A non-conductive magnetic shield material is provided for use in magnetic shields of semiconductor packaging. The material is made magnetic by the incorporation of ferromagnetic particles into a polymer matrix, and is made non-conductive by the provision of an insulating coating on the ferromagnetic particles.

A display panel is manufactured that includes a first panel substrate, a second panel substrate that is opposite the first panel substrate and has a protruding portion protruding from the first panel substrate, and a wiring board connected to the protruding portion of the second panel substrate. A manufacturing method of the display panel includes: overlapping protruding terminals and wiring terminals with the protruding terminals and the wiring terminals being opposite each other through an anisotropic conductive film; exposing the conductive layer on a surface of particles, located between the protruding terminals and the wiring terminals that are opposite each other, of the particles in the anisotropic conductive film; and curing the curable resin layer of particles, located in regions between the protruding terminals or regions between the wiring terminals when viewed in a normal direction of the second panel substrate, of the particles in the anisotropic conductive film.

A display panel is manufactured that includes a first panel substrate, a second panel substrate that is opposite the first panel substrate and has a protruding portion protruding from the first panel substrate, and a wiring board connected to the protruding portion of the second panel substrate. A manufacturing method of the display panel includes: overlapping protruding terminals and wiring terminals with the protruding terminals and the wiring terminals being opposite each other through an anisotropic conductive film; exposing the conductive layer on a surface of particles, located between the protruding terminals and the wiring terminals that are opposite each other, of the particles in the anisotropic conductive film; and curing the curable resin layer of particles, located in regions between the protruding terminals or regions between the wiring terminals when viewed in a normal direction of the second panel substrate, of the particles in the anisotropic conductive film.

A non-conductive magnetic shield material is provided for use in magnetic shields of semiconductor packaging. The material is made magnetic by the incorporation of ferromagnetic particles into a polymer matrix, and is made non-conductive by the provision of an insulating coating on the ferromagnetic particles.

A non-conductive magnetic shield material is provided for use in magnetic shields of semiconductor packaging. The material is made magnetic by the incorporation of ferromagnetic particles into a polymer matrix, and is made non-conductive by the provision of an insulating coating on the ferromagnetic particles.

Provided relates to a method for manufacturing an anisotropic conductive adhesive and a method for mounting a component using an anisotropic conductive adhesive, and provides a method for manufacturing an anisotropic conductive adhesive, including: a process of removing a first oxide film on solder particles by using a first reducing agent; and a process of manufacturing an anisotropic conductive adhesive by mixing the solder particles, a gapper, and an adhesive resin.

Provided relates to a method for manufacturing an anisotropic conductive adhesive and a method for mounting a component using an anisotropic conductive adhesive, and provides a method for manufacturing an anisotropic conductive adhesive, including: a process of removing a first oxide film on solder particles by using a first reducing agent; and a process of manufacturing an anisotropic conductive adhesive by mixing the solder particles, a gapper, and an adhesive resin.

The present disclosure provides a display panel, a method for manufacturing the display panel, and a display device. The display panel includes a substrate; a printed circuit board; a chip on film; an anisotropic conductive adhesive layer, connected between the chip on film and the substrate, and between the chip on film and the printed circuit board.

The present disclosure provides a display panel, a method for manufacturing the display panel, and a display device. The display panel includes a substrate; a printed circuit board; a chip on film; an anisotropic conductive adhesive layer, connected between the chip on film and the substrate, and between the chip on film and the printed circuit board.

One aspect of the invention is a method of manufacturing a connection structure, including disposing an adhesive layer between a first electronic member including a first substrate and a first electrode formed on the first substrate and a second electronic member including a second substrate and a second electrode formed on the second substrate, and pressure-bonding the first electronic member and the second electronic member via the adhesive layer such that the first electrode and the second electrode are electrically connected to each other, wherein the first electronic member further including an insulating layer formed on a side of the first electrode opposite to the first substrate, and the adhesive layer including: a first conductive particle being a dendritic conductive particle; and a second conductive particle being a conductive particle other than the first conductive particle and having a non-conductive core and a conductive layer provided on the core.