The present invention relates to a cavity filter. The cavity filter includes: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein the terminal portion is divided into a first side terminal contacted with the electrode pad and a second side terminal connected to the RF signal connecting portion, absorbs the assembly tolerance existing in a terminal insertion port, in which the terminal portion is provided, through an elastic member provided between the first side terminal and the second side terminal, and prevents disconnection of an electric flow, thereby preventing degradation in performance of an antenna device.

An apparatus includes a filter. The filter includes a metal structure forming a cavity and includes a ceramic block, which is suspended in the cavity. The ceramic block has two removed portions, the removed portions removed from two opposing sides of the ceramic block. The ceramic block further has one or more slots that that span a region of ceramic between the two removed portions and connects chambers formed by the two regions with chambers formed by the one or more slots, wherein a combined structure of the ceramic block, cavity, and metal structure supports multiple fundamental TM modes and one fundamental TE mode. The filter comprises multiple coupling structures to couple radio frequency signals into and out of the filter. The apparatus may include multi-cavity filters including one and typically multiple ones of the filters.

Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components.

To provide a printed board that solves the problem of transmission characteristics deterioration, the disclosed printed board includes a substrate, a circular signal pad that is provided on the substrate, a doughnut-shaped ground pad, which sandwiches the substrate that surrounds, in a doughnut shape, the signal pad, and which surrounds the outer circumference of the substrate, and one or more recessed sections that are disposed on the substrate that surrounds, in the doughnut shape, the signal pad.

The present disclosure relates to a dielectric coupling sleeve configured to capacitively couple a first electrical conductor to a second electrical conductor. The dielectric coupling sleeve includes a first sleeve section and a second sleeve section. The first sleeve section has a first diameter. A receiving space is closed on one side and formed in the first sleeve section. The receiving section is configured to receive an insertion of the first electrical conductor. The second sleeve section has a second diameter. The second diameter is smaller than the first diameter. The second sleeve section is configured for insertion into the conductor cavity of the second electrical conductor.

An apparatus for hydrocarbon resource recovery from a subterranean formation includes a radio frequency (RF) source, an RF antenna to be positioned within the subterranean formation to deliver RF power to the hydrocarbon resource within the subterranean formation, and an RF transmission line extending between the RF source and the RF antenna. The RF transmission line may include RF transmission line sections coupled together in end-to-end relation. Each section may include an inner conductor, an outer conductor surrounding the inner conductor, and an outer load-carrying tubular member surrounding the outer conductor. A respective coupling assembly joins ends of adjacent sections together. Each coupling assembly may include an electrical coupler being fixedly connected to first ends of corresponding inner and outer conductors and being slidably connected to opposing second ends of adjacent inner and outer conductors, and a mechanical coupler connecting ends of adjacent load-bearing tubular members together.

Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.

A microwave connector is provided. The microwave connector includes an outer conductor, an inner conductor disposed within the outer conductor and dielectric materials interposed between the outer conductor and the inner conductor, the dielectric materials including a non-dissipative dielectric material and a dissipative dielectric material.

A coaxial connector mounted to a board, wherein a center conductor is provided with a contact portion in contact with the terminal of a counterpart connector. A first coupling portion couples to the contact portion and extends in the axial direction of an outer conductor. A bend portion couples to the first coupling portion and is bent in the radial direction of the outer conductor. A second coupling portion couples to the bend portion and extends in the radial direction of the outer conductor. A connecting portion couples to the second coupling portion and connects said center conductor to on-board circuitry. A first and second expanded portion produced by an expansion of a portion of the outer peripheral surface of said first and second coupling portions, is formed in the first and second coupling portions.

Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components are provided.