A package structure is provided. The package structure includes an interposer substrate comprising an insulating structure, a conductive pad, a first conductive via structure, and a second conductive via structure. The package structure includes an electronic device bonded to the conductive pad. The package structure includes a chip structure bonded to the first end portion of the first conductive via structure. The package structure includes a conductive pillar connected to the second end portion of the second conductive via structure. The second end portion extends into the conductive pillar. The package structure includes a solder bump connected to the conductive pillar. The solder bump extends into the conductive pillar.