A thermoelectric element-containing package according to one aspect of the present disclosure includes a thermoelectric conversion module including: a first substrate having first and second main surfaces; a second substrate having third and fourth main surfaces; and a plurality of thermoelectric elements that are sandwiched between the first and second substrates and arranged along the second main surface and the third main surface. The thermoelectric element-containing package further includes: a frame joined to the first and second substrates so as to form a hermetically sealed space surrounding the plurality of thermoelectric elements and disposed between the first substrate and the second substrate; and a placement member that is disposed on the first main surface of the first substrate or the fourth main surface of the second substrate and to which an additional device is to be connected.

The present invention discloses a thermal thick film integrated circuit comprising: a metal substrate and a vapor chamber which arranged in layers, and a thermoelectric element sandwiched between the metal substrate and the vapor chamber, wherein an integrated circuit is arranged on a surface of the metal substrate proximal to the vapor chamber, and the thermoelectric element is connected to a power supply. The thermal thick film integrated circuit has fewer parts, is simpler and more reliable. The thermal thick film integrated circuit adopts an integrated and compact design, which occupies a small space, has high in reliability, and is safe due to fewer use of wires. For large surface area, the temperature is evenly and quickly distributed during cooling, and it has high heat dissipation performance, high efficiency, convenience and easy to develop and use.

The present invention discloses a thermal thick film integrated circuit comprising: a metal substrate and a vapor chamber which arranged in layers, and a thermoelectric element sandwiched between the metal substrate and the vapor chamber, wherein an integrated circuit is arranged on a surface of the metal substrate proximal to the vapor chamber, and the thermoelectric element is connected to a power supply. The thermal thick film integrated circuit has fewer parts, is simpler and more reliable. The thermal thick film integrated circuit adopts an integrated and compact design, which occupies a small space, has high in reliability, and is safe due to fewer use of wires. For large surface area, the temperature is evenly and quickly distributed during cooling, and it has high heat dissipation performance, high efficiency, convenience and easy to develop and use.

An optical sub-assembly includes a diode submount structure, a diode mounted to the diode submount, and a thermoelectric cooler (TEC). The TEC is in thermal contact with the diode, and the diode is positioned between the diode submount structure and the TEC.

Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, the electronic package comprises a base substrate. The base substrate may have a plurality of through substrate vias. In an embodiment, a first die is over the base substrate. In an embodiment a first cavity is disposed into the base substrate. In an embodiment, the first cavity is at least partially within a footprint of the first die. In an embodiment, a first component is in the first cavity.

A thermal chamber includes a cavity that is enclosed by sides and one or more ports that expose the cavity within the thermal chamber. Each of the one or more ports is configured to receive a temperature control component having a solid physical structure and configured to transfer thermal energy to and from an electrical device exposed via the cavity. The thermal chamber includes a bottom side open area of the thermal chamber located below the one or more ports. The bottom side open area is configured to allow the temperature control component to contact the electrical device that is exposed via the bottom side open area.

Provided is a thermoelectric conversion module in which heat dissipation is further improved with a simple structure. The thermoelectric conversion module is a thermoelectric conversion module including a first electrode, a P-type thermoelectric element layer and an N-type thermoelectric element layer, and a second electrode disposed opposite the first electrode. The thermoelectric conversion module includes a plurality of PN-junction pairs in which the P-type thermoelectric element layer and the N-type thermoelectric element layer are PN-joined through the first electrode or the second electrode, the plurality of PN-junction pairs being electrically connected in series alternately by the first electrode and the second electrode. An area of the second electrode is larger than an area of the first electrode.

Technologies for thermoelectric enhanced cooling on an integrated circuit die are disclosed. In the illustrative embodiment, one or more components are created on a top side of an integrated circuit die, such as a power amplifier, logic circuitry, etc. The one or more components, in use, generate heat that needs to be carried away from the components. A thermoelectric cooler can be created on a back side of the die in order to facilitate removal of heat from the component. In some embodiments, additional structures such as vias filled with high-thermal-conductivity material may be used to further improve the removal of heat from the component.

Technologies for thermoelectric enhanced cooling on an integrated circuit die are disclosed. In the illustrative embodiment, one or more components are created on a top side of an integrated circuit die, such as a power amplifier, logic circuitry, etc. The one or more components, in use, generate heat that needs to be carried away from the components. A thermoelectric cooler can be created on a back side of the die in order to facilitate removal of heat from the component. In some embodiments, additional structures such as vias filled with high-thermal-conductivity material may be used to further improve the removal of heat from the component.

A controller according to an exemplary aspect of the present disclosure includes, among other things, a cold plate and at least one electronic component mounted to the cold plate by an intermediate thermoelectric cooler.