The antenna module includes a first substrate and a second substrate on each of which a radiating element is arranged, a third substrate, and a switch circuit. An RFIC for supplying a radio frequency signal to the first substrate and the second substrate is arranged on the third substrate. The switch circuit is configured to change over a connection between the RFIC and the radiating element on the first substrate and a connection between the RFIC and the radiating element on the second substrate.

A low profile array (LPA) includes an antenna element array layer having at least one Faraday wall, and a beamformer circuit layer coupled to the antenna element array layer. The beamformer circuit layer has at least one Faraday wall. The Faraday walls extends between ground planes associated with at least one of the antenna element array layer and the beamformer circuit layer.

Disclosed herein is a semiconductor device including: a semiconductor circuit element configured to process an electrical signal having a predetermined frequency; and a transmission line configured to be connected to the semiconductor circuit element via a wire and transmit the electrical signal. An impedance matching pattern having a symmetric shape with respect to a direction of the transmission line is provided in the transmission line.

A transmission line device includes a first multilayer substrate with a transmission line including laminated insulating base materials and a conductor pattern on the insulating base materials, and a second multilayer substrate defining a connected member to which the transmission line of the first multilayer substrate is connected. The conductor pattern includes a signal conductor pattern and a signal electrode pad electrically connected to the signal conductor pattern. The first multilayer substrate includes a resist film provided on a surface of a laminate of the insulating base materials, and the resist film includes an opening that is separated from an outer edge of the signal electrode pad in a surface direction of the laminate of the insulating base material and exposes the signal electrode pad.

A method of improving electrical interconnections between two electrical elements is made available by providing a meta-material overlay in conjunction with the electrical interconnection. The meta-material overlay is designed to make the electrical signal propagating via the electrical interconnection to act as though the permittivity and permeability of the dielectric medium within which the electrical interconnection is formed are different than the real component permittivity and permeability of the dielectric medium surrounding the electrical interconnection. In some instances the permittivity and permeability resulting from the meta-material cause the signal to propagate as if the permittivity and permeability have negative values. Accordingly the method provides for electrical interconnections possessing enhanced control and stability of impedance, reduced noise, and reduced loss. Alternative embodiments of the meta-material overlay provide, the enhancements for conventional discrete wire bonds whilst also facilitating single integrated designs compatible with tape implementation.

The present invention relates to a microwave signal transition component (1) having a first signal conductor side (2) and a second signal conductor side (3). The signal transition component (1) is arranged for transfer of microwave signals from the first signal conductor side (2) to the second signal conductor side (3). The transfer component (1) comprises at least one, at least partly circumferentially running, electrically conducting frame (4), a dielectric filling (5) positioned at least partly within said conducting frame (4), at least one filling aperture (6; 6a, 6b) miming through the dielectric filling, and, for each filling aperture (6; 6a, 6b), an electrically conducting connection (7; 7a, 7b) that at least partly is positioned within said filling aperture (6; 6a, 6b). The present invention also relates to a method for manufacturing a microwave signal transition component according to the above.

A printed circuit board includes a first signal line inside a first dielectric layer; a first ground conductor layer and a second ground conductor layer; a second signal line disposed on the first ground conductor layer; a signal via for connecting the first signal line and the second signal line; and ground vias formed surrounding the signal via. The ground vias include first ground vias formed at respective first points, second ground vias formed at respective second points. The first points are placed on the line of a first polygon, and the second points are placed on the line of a second polygon, and the distances between adjacent first points and those between adjacent second points are all equal to or shorter than a first distance, and at least one second point is placed within the first distance from each of the adjacent first points.

Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

A device for transmission of at least one high-frequency signal includes at least one first electrically-conductive track formed inside and/or on top of a flexible substrate.