H01L2924/203

Silver paste composition and semiconductor device using same

A silver paste composition comprising silver particles having a particle diameter of 0.1 m to 20 m, and a solvent, wherein the above-described solvent comprises a solvent having a boiling point of 300 C. or more.

Silver paste composition and semiconductor device using same

A silver paste composition comprising silver particles having a particle diameter of 0.1 m to 20 m, and a solvent, wherein the above-described solvent comprises a solvent having a boiling point of 300 C. or more.

Bonding method using bonding material

A method of bonding two different substances includes the steps of: applying a bonding material containing a flux component that includes an organic material having at least two carboxyl groups to a bonding surface of a bonding object, disposing an object to be bonded on the bonding material, performing preliminary firing at a preset temperature in a state in which the object to be bonded is disposed, and performing a main firing by heating at a temperature higher than the temperature of the preliminary firing.

Bonding method using bonding material

A method of bonding two different substances includes the steps of: applying a bonding material containing a flux component that includes an organic material having at least two carboxyl groups to a bonding surface of a bonding object, disposing an object to be bonded on the bonding material, performing preliminary firing at a preset temperature in a state in which the object to be bonded is disposed, and performing a main firing by heating at a temperature higher than the temperature of the preliminary firing.

Bonding material and bonding method using the same

A bonded product is obtained by applying a silver paste containing silver nanoparticles having an average primary particle diameter of 1 to 200 nm, and performing firing. A diameter of a crystallite of the bonded product on a (111) plane of Ag when heated at 250 C. for 10 minutes in an inert atmosphere is 65 nm or larger.

Bonding material and bonding method using the same

A bonded product is obtained by applying a silver paste containing silver nanoparticles having an average primary particle diameter of 1 to 200 nm, and performing firing. A diameter of a crystallite of the bonded product on a (111) plane of Ag when heated at 250 C. for 10 minutes in an inert atmosphere is 65 nm or larger.