A high frequency switch configured to switch paths of differential signals arranged in an integrated circuit. The high frequency switch includes a pair of pole terminals and a plurality of pairs of throw terminals. The pair of pole terminals constitutes one port. Each pair of throw terminals constitutes another port.

A high frequency switch configured to switch paths of differential signals arranged in an integrated circuit. The high frequency switch includes a pair of pole terminals and a plurality of pairs of throw terminals. The pair of pole terminals constitutes one port. Each pair of throw terminals constitutes another port.

A switch comprising a first switching circuit assembly having a first pair of identical diodes in first anti-series configuration. The first switching circuit assembly constructed and arranged to cancel capacitance change wherein capacitance increases in a first diode of the first pair of identical diodes and, simultaneously, capacitance decreases in a second diode of the first pair of identical diodes with a first selectively applied radio frequency (RF) voltage input. The switch comprises a second switching circuit assembly having a second pair of identical diodes in second anti-series configuration. The second switching circuit assembly constructed and arranged to cancel capacitance change wherein capacitance increases in a first diode of the second pair of identical diodes and, simultaneously, capacitance decreases in a second diode of the second pair of identical diodes with a second selectively applied RF voltage input. A system and method are also provided.

The present disclosure relates to an integrated circuit (IC) that includes a boundary region defined between a low voltage region and a high voltage region, and a method of formation. In some embodiments, the integrated circuit comprises an isolation structure disposed in the boundary region of the substrate. A first polysilicon component is disposed over the substrate alongside the isolation structure. A boundary dielectric layer is disposed on the isolation structure. A second polysilicon component is disposed on the sacrifice dielectric layer.

A novel RF switch circuit and method for switching RF signals is described. The RF switch circuit is fabricated in a silicon-on-insulator (SOI) technology. The RF switch includes pairs of switching and shunting transistor groupings used to alternatively couple RF input signals to a common RF node. The switching and shunting transistor grouping pairs are controlled by a switching control voltage (SW) and its inverse (SW_). The switching and shunting transistor groupings comprise one or more MOSFET transistors connected together in a “stacked” or serial configuration. The stacking of transistor grouping devices, and associated gate resistors, increase the breakdown voltage across the series connected switch transistors and operate to improve RF switch compression. A fully integrated RF switch is described including digital control logic and a negative voltage generator integrated together with the RF switch elements. In one embodiment, the fully integrated RF switch includes a built-in oscillator, a charge pump circuit, CMOS logic circuitry, level-shifting and voltage divider circuits, and an RF buffer circuit. Several embodiments of the charge pump, level shifting, voltage divider, and RF buffer circuits are described. The inventive RF switch provides improvements in insertion loss, switch isolation, and switch compression.

A novel RF switch circuit and method for switching RF signals is described. The RF switch circuit is fabricated in a silicon-on-insulator (SOI) technology. The RF switch includes pairs of switching and shunting transistor groupings used to alternatively couple RF input signals to a common RF node. The switching and shunting transistor grouping pairs are controlled by a switching control voltage (SW) and its inverse (SW_). The switching and shunting transistor groupings comprise one or more MOSFET transistors connected together in a “stacked” or serial configuration. The stacking of transistor grouping devices, and associated gate resistors, increase the breakdown voltage across the series connected switch transistors and operate to improve RF switch compression. A fully integrated RF switch is described including digital control logic and a negative voltage generator integrated together with the RF switch elements. In one embodiment, the fully integrated RF switch includes a built-in oscillator, a charge pump circuit, CMOS logic circuitry, level-shifting and voltage divider circuits, and an RF buffer circuit. Several embodiments of the charge pump, level shifting, voltage divider, and RF buffer circuits are described. The inventive RF switch provides improvements in insertion loss, switch isolation, and switch compression.

A device for controlling transmission of electromagnetic waves according to the present disclosure includes: a conductor line which is positioned on a signal layer and through which electromagnetic waves received via an input terminal travel; a ground layer electrically separated from the signal layer through a dielectric layer and electrically grounded; a shunt via including a first end and a second end and connected to the conductor line through the first end; and a photoconductive semiconductor connected between the second end of the shunt via and the ground layer and having a dielectric state or a conducting state, based on an input of an optical signal, wherein the conductor line is electrically connected to the ground layer via the shunt via and the photoconductive semiconductor in the conducting state, thereby causing reflection of electromagnetic waves from the shunt via.

A transmit/receive switching assembly includes a symmetrical PIN diode-based switch to selectively connect an antenna port to one of a transmit port and a receive port, transmit bias control circuitry that receives a first bias control signal, receive bias control circuitry that receives a second bias control signal, and shunt bias control circuitry coupled between the symmetrical PIN diode-based switch and a reference node. The first and second bias control signals are simultaneously and oppositely switchable between first and second voltage values and together configured to operate the switch between a transmit mode where RF signal flow is enabled from the transmit port to the antenna port and isolation is provided between the antenna port and the receive port, and a receive mode where RF signal flow is enabled from the antenna port to the receive port and isolation is provided between the antenna port and the transmit port.

A transmit/receive switching assembly includes a symmetrical PIN diode-based switch to selectively connect an antenna port to one of a transmit port and a receive port, transmit bias control circuitry that receives a first bias control signal, receive bias control circuitry that receives a second bias control signal, and shunt bias control circuitry coupled between the symmetrical PIN diode-based switch and a reference node. The first and second bias control signals are simultaneously and oppositely switchable between first and second voltage values and together configured to operate the switch between a transmit mode where RF signal flow is enabled from the transmit port to the antenna port and isolation is provided between the antenna port and the receive port, and a receive mode where RF signal flow is enabled from the antenna port to the receive port and isolation is provided between the antenna port and the transmit port.

A high-frequency device and/or a high-frequency switch including the same may include: a signal electrode; a first ground electrode arranged in parallel with the signal electrode; a first liquid crystal layer disposed between the signal electrode and the first ground electrode; and a first dielectric layer disposed between the first liquid crystal layer and the first ground electrode, and/or between the signal electrode and the first liquid crystal layer. The first dielectric layer may have a dielectric constant that is larger than the dielectric constant of the first liquid crystal layer. The high-frequency device and/or the high-frequency device including the same may be variously implemented.