Passive radiative cooling structures and apparatus manufactured with such cooling structures conserve energy needs. A flexible film transparent to visible light incorporates particles at a volume percentage larger than 25% so as to absorb and emit infrared radiation at wavelengths where Earth's atmosphere is transparent. Another film transparent to visible light is thin and flexible and configured to absorb and emit infrared radiation at wavelengths where Earth's atmosphere is transparent, wherein etchings or depositions are present on one or both surfaces. A high efficiency cooling structure has an emissive layer sandwiched between a waveguide layer and a thermal conductive layer. A solar cell panel is covered by a transparent passive radiative cooling film. A container housing an active cooling unit incorporates passive radiative cooling structures on one or more exterior surfaces.

A cytometer includes an avalanche photodiode, a switching power supply, a filter, and voltage adjustment circuitry. The switching power supply includes a feedback loop. The filter is electrically connected between the switching power supply and the avalanche photodiode. The voltage adjustment circuitry adjusts a voltage on the feedback loop based at least in part on a voltage measured between the filter and the avalanche photodiode.

A cytometer includes an avalanche photodiode, a switching power supply, a filter, and voltage adjustment circuitry. The switching power supply includes a feedback loop. The filter is electrically connected between the switching power supply and the avalanche photodiode. The voltage adjustment circuitry adjusts a voltage on the feedback loop based at least in part on a voltage measured between the filter and the avalanche photodiode.

An assembly for optical to electrical power conversion including a photodiode assembly having a substrate layer and an internal side, an antireflective layer, a heterojunction buffer layer adjacent the internal side; an active area positioned adjacent the heterojunction buffer layer, a plurality of n+ electrode regions and p+ electrode regions positioned adjacent the active area, and back-contacts configured to align with the n+ and p+ electrode regions. The active area converts photons from incoming light into liberated electron hole pairs. The heterojunction buffer layer prevents electrons and holes of the liberated electron hole pairs from moving toward the substrate layer. The plurality of electrode regions are configured in an alternating pattern with gaps between each n+ and p+ electrode region. The electrode regions receive and generate electrical current from migration of the electrons and the holes, provide electrical pathways for the electrical current, and provide thermal pathways to dissipate heat.

A system is disclosed that includes an electronic package. The electronic package includes a package base couplable to a host substrate, and a package lid mechanically coupled to the package base that includes one or more transparent lid areas, configured to permit transmission of light. The electronic package further includes a thermal spreader bonded on a first side to a first side of the package lid. The thermal spreader includes one or more transparent spreader areas that are configured to allow transmission of light through the thermal spreader. The electronic package further includes one or more integrated circuits bonded to a second side of the thermal spreader that communicatively coupled to the host substrate. The electronic package further includes one or more optical paths that include at least one of the one or more transparent spreader areas configured adjacent to at least one of the transparent lid areas.

A system is disclosed that includes an electronic package. The electronic package includes a package base couplable to a host substrate, and a package lid mechanically coupled to the package base that includes one or more transparent lid areas, configured to permit transmission of light. The electronic package further includes a thermal spreader bonded on a first side to a first side of the package lid. The thermal spreader includes one or more transparent spreader areas that are configured to allow transmission of light through the thermal spreader. The electronic package further includes one or more integrated circuits bonded to a second side of the thermal spreader that communicatively coupled to the host substrate. The electronic package further includes one or more optical paths that include at least one of the one or more transparent spreader areas configured adjacent to at least one of the transparent lid areas.

An electronic component mounting substrate includes: a metal substrate including a first surface, an insulation substrate including a second surface on which a first metal layer having a frame shape is provided, and a bonding material that bonds the first surface and the first metal layer. The bonding material is located in a region that includes the first metal layer and that is surrounded by the first metal layer in a plane perspective.

An electronic component mounting substrate includes: a metal substrate including a first surface, an insulation substrate including a second surface on which a first metal layer having a frame shape is provided, and a bonding material that bonds the first surface and the first metal layer. The bonding material is located in a region that includes the first metal layer and that is surrounded by the first metal layer in a plane perspective.

A photoelectric apparatus comprises a barrel-shaped container, an optical lens and a photoelectric imaging device arranged at two ends of the container, respectively. The container is filled with a light-transmitting and heat-conductive liquid. The heat-conductive liquid contains a plurality of nanostructures and particularly includes a plurality of nanorods. When an external voltage is applied between the photoelectric imaging device and the container, the nanorods are aligned with the electric field lines created by the external voltage, and form into nanorod chains. The nanorod chains link the photoelectric imaging device and the container, thereby increase the thermal conductivity of the heat-conductive liquid, and hence improve the heat dissipation efficiency of the photoelectric apparatus.

A photoelectric apparatus comprises a barrel-shaped container, an optical lens and a photoelectric imaging device arranged at two ends of the container, respectively. The container is filled with a light-transmitting and heat-conductive liquid. The heat-conductive liquid contains a plurality of nanostructures and particularly includes a plurality of nanorods. When an external voltage is applied between the photoelectric imaging device and the container, the nanorods are aligned with the electric field lines created by the external voltage, and form into nanorod chains. The nanorod chains link the photoelectric imaging device and the container, thereby increase the thermal conductivity of the heat-conductive liquid, and hence improve the heat dissipation efficiency of the photoelectric apparatus.