A bonding apparatus includes: an anisotropic conductive film (ACF) attachment unit which attaches a first ACF and a second ACF onto a display panel assembly; a compression unit which compresses a first chip-on-film (COF) on the first ACF and compresses a second COF on the second ACF;

and a buffer unit which rotates the display panel assembly, on which the first ACF and the second COF are compressed, on a plane.

A method of directly transferring a first semiconductor device die to a substrate includes loading a wafer tape into a first frame, loading a substrate into a second frame, arranging at least one of the first frame or the second frame such that a surface of the substrate is adjacent to a first side of the wafer tape, and orienting a needle to a position adjacent to a second side of the wafer tape, the needle extending in a direction toward the wafer tape. The method also includes activating a needle actuator connected to the needle to move the needle to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die.

A pressing ram having an elastic cushion element and intended for the material-bonded press-sintering connection of a first connection partner to a second connection partner of a power-electronics component. The elastic cushion element of the pressing ram is enclosed by a dimensionally stable frame, within which the cushion element and a guide part of the pressing ram are guided for linear movement such that the dimensionally stable frame lowers onto the first connection partner, or a workpiece carrier with the first connection partner arranged therein, and, following abutment against the same, the pressing ram together with the elastic cushion element is lowered onto the second connection partner and the elastic cushion exerts a pressure necessary for connecting the first connection partner to the second connection partner.

A mask-integrated surface protective tape with a release liner, containing: a base film, a temporary-adhesive layer, a release film, a mask material layer, and a release liner, in this order, wherein the release film and the release liner each have one release-treated surface, and the release-treated surfaces of the release film and the release liner each are in contact with the mask material layer, and wherein the peeling strength between the release liner and the mask material layer is smaller than the peeling strength between the release film and the mask material layer.

An apparatus including components to stack semiconductor device die.

A bonding and indexing apparatus has a first index head to move a substrate in an indexing direction from a first position to a second position and a second index head to move the substrate in an indexing direction from the second position to a third position. The first and/or second index head has a bonding element to effect a bonding process between the substrate and an element disposed against the substrate so that bonding and movement in the indexing direction is implemented simultaneously by the first index head and/or bonding and movement in the indexing direction is implemented simultaneously by the second index head.

A power electronics method and assembly produced by the method. The assembly has a substrate, having a power semiconductor element, and an adhesion layer disposed therebetween, wherein the substrate has a first surface that faces a power semiconductor element, a power semiconductor element has a third surface that faces the substrate, the adhesion layer has a second surface which, preferably across the full area, contacts the third surface and has a first consistent surface contour having a first roughness, and wherein a fourth surface of the power semiconductor element that is opposite the third surface has a second surface contour having a second roughness, said second surface contour following the first surface contour.

A switching device has a substrate and a power semiconductor component, comprising a connection device and a pressure device wherein the substrate has tracks electrically insulated from one another. The power semiconductor component is on one of the tracks with a first main surface and is conductively connected thereto. The device is embodied as a film composite having a conductive film and an insulating film that forms a first and a second main surface. The switching device is connected internally in a circuit-conforming manner by the connection device and a contact area of the connection device is connected to a first contact area of one of the tracks in a force-locking and electrically conductive manner. There is a pressure body projecting to the substrate and pressing onto a first section of the second main surface of the film composite.

An apparatus including components to stack semiconductor device die.

An attaching apparatus for chip-on-films includes: a base; a rotary table; a first driving device configured to drive the rotary table to rotate around the axis of the rotary table; a TCP side adhesive-attaching mechanism configured to attach a conductive film onto a chip-on-film on a carrier located in the TCP adhesive-attaching region; a PCB side adhesive-attaching mechanism configured to attach a conductive film onto a chip-on-film on a carrier located in the PCB adhesive-attaching region; and a pre-pressing mechanism configured to pre-press conductive films attached on a chip-on-film on a carrier located in the pre-pressing region. The rotary table is in a first operating position, a second operating position, a third operating position and a fourth operating position successively during a rotation around its axis. When the rotary table is in any one of the operating positions, there is always one carrier in each region of the base.