Provided is a method of producing semiconductor nanoparticles that exhibit a band-edge emission, and are superior in quantum yield. The method includes raising the temperature of a first mixture containing a silver (Ag) salt, a salt containing at least one of indium (In) and gallium (Ga), a solid compound that serves as a supply source of sulfur (S), and an organic solvent to a temperature in a range of from 125° C. to 175° C., and heat-treating, subsequent to the raising of the temperature, the first mixture at a temperature in a range of from 125° C. to 175° C. for three seconds or more to obtain a solution containing semiconductor nanoparticles, and decreasing the temperature of the solution containing semiconductor nanoparticles. The solid compound that serves as a supply source of S contains thiourea.

Disclosed are a light emitting diode and a method for manufacturing a light emitting diode. The light emitting diode includes a first-type layer, a light emitting layer, a second-type layer and an electrode layer; the first-type layer includes a first-type gallium nitride; the light emitting layer is located on the first-type layer; the light emitting layer includes a quantum point; the second-type layer is located on the light emitting layer; the second-type layer includes a second-type gallium nitride; and the electrode layer is located on the second-type layer.

A white light emitting device comprises: an LED that generates excitation light of wavelength from 420 nm to 480 nm; and photoluminescence materials that generate light with a peak emission wavelength from 500 nm to 650 nm comprising a broadband phosphor, and a manganese-activated narrowband red fluoride phosphor with a peak emission wavelength from 628 nm to 640 nm and a full width at half maximum of less than 30 nm. The device generates white light with a selected color temperature from 2200K to 6500K, a General Color Rendering Index, CRI Ra, of at least 80, and a Duv (Delta u, v) from 0.0060 to 0.0170 for the selected color temperature and wherein the device has an LER (Luminous Efficacy of Radiation) of at least 320 lm/W.sub.opt.

A white light emitting device comprises: an LED that generates excitation light of wavelength from 420 nm to 480 nm; and photoluminescence materials that generate light with a peak emission wavelength from 500 nm to 650 nm comprising a broadband phosphor, and a manganese-activated narrowband red fluoride phosphor with a peak emission wavelength from 628 nm to 640 nm and a full width at half maximum of less than 30 nm. The device generates white light with a selected color temperature from 2200K to 6500K, a General Color Rendering Index, CRI Ra, of at least 80, and a Duv (Delta u, v) from 0.0060 to 0.0170 for the selected color temperature and wherein the device has an LER (Luminous Efficacy of Radiation) of at least 320 lm/W.sub.opt.

A photonic device that includes two electrodes and a two-dimensional (2D) material electrically connecting the two electrodes. The 2D material may be molybdenum ditelluride. Strain may be induced in the 2D material (e.g., by placing the 2D material on a waveguide) to reduce the band gap of the 2D material and increase the efficiency of the photodetector. The photonic device may be a photodetector with 2D material that absorbs light energy and converts it into a photocurrent in a circuit that includes the two electrodes. The photonic device may be an emitter with 2D material that emits light energy in response to an electric field across the two electrodes. The photonic device may be a modulator with 2D material that modulates a property of an optical signal (e.g., the amplitude or phase) by modulating the amount of strain induced in the 2D material.

A semiconductor device package includes a carrier, an emitting element and a first package body. The carrier includes a first surface and a second surface opposite to the first surface. The emitting element is disposed on the first surface of the carrier. The first package body is disposed over the first surface of the carrier and spaced apart from the first surface of the carrier.

A semiconductor structure can include a substrate comprising a first in-plane lattice constant, a graded layer on the substrate, and a first region of the graded layer comprising a first epitaxial oxide material comprising a second in-plane lattice constant. The graded layer on the substrate can include (Al.sub.x1Ga.sub.1−x1).sub.y1O.sub.z1, wherein x1 is from 0 to 1, wherein y1 is from 1 to 3, wherein z1 is from 2 to 4, and wherein x1 varies in a growth direction such that the graded layer has the first in-plane lattice constant adjacent to the substrate and a second in-plane lattice constant at a surface of the graded layer opposite the substrate. In some cases, a semiconductor structure includes a first region comprising a first epitaxial oxide material; a second region comprising a second epitaxial oxide material; and the graded region located between the first and the second regions.

A semiconductor structure can include a substrate comprising a first in-plane lattice constant, a graded layer on the substrate, and a first region of the graded layer comprising a first epitaxial oxide material comprising a second in-plane lattice constant. The graded layer on the substrate can include (Al.sub.x1Ga.sub.1−x1).sub.y1O.sub.z1, wherein x1 is from 0 to 1, wherein y1 is from 1 to 3, wherein z1 is from 2 to 4, and wherein x1 varies in a growth direction such that the graded layer has the first in-plane lattice constant adjacent to the substrate and a second in-plane lattice constant at a surface of the graded layer opposite the substrate. In some cases, a semiconductor structure includes a first region comprising a first epitaxial oxide material; a second region comprising a second epitaxial oxide material; and the graded region located between the first and the second regions.

A light-emitting element according to the present invention includes an anode, a hole transport layer, and a light-emitting layer containing a quantum dot, and a cathode in this order, and the hole transport layer includes an n+-type semiconductor layer, and a p+-type semiconductor layer adjacent to the n+-type semiconductor layer and disposed closer to the light-emitting layer than the n+-type semiconductor layer (24).

The present disclosure relates to the field of dielectric elastomers. In particular, provided are a dielectric elastomer precursor fluid, a preparation method therefor and the use thereof, a dielectric elastomer composite material, a flexible device, and a light-emitting device. The dielectric elastomer precursor fluid comprises an elastomer matrix, an ionic liquid and a solvent, wherein the volume fraction of the ionic liquid and the solvent is 5-45%. The dielectric elastomer precursor fluid has the advantages of a high conductivity, a high transparency and a good fluidity, and is beneficial for preparing a dielectric elastomer composite material having a high dielectric constant, a low elastic modulus and a high optical transparency, thus fully solving the problem that a high dielectric constant cannot be balanced with a low elastic modulus and a high optical transparency in a dielectric elastomer.