An immersion system includes an immersion tank configured to store a coolant liquid and contain an electronic device, a heat exchanger coupled to the immersion tank through first piping, a first pump provided in the first piping and configured to circulate the coolant liquid between the immersion tank and the heat exchanger, a tank coupled to the immersion tank through second piping, a second pump provided in the second piping and configured to move the coolant liquid between the immersion tank and the tank, a level sensor provided in the immersion tank and configured to detect a liquid level in the immersion tank, and a controller configured to control the second pump in accordance with a detection signal of the level sensor.

A rack system which includes a rack frame and at least one reservoir for housing at least one rack-mounted immersion case is disclosed. The rack frame is configured to slidably accommodate racking and de-racking operations of the at least one rack-mounted immersion case. The at least one collapsible reservoir, which is configured to store a fluid therein, is fluidly connected to the at least one rack-mounted immersion case, has a first portion fixedly connected to the at least one rack-mounted immersion case, and a second portion fixedly connected to the rack frame. The at least one collapsible reservoir is configured to respectively collapse and expand along a racked space and a de-racked space, the racked and de-racked spaces being defined between a backplane of the at least one rack-mounted immersion case and a backplane of the rack frame, the de-racked space being larger than the racked space.

An electronics cooling system includes a printed circuit board (PCB) assembly having a heat generating component connected to a base. A plurality of thermally conductive microtubes are connected to the PCB assembly with a first spatial density. The plurality of thermally conductive microtubes are connected to a heat plate of a cooling system with a second spatial density to evenly spread the heat flux of the PCB assembly over the heat plate.

The present invention provides an implantable medical device (10), such as a neural implant, a neural stimulator, a pacemaker, a defibrillator, a glucometer or a drug pump. The device (10) includes a battery (B) providing a supply of electric power for operation of the device, and a system (1) for thermoelectric charging or re-charging of the battery (B). The system (1) includes a field-sensitive component (2) configured and/or adapted for transducing a field of magnetic energy, microwave energy, ultrasound energy, and/or X-ray energy into heat; and a thermoelectric module (4) arranged and/or connected to interface with the field-sensitive component (2) for generating an electric potential from the heat transduced by the field-sensitive component (2). The thermoelectric module (4) is arranged in electrical connection with the battery (B) for applying the electric potential to the battery (B).

The present invention provides an implantable medical device (10), such as a neural implant, a neural stimulator, a pacemaker, a defibrillator, a glucometer or a drug pump. The device (10) includes a battery (B) providing a supply of electric power for operation of the device, and a system (1) for thermoelectric charging or re-charging of the battery (B). The system (1) includes a field-sensitive component (2) configured and/or adapted for transducing a field of magnetic energy, microwave energy, ultrasound energy, and/or X-ray energy into heat; and a thermoelectric module (4) arranged and/or connected to interface with the field-sensitive component (2) for generating an electric potential from the heat transduced by the field-sensitive component (2). The thermoelectric module (4) is arranged in electrical connection with the battery (B) for applying the electric potential to the battery (B).

An electronic device includes electronic components and an epoxy resin portion which seals the electronic components. The electronic device is disposed in a refrigerant which cools the electronic components. A first layer having a three-dimensional crosslinking structure is formed on a surface or inside of the epoxy resin portion. The first layer is formed such that a length calculated by cube root of an average free volume in the three-dimensional crosslinking structure of the first layer is shorter than a length of the longest side of molecules forming the refrigerant.

An electronic device includes electronic components and an epoxy resin portion which seals the electronic components. The electronic device is disposed in a refrigerant which cools the electronic components. A first layer having a three-dimensional crosslinking structure is formed on a surface or inside of the epoxy resin portion. The first layer is formed such that a length calculated by cube root of an average free volume in the three-dimensional crosslinking structure of the first layer is shorter than a length of the longest side of molecules forming the refrigerant.

Provided is a cooling system capable of improving the cooling performances of a plurality of electronic apparatuses, of making stabilization by eliminating the variance in the cooling performances and of being improved in the handling and maintainability of the electronic apparatuses. A plurality of inner partitioning walls are provided in a cooling tank having an open space defined by a bottom wall and side walls to divide the open space, and a plurality of arrayed storage sections are defined. An electronic apparatus is stored in each of the storage sections. Each of the storage sections is formed with an inflow opening and an outflow opening for the cooling liquid. The inflow opening is formed at a bottom portion or a side surface of each storage section, and the outflow opening is formed in the vicinity of the liquid level of the cooling liquid flowing through each storage section.

Provided is a cooling system capable of improving the cooling performances of a plurality of electronic apparatuses, of making stabilization by eliminating the variance in the cooling performances and of being improved in the handling and maintainability of the electronic apparatuses. A plurality of inner partitioning walls are provided in a cooling tank having an open space defined by a bottom wall and side walls to divide the open space, and a plurality of arrayed storage sections are defined. An electronic apparatus is stored in each of the storage sections. Each of the storage sections is formed with an inflow opening and an outflow opening for the cooling liquid. The inflow opening is formed at a bottom portion or a side surface of each storage section, and the outflow opening is formed in the vicinity of the liquid level of the cooling liquid flowing through each storage section.

A heat sink includes a body with an expansion chamber therein. The body is configured to receive heat from a heat source. The expansion chamber is configured to expand a working fluid from an inlet port to an outlet port of the heat sink. An immersion system includes a heat sink and a pressurizing mechanism for pressurizing the working fluid prior to the inlet port.