Patent classifications
H01L33/0083
Conversion Element, Radiation-Emitting Semiconductor Device and Method for Producing a Conversion Element
A conversion element, a radiation-emitting semiconductor device and a method for producing a conversion element are disclosed. In an embodiment a conversion element includes a ceramic luminescent material and a flux material, wherein the flux material has a boiling temperature above 1500 C. and/or a melting temperature below 1500 C., and wherein the flux material has a concentration in the conversion element between at least 0.01 wt % and at most 1 wt %.
SMALL MOLECULE PASSIVATION OF QUANTUM DOTS FOR INCREASED QUANTUM YIELD
This disclosure pertains to the field of nanotechnology. The disclosure provides nanostructure compositions comprising (a) at least one population of nanostructures; (b) at least one metal halide bound to the surface of the nanostructures; and (c) at least one metal carboxylate bound to the surface of the nanostructures. The nanostructure compositions have high quantum yield, narrow emission peak width, tunable emission wavelength, and colloidal stability. Also provided are methods of preparing the nanostructure compositions. And, nanostructure films and molded articles comprising the nanostructure compositions are also provided.
Highly luminescent nanostructures and methods of producing same
Highly luminescent nanostructures, particularly highly luminescent quantum dots, are provided. The nanostructures have high photoluminescence quantum yields and in certain embodiments emit light at particular wavelengths and have a narrow size distribution. The nanostructures can comprise ligands, including C5-C8 carboxylic acid ligands employed during shell formation and/or dicarboxylic or polycarboxylic acid ligands provided after synthesis. Processes for producing such highly luminescent nanostructures are also provided, including methods for enriching nanostructure cores with indium and techniques for shell synthesis.
MICRON-SIZED LIGHT EMITING DIODE DESIGNS
A emitting diode (LED) includes an epitaxial structure defining a base and a mesa on the base. The base defines a light emitting surface of the LED and includes current spreading layer. The mesa includes a thick confinement layer, a light generation area on the thick confinement layer to emit light, a thin confinement layer on the light generation area, and a contact layer on the thin confinement layer, the contact layer defining a top of the mesa. A reflective contact is on the contact layer to reflect a portion of the light emitted from the light generation area, the reflected light being collimated at the mesa and directed through the base to the light emitting surface. In some embodiments, the epitaxial structure grown on a non-transparent substrate. The substrate is removed, or used to form an extended reflector to collimate light.
OPTOELECTRONIC DEVICE WITH LIGHT-EMITTING DIODES
An optoelectronic device including a substrate with first and second opposite surfaces; and electrical insulation side elements extending from the first surface to the second surface and defining, within the substrate, first semi-conductive or conductive portions which are electrically insulated from each other. The optoelectronic device also includes, for each first portion a first conductive contact pad on the second surface in contact with the first portion and a set of light-emitting diodes resting on the first surface and electrically connected to the first portion. The optoelectronic device also includes a conductive, at least partially transparent electrode layer covering all the light-emitting diodes; an insulating, at least partially transparent encapsulation layer covering the electrode layer; and at least one second conductive contact pad electrically connected to the electrode layer.
LIGHT EMITTING DEVICE PACKAGE AND LIGHT SOURCE UNIT
A light emitting device package disclosed to an embodiment of the invention includes a body including an upper surface and a lower surface, the body including a first recess and a second recess concaved from the lower surface toward the upper surface; a light emitting device disposed on the body and including a first bonding portion and a second bonding portion; and first and second conductive portions respectively disposed in the first recess and the second recess, wherein the body includes a first through hole and a second through hole penetrating an upper surface of each of the first recess and the second recess and the upper surface of the body, and wherein each of the first and second conductive portions extends into the first and second through holes and is electrically connected to the first bonding portion and the second bonding portion, respectively.
QUANTUM DOT DEVICE AND DISPLAY DEVICE
A quantum dot device including a first electrode and a second electrode facing each other, a quantum dot layer disposed between the first electrode and the second electrode and an electron auxiliary layer disposed between the quantum dot layer and the second electrode, wherein the electron auxiliary layer includes an electron-transporting material represented by Chemical Formula 1 and an electron-controlling material capable of decreasing electron mobility of the electron auxiliary layer, and a display device.
Zn.sub.1-xM.sub.xOChemical Formula 1
In Chemical Formula 1, M and x are the same as described in the detailed description.
Optoelectronic device with light-emitting diodes
An optoelectronic device including a substrate with first and second opposite surfaces; and electrical insulation side elements extending from the first surface to the second surface and defining, within the substrate, first semi-conductive or conductive portions which are electrically insulated from each other. The optoelectronic device also includes, for each first portion a first conductive contact pad on the second surface in contact with the first portion and a set of light-emitting diodes resting on the first surface and electrically connected to the first portion. The optoelectronic device also includes a conductive, at least partially transparent electrode layer covering all the light-emitting diodes; an insulating, at least partially transparent encapsulation layer covering the electrode layer; and at least one second conductive contact pad electrically connected to the electrode layer.
Multi-heterojunction nanoparticles, methods of manufacture thereof and articles comprising the same
Disclosed herein is a semiconducting nanoparticle comprising a one-dimensional semiconducting nanoparticle having a first end and a second end; where the second end is opposed to the first end; and two first endcaps, one of which contacts the first end and the other of which contacts the second end respectively of the one-dimensional semiconducting nanoparticle; where the first endcap that contacts the first end comprises a first semiconductor and where the first endcap extends from the first end of the one-dimensional semiconducting nanoparticle to form a first nanocrystal heterojunction; where the first endcap that contacts the second end comprises a second semiconductor; where the first endcap extends from the second end of the one-dimensional semiconducting nanoparticle to form a second nanocrystal heterojunction; and where the first semiconductor and the second semiconductor are chemically different from each other.
Group III-V quantum dot and manufacturing method thereof
Embodiments disclosed herein relate to group III-V QDs and manufacturing methods thereof. More specifically, the embodiments disclosed herein relate to group III-V QDs that have at least one shell of a group II-VI compound surrounding the group III-V QD core. Thus, the QDs disclosed herein are core/shell QDs and in some embodiments may be a core/shell/shell QD. For example, the group III-V QD core material may be surrounded by a shell of a group II-VI compound, which itself may be surrounded by a shell of a group II-VI compound.