and a socket having a receptacle with a threadless interior surface configured to receive the neck. A first magnet is positioned at a tip of the lightbulb base and a second magnet is positioned in the receptacle of the socket such that the first magnet and the second magnet are configured to attract each other to magnetically retain the lightbulb within the socket. A threadless magnetic lightbulb includes a lightbulb base having a neck with a threadless exterior surface and a magnet positioned at a tip of the lightbulb base. A threadless magnetic socket includes a socket having a receptacle with a threadless interior surface configured to receive a lightbulb base and a magnet positioned in the receptacle of the socket.

Inductor built-in substrate
11856699 · 2023-12-26 · ·

An inductor built-in substrate includes a core substrate having openings and first through holes formed therein, a magnetic resin filling the openings and having second through holes formed therein, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes an electroless plating film and an electrolytic plating film, and second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes an electroless plating film and an electrolytic plating film. The first through-hole conductors and the second through-hole conductors are formed such that a thickness of the electroless plating film in the first through-hole conductors is larger than a thickness of the electroless plating film in the second through-hole conductors.