A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substrate susceptor and the substrate holder.

A method of heat-treating a silicon wafer using a lateral heat treatment furnace that can improve the product yield by restricting reduction in the lifetime value of silicon wafers placed in the vicinity of dummy blocks placed to equalize the temperature of the region where the wafers are placed. In a method of heat-treating a silicon wafer using a lateral heat treatment furnace, a boat is placed in a hollow cylindrical furnace core tube, and on the boat, at least one of a first additional block between a first dummy block and a wafer group and a second additional block between a second dummy block and the wafer group is placed.

A substrate cleaning apparatus includes a first processing unit configured to supply a first processing liquid for removing a residue adhering to a substrate onto the substrate on which a metal film is exposed at a recess of a pattern; a second processing unit configured to supply, onto the substrate, a second processing liquid for forming a protective film insoluble to the first processing liquid; a third processing unit configured to supply, onto the substrate, a third processing liquid for dissolving the protective film; and a control unit. The control unit performs forming the protective film on the metal film in a state that an upper portion of the pattern is exposed from the protective film; removing the residue adhering to the upper portion of the pattern after the forming of the protective film; and removing the protective film from the substrate after the removing of the residue.

A substrate cleaning apparatus includes a first processing unit configured to supply a first processing liquid for removing a residue adhering to a substrate onto the substrate on which a metal film is exposed at a recess of a pattern; a second processing unit configured to supply, onto the substrate, a second processing liquid for forming a protective film insoluble to the first processing liquid; a third processing unit configured to supply, onto the substrate, a third processing liquid for dissolving the protective film; and a control unit. The control unit performs forming the protective film on the metal film in a state that an upper portion of the pattern is exposed from the protective film; removing the residue adhering to the upper portion of the pattern after the forming of the protective film; and removing the protective film from the substrate after the removing of the residue.

A substrate container including a plate, a shell, a connector, and a seal, where the connector is threaded and secured via a nut, and the seal contacts each of the shell, plate, and connector. The plate has a recess accommodating an end of the connector and the nut. Field-serviceable, removable purge modules including check valves may be used with the substrate container, and may be secured to the substrate container in the recess in the plate. Filters may be secured to the connector or included in the purge modules. These filters may have diameters larger than an internal diameter of the connector.

A dummy panel transport apparatus includes: an adsorption unit including an injection hole into which compressed air is injected, a discharge hole to which the compressed air is discharged, and a suction hole in which an external air is sucked; an adsorption unit holder supporting the adsorption unit, and movable in a first direction and a direction opposite to the first direction; a plate disposed under the adsorption unit holder; a plate holder supporting the plate, and movable in a second direction crossing the first direction and in a direction opposite to the second direction; a dummy storage part disposed under the plate; a brush unit disposed on the plate; and a brush unit holder supporting the brush unit, and movable in the first direction, in the direction opposite to the first direction, in the second direction, and the direction opposite to the second direction.

A wafer separating apparatus is provided which includes a wafer supporting member having an upper surface on which a bonded wafer formed of two wafers bonded with each other is placed; an arm portion arranged outside of the wafer supporting member, the arm portion being movable closer to and away from a bonded portion of the bonded portion of the bonded wafer supported by the supporting portion; and an inflating portion provided in an distal end portion of the arm portion, the inflating portion being inflatable in a direction intersecting the upper surface of the wafer supporting member.

A plasma processing apparatus includes: a processing container having a cylindrical shape; a pair of plasma electrodes arranged along the longitudinal direction of the processing container while facing each other; and a radio-frequency power supply configured to supply a radio-frequency power to the pair of plasma electrodes. In the pair of plasma electrodes, an inter-electrode distance at a position distant from a power feed position to which the radio-frequency power is supplied is longer than an inter-electrode distance at the power feed position.

A stocker for holding a plurality of reticle pods is provided. Each of the reticle pods is configured to accommodate a reticle assembly. The reticle assembly includes a reticle and a pellicle covering the reticle. The stocker includes a main frame and an electrostatic generator. The main frame has an inner space and at least one pod support disposed in the inner space. The pod support divides the inner space into a plurality of chambers configured to respectively accommodate the plurality of reticle pods. The electrostatic generator is coupled to the reticle assembly and configured to generate static electricity to the reticle assembly. The static electricity alternates between positive electricity and negative electricity.

The present disclosure relates to an in-situ temperature control platform, including an independent sample holder, a sample holder fixing cartridge, a customized sample stage and an anode contact pin. The independent sample holder includes a sample loading spot and a sample holder grip. The sample holder fixing cartridge includes a fixing cartridge body, the fixing cartridge body is provided with a sample holder slot, the bottom surface of the sample holder slot is provided with a heating element slot, and the sample holder slot is aligned with the sample loading spot. The bottom surface of the heating element slot is provided with a heating element fixing pinhole. The customized sample stage includes a sample stage body, the sample stage body is provided with a heating element support, and the heating element support is provided with a heating element.