An electronic device including optical sensing with a concentric architecture and methods for operation thereof is disclosed. The concentric architecture can include light detector(s) arranged in a concentric manner around light emitter(s). In some examples, at least one light emitter can be located in the center of the device, and each light detector can be located the same separation distance from the light emitter. Each light detector can be arranged such that the separation distance from the centrally located light emitter can be greater than the separation distance from another light emitter. Examples of the disclosure further include a selective transparent layer overlaying the light detector(s). The selective transparent layer can include section(s) transparent to a first wavelength range and non-transparent to a second wavelength ranges. In some examples, the selective transparent layer can further include section(s) transparent to the second wavelength range.

An electronic device including optical sensing with a concentric architecture and methods for operation thereof is disclosed. The concentric architecture can include light detector(s) arranged in a concentric manner around light emitter(s). In some examples, at least one light emitter can be located in the center of the device, and each light detector can be located the same separation distance from the light emitter. Each light detector can be arranged such that the separation distance from the centrally located light emitter can be greater than the separation distance from another light emitter. Examples of the disclosure further include a selective transparent layer overlaying the light detector(s). The selective transparent layer can include section(s) transparent to a first wavelength range and non-transparent to a second wavelength ranges. In some examples, the selective transparent layer can further include section(s) transparent to the second wavelength range.

Embodiments are directed to an electronic device having a hidden or concealable input region. In one aspect, an embodiment includes an enclosure having a wall that defines an input region having an array of microperforations. A light source may be positioned within a volume defined by the enclosure and configured to propagate light through the array of microperforations. A sensing element may be coupled with the wall and configured to detect input received within the input region. The array of microperforations are configured to be visually imperceptible when not illuminated by the light source. When illuminated by the light source, the array of microperforations may display a symbol.

An optical device includes a substrate, a light receiving component, an encapsulant, a coupling layer and a light shielding layer. The light receiving component is disposed on the substrate. The encapsulant covers the light receiving component. The coupling layer is disposed on at least a portion of the encapsulant. The light shielding layer is disposed on the coupling layer.

A light-emitting device is provided. The light-emitting device includes a first substrate. The light-emitting device also includes a second substrate including a light-shielding structure. The light-emitting device further includes a first light-emitting module and a second light-emitting module being adjacent to each other. The first light-emitting module and the second light-emitting module are disposed between the first substrate and the second substrate. The first light-emitting module and the second light-emitting module are spaced apart by a gap, and the light-shielding structure at least partially covers the gap in a top view direction of the light-emitting device.

A light-emitting device is provided. The light-emitting device includes a first substrate. The light-emitting device also includes a second substrate including a light-shielding structure. The light-emitting device further includes a first light-emitting module and a second light-emitting module being adjacent to each other. The first light-emitting module and the second light-emitting module are disposed between the first substrate and the second substrate. The first light-emitting module and the second light-emitting module are spaced apart by a gap, and the light-shielding structure at least partially covers the gap in a top view direction of the light-emitting device.

Embodiments are directed to an electronic device having a hidden or concealable input region. In one aspect, an embodiment includes an enclosure having a wall that defines an input region having an array of microperforations. A light source may be positioned within a volume defined by the enclosure and configured to propagate light through the array of microperforations. A sensing element may be coupled with the wall and configured to detect input received within the input region. The array of microperforations are configured to be visually imperceptible when not illuminated by the light source. When illuminated by the light source, the array of microperforations may display a symbol.

A time-of-flight sensor includes a first light ray generation circuit and a second light ray reception circuit. A resin layer encapsulates the first light ray generation circuit and the second light ray reception circuit. A first region configured to emit light rays of the first light ray generation circuit is exposed at a surface of the resin layer. A second region configured to receive light rays of the second light ray reception circuit is also exposed at that surface of the resin layer. The surface of the resin layer is configured to be directed towards a scene.

A light sensing packaging structure and a packaging method thereof is provided, wherein the light sensing packaging structure comprises a substrate provided with a through-hole between a light-emitting element and a light-sensing element; and a cover body covered the substrate. The cover body comprises a shielding part and an extended part. The shielding part is mounted between the light-emitting element and the light-sensing element, and provided with a metal bonding layer on a surface towards the substrate. The extended part is provided with a metal side wall connected to the metal bonding layer. The through-hole is covered with a conductive glue, and the metal junction contacts the conductive glue. Hereby, the present application may reduce the size of the light sensing device, provide a stable packaging, reduce the packaging cost and improve the reliability of the light sensing product.

A fingerprint identification structure and a display panel are disclosed. display panel includes a fingerprint identification structure. The fingerprint identification structure includes a light energy switch and a thermosensitive light path adjustment structure. The light energy switch is configured to switch from an open circuit to a closed circuit under light irradiation. The thermosensitive light path adjustment structure is connected to a surface of the light energy switch, is able to transmit light internally, and is configured to adjust a light path of light to drive the light to irradiate the light energy switch when receiving a heat source.