A light-emitting device according to the present invention includes a resin substrate having a flat plate shape, a first wiring electrode made of metal, a second wiring electrode made of metal, a light-emitting element, and a resin body. The light-emitting element is mounted onto the electrode portions of the first wiring electrode and the second wiring electrode on the first principal surface side of the resin substrate. The resin body has a light reflection property, covers the first principal surface of the resin substrate, covers the respective wiring portions of the first wiring electrode and the second wiring electrode and forming a frame body surrounding the light-emitting element on the first principal surface, and covers a region exposed from the first wiring electrode and the second wiring electrode on the second principal surface of the resin substrate.

A semiconductor device includes a substrate including a first region and a second region that are arranged in a first direction that is parallel to an upper surface of the substrate; a separation layer provided on the first region of the substrate; a high electron mobility transistor (HEMT) device overlapping the separation layer in a second direction that is perpendicular to the upper surface of the substrate; a light-emitting device provided on the second region of the substrate; and a first insulating pattern covering a side surface of the HEMT device, wherein the first insulating pattern overlaps the separation layer in the second direction.

A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

A light emitting diode apparatus is provided. The light emitting diode apparatus includes a wavelength conversion layer, a light emitting diode layer, a light transmission layer, and a sheath layer. The wavelength conversion layer has a first refractive index. The light emitting diode layer includes a base layer arranged on the wavelength conversion layer, and a light emitting structure layer arranged on the base layer. The light transmission layer is arranged on the wavelength conversion layer, surrounds a sidewall of the light emitting diode layer and contacts the sidewall of the light emitting diode layer, and has a second refractive index. The sheath layer is arranged to cover the light emitting diode layer and the light transmission layer, and has a third refractive index less than the second refractive index.

A backlight module includes a substrate, a light blocking unit, and a plurality of light-emitting chips. The light blocking unit is disposed on the substrate, and includes a carbon black, a scattering particle and a resin. The scattering particle is one of titanium dioxide, silicon dioxide, barium sulfate, and combinations thereof. The light blocking unit cooperates with the substrate to form a plurality of spaced-apart wells. The light-emitting chips are disposed in the wells, respectively, to permit optical units to be disposed thereon. A display device including the backlight module, and a method for making the display device are also provided herein.

A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.

A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

A package structure, a display device, and manufacturing methods thereof are provided. A package structure includes a conductive element, a first dielectric layer, a redistribution layer, a second dielectric layer, a light-shielding layer, a conductive layer, and a light-emitting diode unit. The first dielectric layer is disposed on the conductive element. The redistribution layer is disposed on the first dielectric layer. The redistribution layer is electrically connected to the conductive element. The second dielectric layer is disposed on the first dielectric layer. The light-shielding layer is disposed on the second dielectric layer. The conductive layer is disposed on the redistribution layer and includes a first conductive portion with a light reflectivity of less than 30%. The light-emitting diode unit is disposed on the conductive layer.

The present invention relates to a nano-scale light emitting diode (LED) electrode assembly emitting polarized light, a method of manufacturing the same, and a polarized LED lamp having the same, and more particularly, to a nano-scale LED electrode assembly in which partially polarized light close to light that is linearly polarized having one direction is emitted as an emitted light when applying a driving voltage to the nano-scale LED electrode assembly and also nano-scale LED devices are connected to a nano-scale electrode without defects such as an electrical short circuit while maximizing a light extraction efficiency, a method of manufacturing the same, and a polarized LED lamp having the same.

A light-emitting device includes: a set of layers including (i) a light-transmissive member having a top surface, a bottom surface, and a lateral surface contiguous with the top surface and the bottom surface, (ii) a first phosphor layer disposed below the bottom surface, and (iii) a dielectric multilayer film between the light-transmissive member and the first phosphor layer; a cover layer disposed on a lateral surface of the set of layers; and a light-emitting element disposed below the first phosphor layer. The light-emitting element emits blue light. The first phosphor layer absorbs at least a portion of the blue light and emits yellow-red to red light. The cover layer is either: a second phosphor layer that absorbs at least a portion of the blue light emitted by the light-emitting element and emits yellow-red to red light, or a pigment layer that presents yellow-red to red light.