The present embodiment comprises: a plurality of light-emitting units; and a reflector including reflector units having spaces formed to receive the plurality of light-emitting units, respectively. Each of the plurality of light-emitting units includes an LED package mounted on a substrate and a light diffusion layer having a groove portion formed on a surface opposite to the substrate in the LED package, wherein the outer circumference of the light diffusion layer faces the inner surface of a reflector unit. In the reflector, the plurality of reflector units are integrally formed, the spaces expand along a direction extending away from the substrate, and a wall forming each of the spaces surrounds the outer circumference of each of the LED package and the light diffusion layer.

A method of manufacturing an electronics assembly includes forming a base layer using an additive manufacturing process, forming a first thermally and electrically conductive intermediate layer onto the base layer using an additive manufacturing process, placing an electronics component onto the first thermally and electrically conductive intermediate layer, the electronics component comprising a plurality of vias, forming a second thermally and electrically conductive intermediate layer over the first thermally and electrically conductive intermediate layer and over at least a portion of the electronics component using an additive manufacturing process, wherein a material of the second thermally and electrically conductive intermediate layer extends through the vias to contact the first thermally and electrically conductive intermediate layer and the vias, thereby forming a bond therebetween, and forming a protective layer over at least a portion of the second thermally and electrically conductive intermediate layer using an additive manufacturing process.

A method of manufacturing an electronics assembly includes forming a base layer using an additive manufacturing process, forming a first thermally and electrically conductive intermediate layer onto the base layer using an additive manufacturing process, placing an electronics component onto the first thermally and electrically conductive intermediate layer, the electronics component comprising a plurality of vias, forming a second thermally and electrically conductive intermediate layer over the first thermally and electrically conductive intermediate layer and over at least a portion of the electronics component using an additive manufacturing process, wherein a material of the second thermally and electrically conductive intermediate layer extends through the vias to contact the first thermally and electrically conductive intermediate layer and the vias, thereby forming a bond therebetween, and forming a protective layer over at least a portion of the second thermally and electrically conductive intermediate layer using an additive manufacturing process.

A color display device includes a matrix of light sources, each light source comprising a single micro-light-emitting diode, the light sources being of three different colors, each color pixel of the matrix comprising three sources emitting in the three different colors. In the device, the matrix is formed by a group of elementary components of identical shape, each elementary component comprising at least two light-emitting diodes emitting in one of the three spectral bands—the shape of the light-emitting diodes being either a triangle, or a quadrilateral, or a pentagon—the elementary components being assembled in threes such that their respective diodes touch one another by one of their sides, the group formed by the three sources associated with the three diodes forming a color pixel.

A color display device includes a matrix of light sources, each light source comprising a single micro-light-emitting diode, the light sources being of three different colors, each color pixel of the matrix comprising three sources emitting in the three different colors. In the device, the matrix is formed by a group of elementary components of identical shape, each elementary component comprising at least two light-emitting diodes emitting in one of the three spectral bands—the shape of the light-emitting diodes being either a triangle, or a quadrilateral, or a pentagon—the elementary components being assembled in threes such that their respective diodes touch one another by one of their sides, the group formed by the three sources associated with the three diodes forming a color pixel.

A semiconductor device includes a semiconductor stack, a third semiconductor structure, a dielectric layer, and a reflective layer under the third semiconductor structure. The semiconductor stack includes a first semiconductor structure, an active structure, a second semiconductor structure. The first semiconductor structure has a first surface which includes a first portion and a second portion, and the first surface has a first area. The third semiconductor structure connects to the first portion, and has a second surface with a second area. The dielectric layer connects to the second portion and includes a plurality of openings, and the plurality of openings have a third area. A ratio of the second area to the first area is between 0.1˜0.7, and a ratio of the third area to the first area is less than 0.2.

A light-emitting device includes: a substrate; a light-emitting element disposed on the substrate; a light-transmissive member disposed on a light extraction surface of the light-emitting element; a cover that covers the light-emitting element with a gap between the cover and the light-emitting element, the cover including: an upper portion that is transmissive to light emitted from the light-emitting element, a sidewall extending along a peripheral edge of the upper portion and having an outer lateral surface, and a recess defined by the upper portion and the sidewall; and a fixing member arranged on at least a part of the outer lateral surface of the sidewall of the cover. The fixing member is formed of a material that is deformable due to a pressing force generated in the event of an engagement with a counterpart member.

A light-emitting device includes: a substrate; a light-emitting element disposed on the substrate; a light-transmissive member disposed on a light extraction surface of the light-emitting element; a cover that covers the light-emitting element with a gap between the cover and the light-emitting element, the cover including: an upper portion that is transmissive to light emitted from the light-emitting element, a sidewall extending along a peripheral edge of the upper portion and having an outer lateral surface, and a recess defined by the upper portion and the sidewall; and a fixing member arranged on at least a part of the outer lateral surface of the sidewall of the cover. The fixing member is formed of a material that is deformable due to a pressing force generated in the event of an engagement with a counterpart member.

A display device includes a display module and a light-shielding structure. The display module has a substrate, a plurality of photoelectric units and a protective layer. The substrate defines with a first surface and a second surface. The photoelectric units are arranged on the first surface of the substrate, and each photoelectric unit has at least one photoelectric element. The protective layer is arranged on the first surface of the substrate and is filled between the photoelectric elements. The light-shielding structure is arranged on and connected to the protective layer. The light-shielding structure has a light-shielding layer including light-absorption materials and a plurality of windows defined in the light-shielding layer. The windows respectively correspond to the photoelectric units, and the photoelectric units are viewed through the corresponding windows in the direction perpendicular to the first surface of the substrate.

The invention relates to a diffuser 3 intended to be facing a light source 1 comprising a transmission layer 10 and a diffusion layer 22, 23 intended to diffuse a light transmitted by the light source, the diffuser being characterised in that the diffusion layer comprises a plurality of metal structures 200, 200a, 200b, called metal nanostructures, having dimensions less than a wavelength of the light transmitted, said metal nanostructures having varied sizes and being distributed within the diffusion layer such that adjacent metal nanostructures have between them, varied distances and preferably less than the wavelength of the light transmitted. The invention also relates to a method for manufacturing such a diffuser, and a display system comprising such a diffuser.