Provided are nanorod light emitting diodes (LEDs), display apparatuses, and manufacturing methods thereof. The nanorod LED includes a first-type semiconductor layer including a body and a pyramidal structure continuously provided from the body, a nitride light emitting layer provided on the pyramidal structure, and a second-type semiconductor layer provided in the nitride light emitting layer.

The present invention provides a display device including a substrate, a wiring electrode disposed on the substrate, and a plurality of semiconductor light emitting devices electrically connected to the wiring electrode, an anisotropic conductive layer disposed between the semiconductor light emitting devices and made of a mixture of conductive particles and an insulating material, and a light transmitting layer formed between the semiconductor light emitting devices. And the anisotropic conductive layer is formed in plurality, and any one of the plurality of anisotropic conductive layers is formed to surround one semiconductor light emitting device or to surround a plurality of semiconductor light emitting devices adjacent to each other.

A display device may include a substrate including pixel areas, and a pixel disposed in each of the pixel area. The pixel may include a transistor and a driving voltage line disposed in the substrate, first and second electrodes spaced apart from each other, a bank pattern disposed on the first and second electrodes, respectively, intermediate layers disposed on the bank pattern, light emitting elements disposed between two adjacent intermediate layers of the intermediate layers, a first contact electrode disposed on one of the two adjacent intermediate layers and electrically connected to an end of each of the light emitting elements, and a second contact electrode disposed on another one of the two adjacent intermediate layers and electrically connected to another end of each of the light emitting elements.

A display device including a wiring area including a plurality of scan lines extending in a first direction and a plurality of data lines extending in a second direction crossing the first direction, a transmissive area surrounded by the wiring area and configured to transmit light, a plurality of pixel drivers respectively connected to one of the plurality scan lines and one of the plurality of data lines, a first pad electrode and a second pad electrode overlapping a first pixel driver from among the plurality of pixel drivers, a light emitting element on the first pad electrode and the second pad electrode, a first supplement electrode overlapping the first pad electrode, and a second supplement electrode overlapping the second pad electrode.

A light-emitting element extending in one direction includes: a semiconductor core including a main body extending in the one direction, a first end connected to one side of the main body and having an inclined side surface, and a second end connected to an other side of the main body and having a width less than that of the main body; and an insulation film around at least a portion of the outer surface of the semiconductor core, wherein the insulation film includes a first insulation film around the first end of the semiconductor core; and a second insulation film around the second end of the semiconductor core, wherein the diameter of an outer surface of the first insulation film is the same as a diameter of an outer surface of the second insulation film.

A light-emitting element extending in one direction includes: a semiconductor core including a main body extending in the one direction, a first end connected to one side of the main body and having an inclined side surface, and a second end connected to an other side of the main body and having a width less than that of the main body; and an insulation film around at least a portion of the outer surface of the semiconductor core, wherein the insulation film includes a first insulation film around the first end of the semiconductor core; and a second insulation film around the second end of the semiconductor core, wherein the diameter of an outer surface of the first insulation film is the same as a diameter of an outer surface of the second insulation film.

A display device includes a pixel circuit layer including a plurality of transistors, a first electrode and a second electrode disposed on a same layer on the pixel circuit layer, a light emitting element disposed between the first electrode and the second electrode, and an antenna pattern disposed on the light emitting element.

A display device includes a pixel circuit layer including a plurality of transistors, a first electrode and a second electrode disposed on a same layer on the pixel circuit layer, a light emitting element disposed between the first electrode and the second electrode, and an antenna pattern disposed on the light emitting element.

A display device includes a display area including light emitting elements in a first pixel row, pixel circuits in a first circuit row and electrically connected to the first pixel row, light emitting elements in a second pixel row between the first pixel row and the first circuit row, pixel circuits in a second circuit row and electrically connected to the second pixel row, and a gate driver including a first stage disposed between the pixel circuits of the first circuit row and a second stage disposed between the pixel circuits of the second circuit row. A distance between adjacent pixel circuits with the first stage between the adjacent pixel circuits in the first circuit row is greater than a distance between other pixel circuits of the first circuit row.

A display device includes: a substrate; a transistor layer on a first surface of the substrate; a pad portion; a first via layer on the transistor layer, and spaced from the pad portion; a second via layer on the first via layer, and exposing an upper surface of the first via layer; a third via layer on the second via layer, and exposing an upper surface of the second via layer; a display element layer on the third via layer; a lead line on a second surface of the substrate; a side surface connection line on the first surface, the second surface, and a side surface between the first surface and the second surface, the side surface connection line electrically connecting the pad portion to the lead line; and an over-coating layer covering the side surface connection line, and overlapping with the exposed upper surface of the first via layer.