A method includes forming image sensors in a semiconductor substrate. A first alignment mark is formed close to a front side of the semiconductor substrate. The method further includes performing a backside polishing process to thin the semiconductor substrate, forming a second alignment mark on the backside of the semiconductor substrate, and forming a feature on the backside of the semiconductor substrate. The feature is formed using the second alignment mark for alignment.

Methods and systems for all wrap around porous silicon formation are provided herein. In some embodiments, a substrate holder used for all wrap around porous silicon formation may include a body having a tapered opening along a first edge of the body, wherein the tapered opening is configured to release byproduct gases produced during porous silicon formation on a substrate supported by the substrate holder, a first vacuum channel formed in the body and extending to a first surface of the body, and a first sealing element disposed on the first surface of the body and fluidly coupled to the first vacuum channel, where in the first sealing element supports the substrate when disposed thereon.

An optical sensor module and a sensor chip thereof are provided. The optical sensor module includes a substrate, a sensor chip and a passive chip. The sensor chip is disposed on the substrate, and the sensor chip includes a chip body having an active region located at a top side thereof and a recess portion depressed from a top surface of the chip body. The passive chip is accommodated in the recess portion, and a depth of the recess portion is greater than a thickness of the passive chip.

In an example, the present invention provides a method of separating a photovoltaic strip from a solar cell. The method includes providing a solar cell, placing the front side of the solar cell on a platen such that the backside is facing a laser source, initiating a laser source to output a laser beam having a wavelength from 200 to 600 nanometers and a spot size of 18 to 30 microns, subjecting a portion of the backside to the laser beam at a power level ranging from about 20 Watts to about 35 Watts to cause an ablation to form a scribe region having a depth, width, and a length, the depth being from 40% to 60% of a thickness of the solar cell, the width being between 16 and 35 microns to create a plurality of scribe regions spatially disposed on the backside of the solar cell.

A method of producing a plurality of optoelectronic semiconductor chips includes a) providing a layer composite assembly having a principal plane which delimits the layer composite assembly in a vertical direction, and includes a semiconductor layer sequence having an active region that generates and/or detects radiation, wherein a plurality of recesses extending from the principal plane in a direction of the active region are formed in the layer composite assembly; b) forming a planarization layer on the principal plane such that the recesses are at least partly filled with material of the planarization layer; c) at least regionally removing material of the planarization layer to level the planarization layer; and d) completing the semiconductor chips, wherein for each semiconductor chip at least one semiconductor body emerges from the semiconductor layer sequence.

Systems and methods for manufacturing solar panels are disclosed. Solar cells are placed on a conveyor that transports the cells from a start point to an end point. A laser scribing module scribes the cells at a predetermined depth. A paste dispensing module deposits a predetermined amount of conductive paste on the surface of the solar cells. A cleaving apparatus divides the cells into smaller strips. A shingling module creates a string of cells by overlapping the strips. A targeted annealing module cures the paste, and a layup module places the strings on a backsheet. A glass cover is then added to one side of the strings.

A photovoltaic module and a method for producing such modules is presented in which the resistance of the interconnects between neighboring photovoltaic cells is minimized and the dead-area is also minimized. This is achieved by routing the interconnects, in form of a finger, from a top contact of a first photovoltaic cell to a bottom contact of a second photovoltaic cell. The interconnect is isolated from the bottom contact of the first photovoltaic cell by means of the photovoltaic stack and the interconnect is connected to the bottom contact of the second photovoltaic cell in an opening of the photovoltaic stack.

A lamination device for laminating a photovoltaic stack on a profiled metallic panel, the lamination device including a lid covered on its underside with an upper flexible pressure membrane so as to form an airtight upper chamber that may be ventilated or evacuated and/or including an upper heating device whose bottom side has a crenellated profile, the device also including a chassis covered on its top with a lower flexible pressure membrane so as to form an airtight lower chamber that may be ventilated or evacuated and/or including a lower heating device whose upper side has a cross-section which differs from the crenellated profile of the bottom side of the upper heating device, wherein the lid is capable of sealably laying on the chassis so that the cavity thus formed is airtight and may be ventilated or evacuated. A corresponding process is also provided.

A method of manufacturing a solar cell module includes: placing a light reflection member across a gap between adjacent two solar cells set on a work table; and attaching the light reflection member to respective ends of the adjacent two solar cells, by thermocompression-bonding respective overlap regions of the light reflection member with the adjacent two solar cells using a compression bonding head that includes: a first thermocompression bonding portion and a second thermocompression bonding portion each having a contact surface that comes into contact with the light reflection member; and a non-thermocompression bonding portion interposed between the first thermocompression bonding portion and the second thermocompression bonding portion and not thermocompression-bonding the light reflection member.

The invention relates to a method for producing a plurality of optoelectronic semiconductor components (1), comprising the following steps: a) providing a semiconductor layer sequence (2) having a plurality of semiconductor body regions (200); b) providing a plurality of carrier bodies (3), which each have a first contact structure (31) and a second contact structure (32); c) forming a composite (4) having the semiconductor layer sequence and the carrier bodies in such a way that adjacent carrier bodies are separated from one another by interspaces (35) and each semiconductor body area is electrically conductive connected to the first contact structure and the second contact structure of the associated carrier body; and d) separating the composite into the plurality of semiconductor components, wherein the semiconductor components each have a semiconductor body (20) and a carrier body. The invention further relates to an optoelectronic semiconductor component (1).