A light emission device includes: a base part; a semiconductor laser device disposed on the base part; a frame body fixed to the base part and provided around the semiconductor laser device; a lid bonded to an upper surface of the frame body; and a first electrical conduction member bonded to an outer surface of the base part or an outer surface of the frame body, the first electrical conduction member having a first conductive region and a second conductive region that are electrically connected to the semiconductor laser device. In a top plan view, the first electrical conduction member includes a first portion overlapping the frame body and a second portion not overlapping the frame body, the first conductive region being contained in the first portion, and the second conductive region being contained in the second portion.

The present disclosure provides a display panel, including: a first barrier wall, enclosing a plurality of first barrier wall openings; light-emitting devices, arranged corresponding to the plurality of first barrier wall openings; and color conversion units, including at least one color conversion unit being at least partially located in a corresponding first barrier wall opening, and at least partially beyond the corresponding first barrier wall opening. The present disclosure also provides a display device. Through the present disclosure, display effect of the display panel can be improved.

An apparatus comprising a chip comprising a plurality of micro-emitters, the micro-emitters to couple to a plurality of data lines and to an optical fiber, wherein the micro-emitters are to generate optical signals for parallel transmission through the optical fiber, the optical signals corresponding to data communicated on the data lines.

A light-emitting diode (LED) module of an LED luminaire assembly for a harsh and hazardous environment is provided. The LED module includes an LED assembly, a single-piece lens assembly, and an adhesive sealant. The LED assembly includes a plurality of LEDs. The single-piece lens assembly includes a plurality of lenses, wherein the lens assembly includes a groove defining a complete loop and surrounding the plurality of lenses, the lens assembly coupled to the LED assembly, and the plurality of lenses covering at least one of the plurality of LEDs. The adhesive sealant is disposed in the groove and bonded to the lens assembly, the adhesive sealant sealing off the plurality of LEDs from an ambient environment around the LED module.

An ultraviolet light array module has a substrate, multiple ultraviolet light chips, and an amorphous silicon concentrator. The substrate has a concave. The ultraviolet light chips are arranged in an array in the concave of the substrate. The amorphous silicon concentrator covers on the concave and includes a light-transmitting base and multiple continuous light-concentrating protrusions. The optical axis of each light-concentrating protrusion aligns with the light-emitting axis of the corresponding ultraviolet light chip to generate ultraviolet light with a specific light-emitting angle. Since the light-concentrating protrusions are integrally formed on the light-transmitting base, the optical axes of the light-concentrating protrusions are close to each other and align with the light-emitting axes of the ultraviolet light chips underneath. By superimposing these ultraviolet lights that maintain the same light-emitting angle, under the same irradiation distance, the central illuminance is greatly increased, and the uniform light shape is maintained.

A light emitting device includes a semiconductor light emitting element and a package that seals the semiconductor light emitting element. The package includes a base having a first upper surface region directly or indirectly supporting the semiconductor light emitting element, and a second upper surface region surrounding the first upper surface region in a plan view viewed in a direction normal to the first upper surface region. The package further includes a cover bonded to the base, an inner metal layer disposed on the second upper surface region of the base, an outer metal layer extending along the outer edge of the inner metal layer, and a slit part on the second upper surface region between the inner metal layer and the outer metal layer. In the plan view, the inner edge of the inner metal layer is positioned inward of the outer edge of the cover. In the plan view, at least a portion of the outer edge of the outer metal layer is positioned outward of the outer edge of the cover. The cover is bonded to the base via a bonding material disposed on the inner metal layer.

Disclosed is an LED module including a cover part, a board part connected to a front portion of the cover part, a light emitting part electrically connected to the board part, positioned on a front portion of the board part, and that emits light through a side surface thereof, a lens part surrounding the side surface of the light emitting part and positioned on the front portion of the board part, and a panel part, into which the lens part is inserted, having an optic part having a fine boss shape on an outer surface thereof, and positioned on the front portion of the board part.

An LED device and a bracket thereof. The bracket includes a first photo-etched metal part, composed of a first electrode and a chip placement layer stacked thereon, wherein an area of the chip placement layer is greater than an area of the first electrode; a second photo-etched metal part, composed of a second electrode and a connection layer stacked thereon; wherein a first insulation trench is provided between the first electrode and the second electrode, and a second insulation trench is provided between the chip placement layer and the connection layer. The LED device and the bracket thereof can increase the placement area for placing LED chips, thereby improving the luminance of the LED device.

A light emitting element including a housing having a cavity and an inner wall, a light emitting part disposed in the cavity to emit light having a peak wavelength in a blue wavelength band and including first and second light emitting chips spaced apart from each other, a lead portion to supply external electric power, and a wavelength converter including a first phosphor layer including a first phosphor to emit light having a peak wavelength in a green wavelength band, and a second phosphor layer including a second phosphor to emit light having a peak wavelength in a red wavelength band, in which the second phosphor includes at least one of a nitride-based red phosphor and a fluoride-based red phosphor represented by A.sub.2MF.sub.6:Mn.sup.4+, A is one of Li, Na, K, Ba, Rb, Cs, Mg, Ca, Se, and Zn, and M is one of Ti, Si, Zr, Sn, and Ge.

A light-emitting device includes a mounting member, first to third light-emitting elements mounted on a mounting surface, and first to third protective elements mounted on the mounting surface and respectively electrically connected to the first to third light-emitting elements. In a plan view viewed along a normal direction of the mounting surface, at least a part of the first protective element is disposed between the first light-emitting element and the second light-emitting element, at least a part of the second protective element and at least a part of the third protective element are disposed between the second light-emitting element and the third light-emitting element, and the second light-emitting element is disposed between the first light-emitting element and the third light-emitting element.