An electronic system is disclosed. The electronic system includes an electronic package having a base with a plurality of external terminals, and further having an electrically insulative material at least partially encapsulating the base, a controller circuit disposed within the electronic package and referenced to a first ground, a first and second driver circuits disposed within the electronic package and referenced to a second ground and arranged to receive isolated control signals from the controller circuit, and a bidirectional switch disposed within the electronic package and referenced to the second ground and arranged to receive drive signals from the first and second driver circuits. In one aspect, the first and second driver circuits are isolated from the controller circuit via capacitors, or magnetics, or optocouplers, or magneto resistors.

A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 m.

A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 m.

An underfill composition for encapsulating a bond line and a method of using the underfill composition are described. Advantageously, the disclosed underfill composition in an uncured state has a fluidity value of less than about ten minutes over about a two centimeter distance at a temperature of about 90 degrees C. and at a bond line thickness of about 50 microns or less and still have a bulk thermal conductivity that is greater than about 0.8 W/mK in the cured state.

An underfill composition for encapsulating a bond line and a method of using the underfill composition are described. Advantageously, the disclosed underfill composition in an uncured state has a fluidity value of less than about ten minutes over about a two centimeter distance at a temperature of about 90 degrees C. and at a bond line thickness of about 50 microns or less and still have a bulk thermal conductivity that is greater than about 0.8 W/mK in the cured state.

An underfill composition comprises a curable resin, a plurality of filler particles loaded within the resin, the filler particles comprising at least 50 weight % of the underfill composition. The filler particles comprise first filler particles having a particle size of from 0.1 micrometers to 15 micrometers and second filler particles having a particle size of less than 100 nanometers. A viscosity of the underfill composition is less than a viscosity of a corresponding composition not including the second filler particles.

A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 m.

A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 m.