Example implementations include a method of mass transfer of display elements, by depositing one or more resist layers between one or more display elements disposed on a photoemitting layer, depositing at least one stress buffer layer between the resist layers, removing the resist layer and at least a portion of the photoemitting layer disposed in contact with the resist layers to form resist layer gaps on a wafer substrate, dicing the wafer substrate at the resist layer gaps to form at least one wafer die, separating the wafer substrate from the display elements by irradiation at corresponding first surfaces of the display elements, removing the stress buffer layers from the wafer die, and bonding the portion of the display elements to a first handler substrate at one or more electrode pads of the portion of the display elements.

A light-emitting device includes an optical amplifier and gives off output light from optical amplifier by making a plurality of seed light rays, having mutually different wavelengths, incident on optical amplifier. Optical amplifier includes a medium portion containing a wavelength-converting element. Optical amplifier has wavelength-converting element thereof excited by excitation light to produce a plurality of partially coherent light rays, of which wavelengths are respectively the same as the mutually different wavelengths of plurality of seed light rays, thereby giving off, as output light, a multi-wavelength light beam. Excitation light has a shorter wavelength than any of plurality of seed light rays and is incident on the medium portion. Multi-wavelength light beam includes a plurality of light rays amplified. Plurality of light rays amplified have wavelengths, which are respectively the same as mutually different wavelengths of plurality of seed light rays.

A light-emitting device includes an optical amplifier and gives off output light from optical amplifier by making a plurality of seed light rays, having mutually different wavelengths, incident on optical amplifier. Optical amplifier includes a medium portion containing a wavelength-converting element. Optical amplifier has wavelength-converting element thereof excited by excitation light to produce a plurality of partially coherent light rays, of which wavelengths are respectively the same as the mutually different wavelengths of plurality of seed light rays, thereby giving off, as output light, a multi-wavelength light beam. Excitation light has a shorter wavelength than any of plurality of seed light rays and is incident on the medium portion. Multi-wavelength light beam includes a plurality of light rays amplified. Plurality of light rays amplified have wavelengths, which are respectively the same as mutually different wavelengths of plurality of seed light rays.

A method of fabricating one or more optoelectronic devices each comprising at least one passive optical component. The method comprises providing a first carrier, depositing a soluble adhesive onto a surface of the first carrier, and placing a plurality of integrated circuit devices onto said surface and curing the soluble adhesive to fix the integrated circuit devices to the carrier. The method further comprises depositing a molding material onto a plurality of molds of a second carrier to form a plurality of said passive optical components, aligning said first and second carriers such that the plurality of passive optical components contact respective zones of the plurality of integrated circuit devices, injecting a polymer compound into a space between said first and second carriers and curing said polymer compound, removing said second carrier to leave the plurality of optical components fixed to the integrated circuit devices by said polymer compound, and dissolving said soluble adhesive to remove the integrated circuit devices, polymer compound and passive optical components from the first carrier to provide a wafer package.

Provided are an LED display pixel structure, an LED display module, and an LED display screen. The LED display pixel structure includes an LED pixel unit (1) and a layered extraction structure arranged above the LED pixel unit (1). The layered extraction structure is configured to receive light from the LED pixel unit (1) and emit the light. The LED display pixel structure includes a first retardation film layer (31), a linear polarizer (32), and a second retardation film layer (33), which are sequentially stacked. The light emitted by the LED pixel unit (1) sequentially passes through the first retardation film layer (31), the linear polarizer (32), and the second retardation film layer (33). The first retardation film layer (31) and the second retardation film layer (33) are quarter-wave plates.

Provided are an LED display pixel structure, an LED display module, and an LED display screen. The LED display pixel structure includes an LED pixel unit (1) and a layered extraction structure arranged above the LED pixel unit (1). The layered extraction structure is configured to receive light from the LED pixel unit (1) and emit the light. The LED display pixel structure includes a first retardation film layer (31), a linear polarizer (32), and a second retardation film layer (33), which are sequentially stacked. The light emitted by the LED pixel unit (1) sequentially passes through the first retardation film layer (31), the linear polarizer (32), and the second retardation film layer (33). The first retardation film layer (31) and the second retardation film layer (33) are quarter-wave plates.

A solid-state device, and use and formation thereof. The device includes a light emitter (102) that emits light with abeam propagation direction and includes an emitter epitaxial layer stack (940); a light routing medium (103) in optical communication with the light emitter; and a light detector (104) in optical communication with the light routing medium, which detects light emitted by the light emitter and includes a detector epitaxial stack (945). The light emitter and detector are monolithically formed on a semiconductor substrate. The emitter and detector epitaxial layer stacks include different pluralities of layers of a single epitaxial layer stack. The beam propagation direction is either in-plane with the single epitaxial layer stack and the light detector detects light out of plane with the single epitaxial layer stack, or out of plane with the single epitaxial layer stack and the light detector detects light in plane with the single epitaxial layer stack.

A solid-state device, and use and formation thereof. The device includes a light emitter (102) that emits light with abeam propagation direction and includes an emitter epitaxial layer stack (940); a light routing medium (103) in optical communication with the light emitter; and a light detector (104) in optical communication with the light routing medium, which detects light emitted by the light emitter and includes a detector epitaxial stack (945). The light emitter and detector are monolithically formed on a semiconductor substrate. The emitter and detector epitaxial layer stacks include different pluralities of layers of a single epitaxial layer stack. The beam propagation direction is either in-plane with the single epitaxial layer stack and the light detector detects light out of plane with the single epitaxial layer stack, or out of plane with the single epitaxial layer stack and the light detector detects light in plane with the single epitaxial layer stack.

A light emitting device and a light emitting module both having narrow spacing between emission faces, as well as a method of manufacturing light emitting device and a method of manufacturing light emitting module are provided.

A light emitting device 100 includes element structure bodies 15, at least one of the element structure bodies including a submount substrate 10, a light emitting element 20 disposed on the submount substrate 10, a light transmitting member 30 disposed on the light emitting element 20, and a first cover member 50 covering the lateral faces of the light emitting element 20 on the submount substrate 10, and a second cover member 60 supporting the element structure bodies 15 by covering the lateral faces of the element structure bodies 15.

An optical device stack includes at least one of a photodetector or an optical emitter and a metasurface. The metasurface is disposed over a light-receiving surface of the photodetector or a light emission surface of the optical emitter. The metasurface includes a first conductive layer having an electrically-tunable optical property and an array of conductive nanostructures disposed on a first side of the first conductive layer. A second conductive layer is disposed on a second side of the first conductive layer. An electrical insulator is disposed between the first conductive layer and the second conductive layer. A change in an electrical bias between the metasurface and the second conductive layer, from a first electrical bias to a second electrical bias, tunes the electrically-tunable optical property from a first state to a second state, and changes an electrically-tunable optical filtering property of the metasurface.