A unit cell alignment apparatus that includes a base member, on the upper surface of which unit cells constituting an electrode assembly are stacked parallel thereto, a first guide member located at one side of the base member, the first guide member being disposed so as to be perpendicular to the upper surface of the base member, a second guide member located at the base member, the second guide member being disposed so as to be perpendicular to the upper surface of the base member while being at right angles to the first guide member, and an inclination adjustment member configured to adjust the inclination of the base member.

A unit cell alignment apparatus that includes a base member, on the upper surface of which unit cells constituting an electrode assembly are stacked parallel thereto, a first guide member located at one side of the base member, the first guide member being disposed so as to be perpendicular to the upper surface of the base member, a second guide member located at the base member, the second guide member being disposed so as to be perpendicular to the upper surface of the base member while being at right angles to the first guide member, and an inclination adjustment member configured to adjust the inclination of the base member.

A laser processing machine includes a condenser and a water pillar forming unit. The condenser condenses a laser beam emitted from a laser oscillator and irradiates it to a workpiece held on a chuck table. The water pillar forming unit is disposed on a lower end of the condenser and is configured to form a thread-shaped water pillar on a front side of the workpiece. The laser oscillator includes a first laser oscillator, which emits a first laser beam having a short pulse width, and a second laser oscillator, which emits a second laser beam having a long pulse width. After the laser beams emitted from the first and second laser oscillators have transmitted through the thread-shaped water pillar formed by the water pillar forming unit and have been irradiated to the workpiece, a plasma occurred in the water pillar forming unit applies processing to the workpiece.

An apparatus includes a substrate holder, a first actuator to rotate the substrate holder, a second actuator to move the substrate holder linearly, a first sensor to generate one or more first measurements or images of the substrate, a second sensor to generate one or more second measurements of target positions on the substrate, and a processing device. The processing device estimates a position of the substrate on the substrate holder and causes the first actuator to rotate the substrate holder about a first axis. The rotation causes an offset between a field of view of the second sensor and a target position on the substrate due to the substrate not being centered on the substrate holder. The processing device causes the second actuator to move the substrate holder linearly along a second axis to correct the offset. The processing device determines a profile across a surface of the substrate based on the one or more second measurements of the target positions.

A vapor deposition device is provided that can correct a positional offset of a carrier in a rotation direction relative to a wafer when the vapor deposition device is viewed in a plan view. The vapor deposition device includes a load-lock chamber provided with a holder for supporting the carrier, and the carrier and the holder are provided with a correction mechanism that corrects a position of the carrier in a rotation direction when the vapor deposition device is viewed in a plan view.

A vapor deposition device is provided that can correct a positional offset of a carrier in a rotation direction relative to a wafer when the vapor deposition device is viewed in a plan view. The vapor deposition device includes a load-lock chamber provided with a holder for supporting the carrier, and the carrier and the holder are provided with a correction mechanism that corrects a position of the carrier in a rotation direction when the vapor deposition device is viewed in a plan view.

The present application provides a unified pod and a material conveying system. The unified pod includes an accommodating box and a gas storage box, wherein gas inlets and gas outlets are formed on the accommodating box, the gas inlets of the accommodating box are connected with the gas storage box; a first sensor for detecting a pressure value in the accommodating box is further arranged in the accommodating box.

The present application provides a unified pod and a material conveying system. The unified pod includes an accommodating box and a gas storage box, wherein gas inlets and gas outlets are formed on the accommodating box, the gas inlets of the accommodating box are connected with the gas storage box; a first sensor for detecting a pressure value in the accommodating box is further arranged in the accommodating box.

A method for transferring objects and a transfer apparatus using the same are provided. The method includes the following steps: controlling, during a first period, the ejector at an ejecting working position to perform an ejecting process along with a first direction, to transfer the object from the first substrate to the second substrate; controlling, during a second period, the ejector to move to an ejecting standby position along with a second direction which is non-parallel to the first direction, to expose at least one of the object on the first substrate to a detection range of an image capturing device; detecting the position of the object in the detection range to obtain calibration information; and adjusting the position of the first substrate according to the calibration information.

A method of scanning a substrate includes immobilizing a substrate on a substrate holder within a processing chamber and performing a pass of a parallel raster pattern by synchronously driving a first rotary drive and a second rotary drive to move the substrate relative to a processing apparatus focused on a localized spot on the substrate, the first rotary drive being coupled to a proximal end of a pendulum arm and the second rotary drive being mounted at a distal end of the pendulum arm and to the substrate holder. Driving the first rotary drive during the pass includes moving the pendulum arm in a first arc motion for a first portion of the pass while the localized spot is on the substrate, and then moving the pendulum arm in an opposite second arc motion for a second portion of the pass while the localized spot is on the substrate.