A networking system includes a transmitter, a waveguide and a receiver. The transmitter is configured to generate a millimeter-wave signal carrying data. The waveguide is transmissive at millimeter-wave frequencies and is configured to receive the millimeter-wave signal from the transmitter, and to guide the millimeter-wave signal from the transmitter to a downstream location by having a dielectric constant that varies over a transversal cross-section of the waveguide in accordance with a predefined profile. The receiver is configured to receive the millimeter-wave signal guided by the waveguide, and to extract the data carried by the received millimeter-wave signal.

An apparatus comprises a waveguide section including an outer layer of conductive material tubular in shape and having multiple ends; and a joining feature on at least one of the ends of the waveguide section configured for joining to a second separate waveguide section.

Generally, this disclosure provides apparatus and systems for coupling waveguides to a server package with a modular connector system, as well as methods for fabricating such a connector system. Such a system may be formed with connecting waveguides that turn a desired amount, which in turn may allow a server package to send a signal through a waveguide bundle in any given direction without bending waveguides.

A polarization tracker and use thereof are provided. The polarization tracker includes a waveguide housing, and a signal input end, a first directional coupler connected to the signal input end, a first reflective phase shifter and a second reflective phase shifter that are coupled to the first directional coupler, a second directional coupler, and a signal output end connected to the second directional coupler disposed in the waveguide housing.

A spacecraft includes a feed array that includes a plurality of unitary modules, each module including a respective plurality of radio frequency (RF) waveguides structurally coupled together with at least one connecting feature. For each unitary module, the at least one connecting feature and a wall structure defining the respective plurality of waveguides are co-fabricated using an additive manufacturing process. The plurality of unitary modules includes a first unitary module including a first plurality of waveguides and a second unitary module including a second plurality of waveguides. The first unitary module and the second unitary module are configured to be integrated together so as to electrically couple at least one of the first plurality of waveguides with at least one of the second plurality of waveguides.

According to one embodiment, a waveguide bend includes a metal block. The metal block includes a first waveguide, a second waveguide and a third waveguide. The first waveguide, the second waveguide and the third waveguide are integrally formed. The second waveguide includes a bend at which a propagation direction of a radio wave is changed. An opening size of the second waveguide is smaller than an opening size of the first waveguide. The third waveguide is provided between the first waveguide and the second waveguide. An opening size of the third waveguide is smaller than the opening size of the first waveguide and is larger than the opening size of the second waveguide.

A method is provided for manufacturing RF structures such as waveguides using additive manufacturing such as 3D printing. RF structures are also provided suitable for manufacturing with said method. The RF structures include waveguides and antenna assemblies manufactured using the additive process. The structures include flanges at the ends of the waveguide and the flanges are integrally manufactured with the said manufacturing process. The structures include a participating conductive surface that is formed on the entirety of an interior of the body, where the conductive surface extends continuously between the two ends and has been subjected to a surface modification process.

Various embodiments provide for waveguide assemblies which may be utilized in wireless communication systems. Various embodiments may allow for waveguide assemblies to be assembled using tools and methodologies that are simpler than the conventional alternatives. Some embodiments provide for a waveguide assembly that comprises a straight tubular portion configured to be shortened, using simple techniques and tools, in order to fit into a waveguide assembly. For instance, for some embodiments, the waveguide assembly may be configured such that the straight portion can be shortened, at a cross section of the portion, using a basic cutting tool, such a hacksaw. In some embodiments, the straight portion may be further configured such that regardless of whether the straight tubular portion is shortened, the waveguide assembly remains capable of coupling to flanges, which facilitate coupling the straight tubular portion to connectable assemblies, such as other waveguide assemblies, radio equipment, or antennas.

The waveguide device, in which first/second openings are formed at end parts of a waveguide path, comprises a waveguide path obtained by uniting first/second waveguides. The first waveguide is provided with a first recessed part which has an opening with a same shape as the first opening and has a bottom part formed in a first direction as seen from the opening. The second waveguide is provided with a second recessed part which has an opening with a same shape as the second opening and has a bottom part formed in a second direction as seen from the opening. The first/second waveguides are united in a manner such that, positions of the bottom parts of the first/second recessed parts are different from each other in a direction differing from the first/second directions, and the first/second recessed parts connect with each other at the respective bottom parts.

A multilayer substrate includes an element assembly including stacked insulating layers and including at least a first insulating layer with a first principal surface and a second principal surface and a second insulating layer with a third principal surface and a fourth principal surface, a first conductor layer, and a second conductor layer. The second principal surface and the third principal surface are in contact with each other, and no planar or linear conductors are located on the second principal surface and the third principal surface. The first conductor layer is located on the first principal surface, and the second conductor layer is located on the fourth principal surface.