A light-emitting device according to an embodiment is provided with: a light-emitting panel including a first board that is light transmissive and flexible, a plurality of conductor patterns formed on a surface of the first board, a plurality of light-emitting elements connected to one of the conductor patterns, and a second board that is light transmissive and flexible and that holds the light-emitting elements relative to the first board; and a flexible wiring board including a circuit pattern that is electrically connected via an anisotropic conductive layer to an exposed part of the conductor patterns formed on the first board, the exposed part being exposed by the end of the second board.

A semiconductor package substrate includes a semiconductor housing space including a mounting surface being provided on a bottom side and configured to mount a semiconductor light-emitting element, and a reflective wall being provided around the mounting surface and configured to reflect light emitted from the semiconductor light-emitting element to be mounted on the mounting surface; a mounting region being provided at a rim portion and configured to mount a lid member for covering the semiconductor light-emitting element; and a flow-suppressing portion separating the mounting region and the reflective wall spatially in such a manner that a joining member joining the lid member to the rim portion is suppressed from flowing from the mounting region into the semiconductor housing space.

A light emitting device includes a light emitting element, lateral walls surrounding the light emitting element, a first light-transmissive member and a light shielding member. The lateral walls includes first to fourth lateral walls. The first and second lateral walls define a first opening therebetween. The second and third lateral walls define a second opening therebetween. The third and fourth lateral walls define a third opening therebetween. The fourth and first lateral walls define a fourth opening therebetween. In the top view, a first straight line passing through the first and third openings extends in a first direction, and a second straight line passing through the second and fourth openings extends in a second direction orthogonal to the first direction. The first light-transmissive member is arranged on or above the light emitting element and the lateral walls. The light shielding member is arranged on or above the first light-transmissive member.

Various embodiments of SST dies and solid state lighting (“SSL”) devices with SST dies, assemblies, and methods of manufacturing are described herein. In one embodiment, a SST die includes a substrate material, a first semiconductor material and a second semiconductor material on the substrate material, an active region between the first semiconductor material and the second semiconductor material, and a support structure defined by the substrate material. In some embodiments, the support structure has an opening that is vertically aligned with the active region.

An electronic device includes a substrate, a light emitting diode and an optical sensor. The light emitting diode is disposed on the substrate and emits a light. The optical sensor is disposed on the substrate and is configured to receive the light. The optical sensor receives the light to generate a first electrical signal for fingerprint authentication, and receives the light to generate a second electrical signal for luminance calibration of the light.

Various embodiments of SST dies and solid state lighting (“SSL”) devices with SST dies, assemblies, and methods of manufacturing are described herein. In one embodiment, a SST die includes a substrate material, a first semiconductor material and a second semiconductor material on the substrate material, an active region between the first semiconductor material and the second semiconductor material, and a support structure defined by the substrate material. In some embodiments, the support structure has an opening that is vertically aligned with the active region.

Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly integrated warning structures for ultraviolet LED packages are disclosed. Integrated warning structures may include passive structures, such as lumiphoric material regions, that are arranged within LED packages to receive a portion of ultraviolet light from an LED chip within the LED package and provide a small amount of wavelength-converted light. Such wavelength-converted light may serve as indication that ultraviolet light is being emitted. Exemplary lumiphoric material regions may form one or more discrete regions within LED packages and may provide such wavelength-converted light without substantial impact on color purity of the LED packages. Accordingly, LED packages may provide integrated warning emissions that may serve to indicate the presence of ultraviolet emissions and/or reduce human exposure to such ultraviolet emissions.

A light emitting apparatus includes: an electrically insulating base member that has first and second sides extending in a width direction, and third and fourth sides extending in a length direction, wherein the third and fourth sides are longer than the first and second sides; a plurality of electrically conductive pattern portions; a plurality of light emitting devices mounted on the electrically conductive pattern portions, the light emitting devices being arrayed in the length direction; a protection element that is flip chip mounted on the electrically conductive pattern portions and located, in the plan view, between the light emitting devices and the third side of the base member in the width direction; a first resin part that has a frame shape; a second resin part that is located in the first resin part; and at least one transparent member located on the light emitting devices.

A display module, a display screen and a display system are disclosed. The display module comprises a frame and multiple display unit boards assembled and installed on the frame to form a display surface. The frame comprises a border and a support frame installed in the border. Each display unit board comprises a circuit board and multiple pixel points installed on a front side of the circuit board, wherein a back side of the circuit board is installed on the border and the support frame, and each pixel point includes at least one LED chip. According to the display module of the invention, multiple display unit boards are assembled on the frame to form a display surface.

A method of manufacturing a lens including forming a cover blank having cover parts by injecting a thermosetting first resin in a first mold and curing the thermosetting first resin, removing a part or all parts of the first mold, and arranging the cover blank in a second mold. The method further includes forming a lens blank having a light-shielding part between adjacent cover parts by injecting a thermosetting second resin having a greater light absorptance or light reflectance than the thermosetting first resin into the second mold and curing the thermosetting second resin, and obtaining individual lenses by taking out the lens blank from the second mold, and cutting the lens blank at the light-shielding part located between adjacent cover parts to obtain individual lenses each with lateral end surfaces and an upper surface of each of flange parts and lateral side walls covered by the light-shielding part.